Applying non-metallic protective coatings

Industry

CPC
H05K3/28

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/28Applying non-metallic protective coatings

Industries

Patents Grantslast 30 patents

Information Patent Grant
Driver for motors
- Patent number 11,984,773
- Issue date May 14, 2024
- Mitsuba Corporation
- Tomoya Ikariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a block device with a shield and method of fabri...
- Patent number 11,985,804
- Issue date May 14, 2024
- QUALCOMM Incorporated
- Anirudh Bhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical arrangements for sensor assemblies in electromagnetic na...
- Patent number 11,980,724
- Issue date May 14, 2024
- Boston Scientific Scimed, Inc.
- Steven J. Meyer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Transmission line and electronic device
- Patent number 11,984,637
- Issue date May 14, 2024
- Murata Manufacturing Co., Ltd.
- Yushi Soeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric circuit module and manufacturing method thereof
- Patent number 11,979,988
- Issue date May 7, 2024
- TDK Corporation
- Shuichi Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Power module and heat sink system
- Patent number 11,974,387
- Issue date Apr 30, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Nianbin Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing circuit boards
- Patent number 11,974,404
- Issue date Apr 30, 2024
- TOPPAN INC.
- Yuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 11,973,486
- Issue date Apr 30, 2024
- Kyocera Corporation
- Sinichiro Kitanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric-based items with electrical component arrays
- Patent number 11,967,561
- Issue date Apr 23, 2024
- Apple Inc.
- Daniel D. Sunshine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board, COF module, and electronic device c...
- Patent number 11,968,779
- Issue date Apr 23, 2024
- LG Innotek Co., Ltd
- Ki Tae Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corona prevention in high power circulators
- Patent number 11,961,635
- Issue date Apr 16, 2024
- Lockheed Martin Corporation
- Kevin L. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantable device for the brain
- Patent number 11,957,898
- Issue date Apr 16, 2024
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with anti-corrosion properties, method for manufactur...
- Patent number 11,943,875
- Issue date Mar 26, 2024
- Champ Tech Optical (Foshan) Corporation
- Li-Ping Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded hearing device components and related methods
- Patent number 11,943,589
- Issue date Mar 26, 2024
- GN HEARING A/S
- Thorvaldur Oli Bodvarsson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical chips mounted on a deformed carrier
- Patent number 11,942,572
- Issue date Mar 26, 2024
- OSRAM OLED GmbH
- Siegfried Herrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,942,260
- Issue date Mar 26, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing a substrate structure with high reflectance
- Patent number 11,937,370
- Issue date Mar 19, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illuminated multilayer structure with embedded light sources
- Patent number 11,934,004
- Issue date Mar 19, 2024
- TACTOTEK OY
- Antti Keränen
- G02 - OPTICS
Information Patent Grant
Fusing electronic components into three-dimensional objects via add...
- Patent number 11,911,825
- Issue date Feb 27, 2024
- Hewlett-Packard Development Company, L.P.
- Kristopher J. Erickson
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Circuit board
- Patent number 11,917,757
- Issue date Feb 27, 2024
- Murata Manufacturing Co., Ltd.
- Hiroki Maegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board having a battery mounted thereto
- Patent number 11,910,531
- Issue date Feb 20, 2024
- Ascensia Diabetes Care Holdings AG
- Igor Y. Gofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency module
- Patent number 11,903,120
- Issue date Feb 13, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density soft-matter electronics
- Patent number 11,903,139
- Issue date Feb 13, 2024
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Curable resin composition, dry film, resin-clad copper foil, cured...
- Patent number 11,891,474
- Issue date Feb 6, 2024
- TAIYO HOLDINGS CO., LTD.
- Kazuhisa Yamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart yarn and method for manufacturing a yarn containing an electr...
- Patent number 11,891,730
- Issue date Feb 6, 2024
- SIREN CARE, INC.
- Jie Fu
- A41 - WEARING APPAREL
Information Patent Grant
Display panel bend reinforcement
- Patent number 11,889,647
- Issue date Jan 30, 2024
- Apple Inc.
- Izhar Z. Ahmed
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lead frame, packaged integrated circuit board, power chip, and circ...
- Patent number 11,887,918
- Issue date Jan 30, 2024
- Huawei Technologies Co., Ltd.
- Xuanwei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,889,627
- Issue date Jan 30, 2024
- Innolux Corporation
- Chin-Cheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONTROL DEVICE WITH ACCESSIBLE SYMMETRICAL INPUT CONNECTOR
- Publication number 20240147580
- Publication date May 2, 2024
- Alain Desmeules
- A41 - WEARING APPAREL
Information Patent Application
CONDUCTIVE FILM AND TEST COMPONENT
- Publication number 20240130040
- Publication date Apr 18, 2024
- Innolux Corporation
- Ker-Yih Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...
- Publication number 20240130045
- Publication date Apr 18, 2024
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- G02 - OPTICS
Information Patent Application
RESIN COMPOSITION FOR SOLDER RESIST, SOLDER RESIST FILM, AND CIRCUI...
- Publication number 20240118609
- Publication date Apr 11, 2024
- SEKISUI KASEI CO., LTD.
- Koichiro OKAMOTO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for Depositing a Bronze Alloy on a Printed Circuit and Print...
- Publication number 20240117518
- Publication date Apr 11, 2024
- LINXENS HOLDING
- Jerome SANSON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240121899
- Publication date Apr 11, 2024
- InnoLux Corporation
- Chin-Cheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240114629
- Publication date Apr 4, 2024
- Kensuke MATSUHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATION OF ELECTRONIC COMPONENTS ON SUBSTRATE FOR HEARING DEVICE
- Publication number 20240114304
- Publication date Apr 4, 2024
- GN Hearing A/S
- Thorvaldur Oli BODVARSSON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...
- Publication number 20240105548
- Publication date Mar 28, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A PROTECTIVE FILM ON AN ELECTRONIC MODULE
- Publication number 20240098904
- Publication date Mar 21, 2024
- ELEADTK CO., LTD.
- Shao-Chi Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
APPARATUS AND POWER MODULE
- Publication number 20240096543
- Publication date Mar 21, 2024
- DELTA ELECTRONICS, INC.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240098912
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Jinhwan JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mouth Guard Having Low-Profile Printed Circuit Board For Sensing An...
- Publication number 20240081737
- Publication date Mar 14, 2024
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WATERPROOF ELECTRONIC PEN
- Publication number 20240085997
- Publication date Mar 14, 2024
- WACOM CO., LTD.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING TRANSIENT ELECTRONICS
- Publication number 20240080991
- Publication date Mar 7, 2024
- Accenture Global Solutions Limited
- Tingyu Cheng
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Application
ELECTRONIC CIRCUIT PACKAGES
- Publication number 20240080970
- Publication date Mar 7, 2024
- Apple Inc.
- Leilei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20240074066
- Publication date Feb 29, 2024
- Apple Inc.
- Nitesh KUMBHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240074062
- Publication date Feb 29, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Hsin-Fa HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME
- Publication number 20240074058
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- JAEKWANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240063104
- Publication date Feb 22, 2024
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240057249
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Plastic Front Plate And Method For Manufacturing The Same
- Publication number 20240050984
- Publication date Feb 15, 2024
- Enflex Corporation
- Hsin Yuan Chen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protective Coating
- Publication number 20240050982
- Publication date Feb 15, 2024
- HZO, Inc.
- Shailendra Vikram Singh
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240057247
- Publication date Feb 15, 2024
- MURATA MANUFACTURING CO., LTD.
- Takanori UEJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE AND ELECTRONIC DEVICE
- Publication number 20240049386
- Publication date Feb 8, 2024
- FUJIFILM CORPORATION
- Akio KATAYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240040699
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Hiromitsu ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20240040703
- Publication date Feb 1, 2024
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETECTION DEVICE
- Publication number 20240040707
- Publication date Feb 1, 2024
- Japan Display Inc.
- Koji ISHIZAKI
- G06 - COMPUTING CALCULATING COUNTING

