Applying solder paste, particles or preforms; Transferring prefabricated solder patterns

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CPC
H05K3/3478

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3478Applying solder paste, particles or preforms; Transferring prefabricated solder patterns

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, power conversion apparatus, moving body, and...
- Patent number 12,267,955
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Takeshi Higashihata
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 12,267,964
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module, and method of manufacturing electronic...
- Patent number 12,177,990
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-plating of solder layer on solderable elements for diffusion so...
- Patent number 12,069,802
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlled wetting and spreading of metals on substrates using poro...
- Patent number 12,022,610
- Issue date Jun 25, 2024
- Board of Trustees of Michigan State University
- Jason Dale Nicholas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a high-temperature resistant lead free solder...
- Patent number 11,772,179
- Issue date Oct 3, 2023
- ENDRESS+HAUSER SE+CO.KG
- Elke Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for printing solder paste and other viscous materials at hi...
- Patent number 11,697,166
- Issue date Jul 11, 2023
- IO Tech Group Ltd.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for curing solder paste on a thermally fragile substrate
- Patent number 11,647,594
- Issue date May 9, 2023
- PulseForge, Inc.
- Rob Jacob Hendriks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-resolution soldering
- Patent number 11,627,667
- Issue date Apr 11, 2023
- Orbotech Ltd.
- Zvi Kotler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball feeding device
- Patent number 11,618,094
- Issue date Apr 4, 2023
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer screen printing stencil
- Patent number 11,576,266
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Jia Yu Zheng
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 11,528,809
- Issue date Dec 13, 2022
- Tahoe Research, LTD.
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming bump electrode substrate
- Patent number 11,478,869
- Issue date Oct 25, 2022
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for printing solder paste and other viscous materials at hi...
- Patent number 11,446,750
- Issue date Sep 20, 2022
- IO TECH GROUP LTD.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlled wetting and spreading of metals on substrates using poro...
- Patent number 11,284,510
- Issue date Mar 22, 2022
- Board of Trustees of Michigan State University
- Jason Dale Nicholas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for applying electronic components
- Patent number 10,999,936
- Issue date May 4, 2021
- Lumileds LLC
- Matthias Epmeier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 10,980,134
- Issue date Apr 13, 2021
- Intel Corporation
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,930,609
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for curing solder paste on a thermally fragile substrate
- Patent number 10,849,239
- Issue date Nov 24, 2020
- NCC Nano, LLC
- Rob Jacob Hendriks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising an audio channel assembly
- Patent number 10,827,618
- Issue date Nov 3, 2020
- Huawei Technologies Co., Ltd.
- Jouni Tapio Mäki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection system and inspection method
- Patent number 10,796,428
- Issue date Oct 6, 2020
- Koh Young Technology Inc.
- Seung Ae Seo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printing device, solder management system, and printing managing me...
- Patent number 10,773,326
- Issue date Sep 15, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuji Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a chip component
- Patent number 10,763,016
- Issue date Sep 1, 2020
- Rohm Co., Ltd.
- Hiroshi Tamagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,692,829
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal core solder ball and heat dissipation structure for semicondu...
- Patent number 10,661,394
- Issue date May 26, 2020
- Duksan Hi-Metal Co., Ltd.
- Yong Cheol Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BALL ATTACH TOOL
- Publication number 20250089179
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Hyeon Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVE...
- Publication number 20250015527
- Publication date Jan 9, 2025
- Intel Corporation
- Landon HANKS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR NORMALIZING SOLDER INTERCONNECTS IN A CIRCUIT...
- Publication number 20230389190
- Publication date Nov 30, 2023
- Skyworks Solutions, Inc.
- James David Walling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...
- Publication number 20230284382
- Publication date Sep 7, 2023
- KIOXIA Corporation
- Kodai Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20230217599
- Publication date Jul 6, 2023
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEET-SHAPED SOLDER
- Publication number 20230173620
- Publication date Jun 8, 2023
- Fuji Electric Co., Ltd.
- Katsunori SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, MOVING BODY, AND...
- Publication number 20230164915
- Publication date May 25, 2023
- Mitsubishi Electric Corporation
- Takeshi HIGASHIHATA
- B60 - VEHICLES IN GENERAL
Information Patent Application
PREFORM SOLDER AND BONDING METHOD USING SAME
- Publication number 20230112020
- Publication date Apr 13, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Haruya SAKUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20230112097
- Publication date Apr 13, 2023
- Tahoe Research, Ltd.
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH A CONTACT POINT
- Publication number 20230105384
- Publication date Apr 6, 2023
- Knorr-Bremse Systeme fuer Nutzfahrzeuge GmbH
- Markus Deeg
- B60 - VEHICLES IN GENERAL
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HI...
- Publication number 20220379396
- Publication date Dec 1, 2022
- IO TECH GROUP LTD.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VACUUM-ASSISTED BGA JOINT FORMATION
- Publication number 20220322540
- Publication date Oct 6, 2022
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A PRE-TINNING ARRANGEMENT AND PRE-TINNING ARRA...
- Publication number 20220256714
- Publication date Aug 11, 2022
- Few Fahrzeugelektrik Werk GMBH & CO. KG
- Hendrik Niemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-RESOLUTION SOLDERING
- Publication number 20220248540
- Publication date Aug 4, 2022
- ORBOTECH LTD.
- Zvi Kotler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING ELECTRONIC...
- Publication number 20220192032
- Publication date Jun 16, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro KITAZUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED WETTING AND SPREADING OF METALS ON SUBSTRATES USING PORO...
- Publication number 20220167501
- Publication date May 26, 2022
- Board of Trustees of Michigan State University
- Jason Dale Nicholas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SCREEN PRINTING STENCIL
- Publication number 20220071017
- Publication date Mar 3, 2022
- International Business Machines Corporation
- Jia Yu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20220046792
- Publication date Feb 10, 2022
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE
- Publication number 20210387276
- Publication date Dec 16, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro HATTORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A HIGH-TEMPERATURE RESISTANT LEAD FREE SOLDER...
- Publication number 20210268593
- Publication date Sep 2, 2021
- Endress+Hauser SE+Co. KG
- Elke Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20210185830
- Publication date Jun 17, 2021
- Intel Corporation
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE
- Publication number 20210037661
- Publication date Feb 4, 2021
- NCC NANO, LLC
- ROB JACOB HENDRIKS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL FEEDING DEVICE
- Publication number 20200269336
- Publication date Aug 27, 2020
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200152590
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device Comprising an Audio Channel Assembly
- Publication number 20200107446
- Publication date Apr 2, 2020
- Huawei Technologies Co., Ltd
- Jouni Tapio Mäki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR APPLYING ELECTRONIC COMPONENTS
- Publication number 20200084893
- Publication date Mar 12, 2020
- Lumileds Holding B.V.
- Matthias EPMEIER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200058612
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS

