Aqueous acid solution

Industry

CPC
H05K2203/0789

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0789Aqueous acid solution

Industries

Patents Grantslast 30 patents

Information Patent Grant
Single step electrolytic method of filling through holes in printed...
- Patent number 11,746,433
- Issue date Sep 5, 2023
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Triazole silane compound, method for synthesizing said compound and...
- Patent number 11,680,076
- Issue date Jun 20, 2023
- Shikoku Chemicals Corporation
- Takayuki Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 11,627,664
- Issue date Apr 11, 2023
- Cortigent, Inc.
- Robert Jay Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microetching agent for copper, copper surface roughening method and...
- Patent number 11,208,726
- Issue date Dec 28, 2021
- MEC Company Ltd.
- Yuki Ogino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing ceramic circuit board
- Patent number 11,129,282
- Issue date Sep 21, 2021
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microcircuit forming method and etching fluid composition
- Patent number 11,089,691
- Issue date Aug 10, 2021
- Inktec Co., Ltd.
- Su Han Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Microetchant for copper and method for producing wiring board
- Patent number 11,053,594
- Issue date Jul 6, 2021
- MEC Company Ltd.
- Keisuke Matsumoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Patterning of a composition comprising silver nanowires
- Patent number 10,983,615
- Issue date Apr 20, 2021
- Heraeus Deutschland GmbH & Co. KG
- Wilfried Lovenich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Manufacturing method for printed circuit board
- Patent number 10,893,613
- Issue date Jan 12, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong-Guk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching solution for copper and copper alloy surfaces
- Patent number 10,619,251
- Issue date Apr 14, 2020
- Atotech Deutschland GmbH
- Fabian Michalik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 10,362,681
- Issue date Jul 23, 2019
- Second Sight Medical Products, Inc.
- Robert Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etchant, replenishment solution and method for forming copper wiring
- Patent number 10,174,428
- Issue date Jan 8, 2019
- MEC Company Ltd.
- Hirofumi Kodera
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing ceramic circuit board
- Patent number 10,104,783
- Issue date Oct 16, 2018
- Hitachi Metals, Ltd.
- Nobuhiko Chiwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning of a composition comprising silver nanowires
- Patent number 10,073,549
- Issue date Sep 11, 2018
- Heraeus Deutschland GmbH & Co. KG
- Wilfried Lovenich
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Microetching solution for copper, replenishment solution therefor a...
- Patent number 9,932,678
- Issue date Apr 3, 2018
- MEC Company Ltd.
- Masayo Kurii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacture of fine line circuitry
- Patent number 9,713,266
- Issue date Jul 18, 2017
- Atotech Deutschland GmbH
- Richard Nichols
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 9,565,775
- Issue date Feb 7, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal stripping additive, composition containing the same, and meth...
- Patent number 9,518,327
- Issue date Dec 13, 2016
- UWIN NANOTECH, CO., LTD.
- Ching-Hsiang Hsu
- B08 - CLEANING
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 9,516,753
- Issue date Dec 6, 2016
- Shinko Electric Industries Co., Ltd.
- Koichi Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning solution, cleaning facility and method of cleaning mount s...
- Patent number 9,476,016
- Issue date Oct 25, 2016
- Mitsubishi Electric Corporation
- Yoshiyuki Kamo
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Microetching solution for copper, replenishment solution therefor a...
- Patent number 9,441,303
- Issue date Sep 13, 2016
- MEC Company Ltd.
- Masayo Kurii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Aqueous composition for etching of copper and copper alloys
- Patent number 9,441,304
- Issue date Sep 13, 2016
- Atotech Deutschland GmbH
- Norbert Lützow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pretreatment agent for electroless plating, and pretreatment and pr...
- Patent number 9,374,913
- Issue date Jun 21, 2016
- C. Uyemura & Co., Ltd.
- Yoshikazu Saijo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal surface treatment aqueous solution and method for inhibiting...
- Patent number 9,200,168
- Issue date Dec 1, 2015
- Rohm and Haas Electronic Materials LLC
- Yutaka Morii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process to form highly conductive feature from silver nanoparticles...
- Patent number 9,137,902
- Issue date Sep 15, 2015
- Xerox Corporation
- Yiliang Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 9,038,266
- Issue date May 26, 2015
- Ibiden Co., Ltd.
- Sho Akai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microetching solution for copper, replenishment solution therefor a...
- Patent number 9,011,712
- Issue date Apr 21, 2015
- MEC Company Ltd.
- Masayo Kurii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 8,633,400
- Issue date Jan 21, 2014
- Ibiden Co., Ltd.