Applying non-metallic protective coatings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Driver for motors

Package comprising a block device with a shield and method of fabri...

Electrical arrangements for sensor assemblies in electromagnetic na...

Transmission line and electronic device

Method of fabricating a substrate with metal reflection layer

Electric circuit module and manufacturing method thereof

Methods of forming interconnect circuits

Power module and heat sink system

Method of producing circuit boards

Electronic component and method for manufacturing the same

Fabric-based items with electrical component arrays

Flexible printed circuit board, COF module, and electronic device c...

Corona prevention in high power circulators

Implantable device for the brain

Circuit board with anti-corrosion properties, method for manufactur...

Shielded hearing device components and related methods

Optical chips mounted on a deformed carrier

Power module

Method for manufacturing a substrate structure with high reflectance

Illuminated multilayer structure with embedded light sources

Fusing electronic components into three-dimensional objects via add...

Circuit board

Flexible printed circuit board having a battery mounted thereto

Radio frequency module

High-density soft-matter electronics

Curable resin composition, dry film, resin-clad copper foil, cured...

Smart yarn and method for manufacturing a yarn containing an electr...

Display panel bend reinforcement

Lead frame, packaged integrated circuit board, power chip, and circ...

Display device

Patents Applicationslast 30 patents

CONTROL DEVICE WITH ACCESSIBLE SYMMETRICAL INPUT CONNECTOR

CONDUCTIVE FILM AND TEST COMPONENT

LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...

RESIN COMPOSITION FOR SOLDER RESIST, SOLDER RESIST FILM, AND CIRCUI...

Method for Depositing a Bronze Alloy on a Printed Circuit and Print...

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE

ENCAPSULATION OF ELECTRONIC COMPONENTS ON SUBSTRATE FOR HEARING DEVICE

PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...

INTERCONNECT CIRCUIT METHODS AND DEVICES

METHOD FOR FORMING A PROTECTIVE FILM ON AN ELECTRONIC MODULE

APPARATUS AND POWER MODULE

CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

Mouth Guard Having Low-Profile Printed Circuit Board For Sensing An...

WATERPROOF ELECTRONIC PEN

METHOD OF MANUFACTURING TRANSIENT ELECTRONICS

ELECTRONIC CIRCUIT PACKAGES

TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME

CIRCUIT BOARD

ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME

Polymer Plastic Front Plate And Method For Manufacturing The Same

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

Protective Coating

HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

LAMINATE AND ELECTRONIC DEVICE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

DETECTION DEVICE