Applying molten solder

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CPC
H05K3/3468

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3468Applying molten solder

Industries

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Patents Grantslast 30 patents

Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,041,723
- Issue date Jul 16, 2024
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering structure with groove portion and power module comprising...
- Patent number 11,862,537
- Issue date Jan 2, 2024
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wave solder pallets for optimal solder flow and methods of manufact...
- Patent number 11,850,684
- Issue date Dec 26, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing an interface on a printed circuit...
- Patent number 11,731,207
- Issue date Aug 22, 2023
- Eagle Technology, LLC
- Michael T. De Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-resolution soldering
- Patent number 11,627,667
- Issue date Apr 11, 2023
- Orbotech Ltd.
- Zvi Kotler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing an interface on a printed circuit...
- Patent number 11,602,800
- Issue date Mar 14, 2023
- Eagle Technology, LLC
- Michael T. De Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 11,589,487
- Issue date Feb 21, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for discharging fluid
- Patent number 11,259,415
- Issue date Feb 22, 2022
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux residue detection
- Patent number 10,939,600
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Jiayu Zheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid discharge device
- Patent number 10,932,372
- Issue date Feb 23, 2021
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising an electronic component mounted on a s...
- Patent number 10,897,822
- Issue date Jan 19, 2021
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering apparatus and method for manufacturing electronic unit
- Patent number 10,814,418
- Issue date Oct 27, 2020
- Denso Corporation
- Shinichiro Shiraishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wave solder nozzle with automated adjustable sliding plate to vary...
- Patent number 10,780,516
- Issue date Sep 22, 2020
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 10,757,814
- Issue date Aug 25, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Nobuhiko Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing displacement of selected components during printed circuit...
- Patent number 10,750,647
- Issue date Aug 18, 2020
- Dell Products, L.P.
- Salvador D. Jimenez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wave solder pallet
- Patent number 10,737,344
- Issue date Aug 11, 2020
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for correcting solder bump
- Patent number 10,681,822
- Issue date Jun 9, 2020
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting system
- Patent number 10,499,551
- Issue date Dec 3, 2019
- FUJI CORPORATION
- Katsushi Ota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Work machine
- Patent number 10,470,350
- Issue date Nov 5, 2019
- FUJI CORPORATION
- Satoru Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, power supply apparatus, image forming appara...
- Patent number 10,412,839
- Issue date Sep 10, 2019
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive particle, and connection material, connection structure,...
- Patent number 10,412,838
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining part and board unit
- Patent number 10,292,267
- Issue date May 14, 2019
- Fujitsu Limited
- Akihiro Wakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting device
- Patent number 10,251,282
- Issue date Apr 2, 2019
- FUJI CORPORATION
- Katsunori Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and soldering device for selective soldering with at least o...
- Patent number 10,201,866
- Issue date Feb 12, 2019
- SEHO Systemtechnik GmbH
- Bernd Dreikorn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual solder layer for fluidic self assembly and electrical componen...
- Patent number 10,039,194
- Issue date Jul 31, 2018
- OSRAM SYLVANIA Inc.
- Jeffery Serre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,986,649
- Issue date May 29, 2018
- International Business Machine Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Viscous fluid coating device
- Patent number 9,969,023
- Issue date May 15, 2018
- Fuji Machine Mfg. Co., Ltd.
- Nobuyuki Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for coating thin molten solder film, thin solder film-covere...
- Patent number 9,956,634
- Issue date May 1, 2018
- Senju Metal Industry Co., Ltd.
- Isamu Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, power supply apparatus, image forming appara...
- Patent number 9,918,393
- Issue date Mar 13, 2018
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240276651
- Publication date Aug 15, 2024
- Honor Device Co., Ltd.
- Jianqiang GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ON-DEMAND METHOD OF MAKING PCB PALLETS USING ADDITIVE MANUFACTURING
- Publication number 20230164966
- Publication date May 25, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ON-DEMAND METHOD OF MAKING PCB PALLETS USING ADDITIVE MANUFACTURING
- Publication number 20230141137
- Publication date May 11, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT...
- Publication number 20230121381
- Publication date Apr 20, 2023
- Eagle Technology, LLC
- Michael T. De Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20220369473
- Publication date Nov 17, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-RESOLUTION SOLDERING
- Publication number 20220248540
- Publication date Aug 4, 2022
- ORBOTECH LTD.
- Zvi Kotler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING STRUCTURE AND POWER MODULE COMPRISING THE SAME
- Publication number 20220044988
- Publication date Feb 10, 2022
- Hyundai Motor Company
- Jun Hee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DISCHARGING FLUID
- Publication number 20210144863
- Publication date May 13, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Hideki NAKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT...
- Publication number 20210107080
- Publication date Apr 15, 2021
- Eagle Technology, LLC
- Michael T. De Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...
- Publication number 20200305283
- Publication date Sep 24, 2020
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACT...
- Publication number 20200180059
- Publication date Jun 11, 2020
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACT...
- Publication number 20200180060
- Publication date Jun 11, 2020
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX RESIDUE DETECTION
- Publication number 20200170155
- Publication date May 28, 2020
- International Business Machines Corporation
- Jiayu Zheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAVE SOLDER NOZZLE WITH AUTOMATED ADJUSTABLE SLIDING PLATE TO VARY...
- Publication number 20190381590
- Publication date Dec 19, 2019
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING...
- Publication number 20190335583
- Publication date Oct 31, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Koji SHIGETA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD, AND COVER ME...
- Publication number 20190174629
- Publication date Jun 6, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- NOBUHIKO NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ATTACHING PRINTED CIRCUIT BOARD TO PALLET
- Publication number 20190160570
- Publication date May 30, 2019
- Western Digital Technologies, Inc.
- Landdell Gregory
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP CORRECTION METHOD
- Publication number 20190132960
- Publication date May 2, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hideki NAKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID DISCHARGE DEVICE AND METHOD FOR DISCHARGING FLUID
- Publication number 20180376600
- Publication date Dec 27, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Hideki NAKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, POWER SUPPLY APPARATUS, IMAGE FORMING APPARA...
- Publication number 20180160544
- Publication date Jun 7, 2018
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION PROCESS FOR SOLDER ELECTRODE AND USE THEREOF
- Publication number 20180129134
- Publication date May 10, 2018
- JSR Corporation
- JUN MUKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH SOLDER THIEVES
- Publication number 20180042121
- Publication date Feb 8, 2018
- Molex, LLC
- Ze-Li XIONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20170367195
- Publication date Dec 21, 2017
- SEIKO EPSON CORPORATION
- Yoshikazu TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PARTICLE, AND CONNECTION MATERIAL, CONNECTION STRUCTURE,...
- Publication number 20170347463
- Publication date Nov 30, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- ARATA KISHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20170142845
- Publication date May 18, 2017
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY
- Publication number 20170127531
- Publication date May 4, 2017
- METALLIC RESOURCES, INC.
- Stanley R. Rothschild
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PRODUCTION PROCESS FOR SOLDER ELECTRODE, PRODUCTION PROCESS FOR LAM...
- Publication number 20170127533
- Publication date May 4, 2017
- JSR Corporation
- JUN MUKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VISCOUS FLUID COATING DEVICE
- Publication number 20170066072
- Publication date Mar 9, 2017
- FUJI MACHINE MFG CO., LTD.
- Nobuyuki ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER SUPPLY DEVICE
- Publication number 20160338209
- Publication date Nov 17, 2016
- FUJI MACHINE MFG CO., LTD.
- Akihiro SENGA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Applying molten solder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

