Apparatus or processes for manufacturing printed circuits

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

H05K3/00Apparatus or processes for manufacturing printed circuits

H05K3/0002for manufacturing artworks for printed circuits H05K3/0005for designing circuits by computer H05K3/0008for aligning or positioning of tools relative to the circuit board H05K3/0011Working of insulating substrates or insulating layers H05K3/0014Shaping of the substrate H05K3/0017Etching of the substrate by chemical or physical means H05K3/002by liquid chemical etching H05K3/0023by exposure and development of a photosensitive insulating layer H05K3/0026by laser ablation H05K3/0029of inorganic insulating material H05K3/0032of organic insulating material H05K3/0035of blind holes H05K3/0038combined with laser drilling through a metal layer H05K3/0041by plasma etching H05K3/0044Mechanical working of the substrate H05K3/0047Drilling of holes H05K3/005Punching of holes H05K3/0052Depaneling H05K3/0055After-treatment H05K3/0058Laminating printed circuit boards onto other substrates H05K3/0061onto a metallic substrate H05K3/0064onto a polymeric substrate H05K3/0067onto an inorganic, non-metallic substrate H05K3/007Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46 H05K3/0076characterised by the composition of the mask H05K3/0079characterised by the method of application or removal of the mask H05K3/0082characterised by the exposure method of radiation-sensitive masks H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor H05K3/0088for treatment of holes H05K3/0091Apparatus for coating printed circuits using liquid non-metallic coating compositions H05K3/0094Filling or covering plated through-holes or blind plated vias H05K3/0097Processing two or more printed circuits simultaneously H05K3/02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding H05K3/022Processes for manufacturing precursors of printed circuits H05K3/025by transfer of thin metal foil formed on a temporary carrier H05K3/027the conductive material being removed by irradiation H05K3/04the conductive material being removed mechanically H05K3/041by using a die for cutting the conductive material H05K3/043by using a moving tool for milling or cutting the conductive material H05K3/045by making a conductive layer having a relief pattern, followed by abrading of the raised portions H05K3/046by selective transfer or selective detachment of a conductive layer H05K3/048using a lift-off resist pattern or a release layer pattern H05K3/06the conductive material being removed chemically or electrolytically H05K3/061Etching masks H05K3/062consisting of metals or alloys or metallic inorganic compounds H05K3/064Photoresists H05K3/065applied by electrographic, electrophotographic or magnetographic methods H05K3/067Etchants H05K3/068Apparatus for etching printed circuits H05K3/07being removed electrolytically H05K3/08the conductive material being removed by electric discharge H05K3/10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern H05K3/101by casting or moulding of conductive material H05K3/102by bonding of conductive powder H05K3/103by bonding or embedding conductive wires or strips H05K3/105by conversion of non-conductive material on or in the support into conductive material H05K3/106by photographic methods H05K3/107by filling grooves in the support with conductive material H05K3/108by semi-additive methods; masks therefor H05K3/12using thick film techniques H05K3/1208Pretreatment of the circuit board H05K3/1216by screen printing or stencil printing H05K3/1225Screens or stencils ; Holders therefor H05K3/1233Methods or means for supplying the conductive material and for forcing it through the screen or stencil H05K3/1241by ink-jet printing or drawing by dispensing H05K3/125by ink-jet printing H05K3/1258by using a substrate provided with a shape pattern H05K3/1266by electrographic or magnetographic printing H05K3/1275by other printing techniques H05K3/1283After-treatment of the printed patterns H05K3/1291Firing or sintering at relative high temperatures for patterns on inorganic boards H05K3/14using spraying techniques to apply the conductive material including vapour evaporation H05K3/143Masks therefor H05K3/146By vapour deposition H05K3/16by cathodic sputtering H05K3/18using precipitation techniques to apply the conductive material H05K3/181by electroless plating H05K3/182characterised by the patterning method H05K3/184using masks H05K3/185by making a catalytic pattern by photo-imaging H05K3/187means therefor H05K3/188by direct electroplating H05K3/20by affixing prefabricated conductor pattern H05K3/202using self-supporting metal foil pattern H05K3/205using a pattern electroplated or electroformed on a metallic carrier H05K3/207using a prefabricated paste pattern, ink pattern or powder pattern H05K3/22Secondary treatment of printed circuits H05K3/222Completing of printed circuits by adding non-printed jumper connections H05K3/225Correcting or repairing of printed circuits H05K3/227Drying of printed circuits H05K3/24Reinforcing the conductive pattern H05K3/241characterised by the electroplating method; means therefor H05K3/242characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated H05K3/243characterised by selective plating H05K3/244Finish plating of conductors, especially of copper conductors H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods H05K3/247Finish coating of conductors by using conductive pastes, inks or powders H05K3/248fired compositions for inorganic substrates H05K3/249comprising carbon particles as main constituent H05K3/26Cleaning or polishing of the conductive pattern H05K3/28Applying non-metallic protective coatings H05K3/281by means of a preformed insulating foil H05K3/282for inhibiting the corrosion of the circuit H05K3/284for encapsulating mounted components H05K3/285Permanent coating compositions H05K3/287Photosensitive