Applying energy

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CPC
H01L2021/60097

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60097Applying energy

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,051,668
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief for flip-chip packaged devices
- Patent number 11,930,590
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,699,674
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages for sensor chips
- Patent number 11,670,521
- Issue date Jun 6, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with flip chip solder joint capsules
- Patent number 11,600,498
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film, power conversion device with...
- Patent number 11,557,531
- Issue date Jan 17, 2023
- Mitsubishi Electric Corporation
- Shohei Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,476,128
- Issue date Oct 18, 2022
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flipchip package with an IC having a covered cavity comprising meta...
- Patent number 11,362,020
- Issue date Jun 14, 2022
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for constructing micro-LED display module
- Patent number 11,177,157
- Issue date Nov 16, 2021
- LUMENS CO., LTD.
- Kihyun An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,101,236
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating of a substrate for epoxy deposition
- Patent number 10,861,714
- Issue date Dec 8, 2020
- ASM Technology Singapore Pte. Ltd.
- Pak Lun Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming joint structures for surface mount packages
- Patent number 10,573,622
- Issue date Feb 25, 2020
- Intel Corporation
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,812,428
- Issue date Nov 7, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,508,685
- Issue date Nov 29, 2016
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS
- Publication number 20240347386
- Publication date Oct 17, 2024
- Honeywell International Inc.
- James L. Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20240224415
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230299033
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES
- Publication number 20230187223
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20220210911
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING ELECTRONIC...
- Publication number 20220192032
- Publication date Jun 16, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro KITAZUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPCHIP PACKAGE WITH AN IC HAVING A COVERED CAVITY COMPRISING META...
- Publication number 20220157698
- Publication date May 19, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220068665
- Publication date Mar 3, 2022
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20210384154
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20210313253
- Publication date Oct 7, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Shohei OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES
- Publication number 20210202269
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210193483
- Publication date Jun 24, 2021
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING A SEMICONDUCTOR POWER MODULE COMPONENT AND A S...
- Publication number 20210013175
- Publication date Jan 14, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATING OF A SUBSTRATE FOR EPOXY DEPOSITION
- Publication number 20200227281
- Publication date Jul 16, 2020
- ASM Technology Singapore Pte Ltd
- Pak Lun CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20200075527
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Applying energy

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of forming the same

Stress relief for flip-chip packaged devices

Semiconductor package and method of forming the same

Reliable semiconductor packages for sensor chips

Semiconductor package with flip chip solder joint capsules

Semiconductor device with metal film, power conversion device with...

Semiconductor device package and method of manufacturing the same

Flipchip package with an IC having a covered cavity comprising meta...

Method for constructing micro-LED display module

Semiconductor package and method of forming the same

Heating of a substrate for epoxy deposition

Methods of forming joint structures for surface mount packages

Vertically integrated wafers with thermal dissipation

Vertically integrated wafers with thermal dissipation

Patents Applicationslast 30 patents

BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING ELECTRONIC...

FLIPCHIP PACKAGE WITH AN IC HAVING A COVERED CAVITY COMPRISING META...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Package and Method of Forming the Same

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES

RELIABLE SEMICONDUCTOR PACKAGES

METHOD OF ASSEMBLING A SEMICONDUCTOR POWER MODULE COMPONENT AND A S...

HEATING OF A SUBSTRATE FOR EPOXY DEPOSITION

Semiconductor Package and Method of Forming the Same