Applying solder paste, particles or preforms; Transferring prefabricated solder patterns

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, power conversion apparatus, moving body, and...

Electronic component module and method for manufacturing electronic...

Electronic component module, and method of manufacturing electronic...

Connection structure and manufacturing method therefor

Pre-plating of solder layer on solderable elements for diffusion so...

Controlled wetting and spreading of metals on substrates using poro...

Vacuum-assisted BGA joint formation

Method for producing a high-temperature resistant lead free solder...

Methods for printing solder paste and other viscous materials at hi...

Method for curing solder paste on a thermally fragile substrate

High-resolution soldering

Solder ball feeding device

Multilayer screen printing stencil

Method for orienting solder balls on a BGA device

Method for forming bump electrode substrate

Systems for printing solder paste and other viscous materials at hi...

Controlled wetting and spreading of metals on substrates using poro...

Method for producing an electric circuit comprising a circuit carri...

Method for applying electronic components

Method for orienting solder balls on a BGA device

Method of forming a solder bump structure

Method for curing solder paste on a thermally fragile substrate

Electronic device comprising an audio channel assembly

Tall and fine pitch interconnects

Inspection system and inspection method

Printing device, solder management system, and printing managing me...

Method of manufacturing a chip component

Method of forming a solder bump structure

Ball grid array and land grid array assemblies fabricated using tem...

Metal core solder ball and heat dissipation structure for semicondu...

Patents Applicationslast 30 patents

BALL ATTACH TOOL

SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVE...

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

SYSTEM AND METHOD FOR NORMALIZING SOLDER INTERCONNECTS IN A CIRCUIT...

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...

SHEET-SHAPED SOLDER

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, MOVING BODY, AND...

PREFORM SOLDER AND BONDING METHOD USING SAME

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

PRINTED CIRCUIT BOARD WITH A CONTACT POINT

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HI...

VACUUM-ASSISTED BGA JOINT FORMATION

METHOD FOR PRODUCING A PRE-TINNING ARRANGEMENT AND PRE-TINNING ARRA...

HIGH-RESOLUTION SOLDERING

ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING ELECTRONIC...

CONTROLLED WETTING AND SPREADING OF METALS ON SUBSTRATES USING PORO...

MULTILAYER SCREEN PRINTING STENCIL

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE

METHOD FOR PRODUCING A HIGH-TEMPERATURE RESISTANT LEAD FREE SOLDER...

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE

SOLDER BALL FEEDING DEVICE

METHOD OF FORMING A SOLDER BUMP STRUCTURE

Electronic Device Comprising an Audio Channel Assembly

METHOD FOR APPLYING ELECTRONIC COMPONENTS

METHOD OF FORMING A SOLDER BUMP STRUCTURE

METHOD FOR PRODUCING AN ELECTRIC CIRCUIT