On-demand method of making PCB pallets using additive manufacturing

Method for soldering an electronic component to a circuit board by...

Soldering structure with groove portion and power module comprising...

Wave solder pallets for optimal solder flow and methods of manufact...

Systems and methods for providing an interface on a printed circuit...

High-resolution soldering

Systems and methods for providing an interface on a printed circuit...

On-demand method of making PCB pallets using additive manufacturing

Method for discharging fluid

Flux residue detection

Fluid discharge device

Electronic device comprising an electronic component mounted on a s...

Soldering apparatus and method for manufacturing electronic unit

Wave solder nozzle with automated adjustable sliding plate to vary...

Method for manufacturing a circuit board

Reducing displacement of selected components during printed circuit...

Method of manufacturing a wave solder pallet

Method for correcting solder bump

Electronic component mounting system

Work machine

Printed circuit board, power supply apparatus, image forming appara...

Conductive particle, and connection material, connection structure,...

Joining part and board unit

Electronic component mounting device

Method and soldering device for selective soldering with at least o...

Dual solder layer for fluidic self assembly and electrical componen...

Increasing solder hole-fill in a printed circuit board assembly

Viscous fluid coating device

Device for coating thin molten solder film, thin solder film-covere...

Printed circuit board, power supply apparatus, image forming appara...

Patents Applicationslast 30 patents

Method for Soldering an Electronic Component to a Circuit Board by...

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

ON-DEMAND METHOD OF MAKING PCB PALLETS USING ADDITIVE MANUFACTURING

ON-DEMAND METHOD OF MAKING PCB PALLETS USING ADDITIVE MANUFACTURING

SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT...

Method for Soldering an Electronic Component to a Circuit Board by...

HIGH-RESOLUTION SOLDERING

SOLDERING STRUCTURE AND POWER MODULE COMPRISING THE SAME

METHOD FOR DISCHARGING FLUID

SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT...

ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...

WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACT...

WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACT...

FLUX RESIDUE DETECTION

WAVE SOLDER NOZZLE WITH AUTOMATED ADJUSTABLE SLIDING PLATE TO VARY...

THREE-DIMENSIONAL PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING...

METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD, AND COVER ME...

SYSTEMS AND METHODS FOR ATTACHING PRINTED CIRCUIT BOARD TO PALLET

SOLDER BUMP CORRECTION METHOD

FLUID DISCHARGE DEVICE AND METHOD FOR DISCHARGING FLUID

PRINTED CIRCUIT BOARD, POWER SUPPLY APPARATUS, IMAGE FORMING APPARA...

PRODUCTION PROCESS FOR SOLDER ELECTRODE AND USE THEREOF

CIRCUIT BOARD WITH SOLDER THIEVES

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CONDUCTIVE PARTICLE, AND CONNECTION MATERIAL, CONNECTION STRUCTURE,...

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

LEAD-FREE SOLDER ALLOY

PRODUCTION PROCESS FOR SOLDER ELECTRODE, PRODUCTION PROCESS FOR LAM...

VISCOUS FLUID COATING DEVICE

SOLDER SUPPLY DEVICE