compositions H05K3/288Removal of non-metallic coatings H05K3/30Assembling printed circuits with electric components H05K3/301by means of a mounting structure H05K3/303Surface mounted components H05K3/305Affixing by adhesive H05K3/306Lead-in-hole components H05K3/308Adaptations of leads H05K3/32electrically connecting electric components or wires to printed circuits H05K3/321by conductive adhesive H05K3/323by applying an anisotropic conductive adhesive layer over an array of pads H05K3/325by abutting or pinching H05K3/326the printed circuit having integral resilient or deformable parts H05K3/328by welding H05K3/34by soldering H05K3/3405Edge mounted components H05K3/341Surface mounted components H05K3/3415on both sides of the substrate or combined with lead-in-hole components H05K3/3421Leaded components H05K3/3426characterised by the leads H05K3/3431Leadless components H05K3/3436having an array of bottom contacts H05K3/3442having edge contacts H05K3/3447Lead-in-hole components H05K3/3452Solder masks H05K3/3457Solder materials or compositions ; Methods of application thereof H05K3/3463Solder compositions in relation to features of the printed circuit board or the mounting process H05K3/3468Applying molten solder H05K3/3473Plating of solder H05K3/3478Applying solder paste, particles or preforms; Transferring prefabricated solder patterns H05K3/3484Paste or slurry or powder H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces H05K3/3494Heating methods for reflowing of solder H05K3/36Assembling printed circuits with other printed circuits H05K3/361Assembling flexible printed circuits with other printed circuits H05K3/363by soldering H05K3/365by abutting H05K3/366substantially perpendicularly to each other H05K3/368parallel to each other H05K3/38Improvement of the adhesion between the insulating substrate and the metal H05K3/381by special treatment of the substrate H05K3/382by special treatment of the metal H05K3/383by microetching H05K3/384by plating H05K3/385by conversion of the surface of the metal H05K3/386by the use of an organic polymeric bonding layer H05K3/387for electroless plating H05K3/388by the use of a metallic or inorganic thin film adhesion layer H05K3/389by the use of a coupling agent H05K3/40Forming printed elements for providing electric connections to or between printed circuits H05K3/4007Surface contacts H05K3/4015using auxiliary conductive elements H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4038Through-connections or via connections H05K3/4046using auxiliary conductive elements H05K3/4053by thick-film techniques H05K3/4061for via connections in inorganic insulating substrates H05K3/4069for via connections in organic insulating substrates H05K3/4076by thin-film techniques H05K3/4084by deforming at least one of the conductive layers H05K3/4092Integral conductive tabs H05K3/42Plated through-holes or plated via connections H05K3/421Blind plated via connections H05K3/422characterised by electroless plating method; pretreatment therefor H05K3/423characterised by electroplating method H05K3/424by direct electroplating H05K3/425characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern H05K3/426initial plating of through-holes in substrates without metal H05K3/427initial plating of through-holes in metal-clad substrates H05K3/428initial plating of through-holes in substrates having a metal pattern H05K3/429Plated through-holes specially for multilayer circuits H05K3/44Manufacture insulated metal core circuits or other insulated electrically conductive core circuits H05K3/445having insulated holes or insulated via connections through the metal core H05K3/46Manufacturing multilayer circuits H05K3/4602characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated H05K3/4605made from inorganic insulating material H05K3/4608comprising an electrically conductive core H05K3/4611by laminating two or more circuit boards H05K3/4614the electrical connections between the circuit boards being made during lamination H05K3/4617characterized by laminating only or mainly similar single-sided circuit boards H05K3/462characterized by laminating only or mainly similar double-sided circuit boards H05K3/4623the circuit boards having internal via connections between two or more circuit layers before lamination H05K3/4626characterised by the insulating layers or materials H05K3/4629laminating inorganic sheets comprising printed circuits H05K3/4632laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets H05K3/4635laminating flexible circuit boards using additional insulating adhesive materials between the boards H05K3/4638Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits H05K3/4641having integrally laminated metal sheets or special power cores H05K3/4644by building the multilayer layer by layer H05K3/4647by applying an insulating layer around previously made via studs H05K3/465by applying an insulating layer having channels for the next circuit layer H05K3/4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4655by using a laminate characterized by the insulating layer H05K3/4658characterized by laminating a prefabricated metal foil pattern H05K3/4661Adding a circuit layer by direct wet plating H05K3/4664Adding a circuit layer by thick film methods H05K3/4667characterized by using an inorganic intermediate insulating layer H05K3/467Adding a circuit layer by thin film methods H05K3/4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer H05K3/4676Single layer compositions H05K3/4679Aligning added circuit layers or via connections relative to previous circuit layers H05K3/4682Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil H05K3/4685Manufacturing of cross-over conductors H05K3/4688Composite multilayer circuits H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers H05K3/4694Partitioned multilayer circuits having adjacent regions with different properties H05K3/4697having cavities