- Sho Akai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal surface treatment aqueous solution and method for inhibiting...
- Patent number 8,591,638
- Issue date Nov 26, 2013
- Rohm and Haas Electronic Materials LLC
- Yutaka Morii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 8,322,027
- Issue date Dec 4, 2012
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240251504
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC CIRCUIT AND METAL ION SOLUTION
- Publication number 20230413449
- Publication date Dec 21, 2023
- National Tsing-Hua University
- Ming-Tsang Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING METHOD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230209721
- Publication date Jun 29, 2023
- Nitto Denko Corporation
- Shotaro NAGAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Single Step Electrolytic Method of Filling Through Holes in Printed...
- Publication number 20210130970
- Publication date May 6, 2021
- MacDermid Enthone Inc.
- Donald Desalvo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROETCHING AGENT FOR COPPER, COPPER SURFACE ROUGHENING METHOD AND...
- Publication number 20200263308
- Publication date Aug 20, 2020
- MEC COMPANY LTD.
- Yuki OGINO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
- Publication number 20200170118
- Publication date May 28, 2020
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROCIRCUIT FORMING METHOD AND ETCHING FLUID COMPOSITION
- Publication number 20200163219
- Publication date May 21, 2020
- Ink Tec Co., Ltd.
- Su Han KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD
- Publication number 20200141010
- Publication date May 7, 2020
- MEC COMPANY LTD.
- Keisuke MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRIAZOLE SILANE COMPOUND, METHOD FOR SYNTHESIZING SAID COMPOUND AND...
- Publication number 20200031852
- Publication date Jan 30, 2020
- SHIKOKU CHEMICALS CORPORATION
- Takayuki MURAI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
SILVER-BASED TRANSPARENT CONDUCTIVE LAYERS INTERFACED WITH COPPER T...
- Publication number 20190364665
- Publication date Nov 28, 2019
- C3NANO INC.
- Xiqiang Yang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD OF MANUFACTURI...
- Publication number 20190292408
- Publication date Sep 26, 2019
- JSR Corporation
- Eiichirou KUNITANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ETCHING SOLUTION FOR COPPER AND COPPER ALLOY SURFACES
- Publication number 20190003061
- Publication date Jan 3, 2019
- Atotech Deutschland GmbH
- Fabian MICHALIK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD
- Publication number 20190003062
- Publication date Jan 3, 2019
- MEC COMPANY LTD.
- Keisuke MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PATTERNING OF A COMPOSITION COMPRISING SILVER NANOWIRES
- Publication number 20180341346
- Publication date Nov 29, 2018
- Heraeus Deutschland GmbH & Co. KG
- Wilfried Lovenich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD
- Publication number 20160192503
- Publication date Jun 30, 2016
- Hitachi Metals, Ltd.
- Nobuhiko CHIWATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS
- Publication number 20150307999
- Publication date Oct 29, 2015
- Atotech Deutschland GmbH
- Norbert LÜTZOW
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROETCHING SOLUTION FOR COPPER, REPLENISHMENT SOLUTION THEREFOR A...
- Publication number 20140326696
- Publication date Nov 6, 2014
- Masayo Kurii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF TREATING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTUR...
- Publication number 20140311778
- Publication date Oct 23, 2014
- Mitsubishi Gas Chemical Company, Inc.
- Tomoko SUZUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION OF AN AQUEOUS ETCHANT CONTAINING A PRECURSOR OF OXIDANT...
- Publication number 20140308616
- Publication date Oct 16, 2014
- Polychem UV/EB International Corp.
- Yung-Shu YANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS
- Publication number 20140262805
- Publication date Sep 18, 2014
- Norbert Lützow
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL STRIPPING ADDITIVE, COMPOSITION CONTAINING THE SAME, AND METH...
- Publication number 20140243249
- Publication date Aug 28, 2014
- Uwin Nanotech. Co., Ltd.
- CHING-HSIANG HSU
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
TREATMENT OF SHAPED BODIES COMPRISING COPPER WITH A MIXTURE COMPRIS...
- Publication number 20140121145
- Publication date May 1, 2014
- BASF SE
- Thomas Paasche
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20140097013
- Publication date Apr 10, 2014
- Shinko Electric Industries Co., Ltd.
- Koichi Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Circuit Electrode Array and Method of Manufacturing the Same
- Publication number 20130319971
- Publication date Dec 5, 2013
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METAL SURFACE TREATMENT AQUEOUS SOLUTION AND METHOD FOR INHIBITING...
- Publication number 20130284066
- Publication date Oct 31, 2013
- Yutaka MORII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THIN METAL FILM ELECTRODE AND FABRICATING METHOD THEREOF
- Publication number 20120168201
- Publication date Jul 5, 2012
- Samsung Electro-Mechanics CO., LTD.
- Young Ah SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20120082779
- Publication date Apr 5, 2012
- IBIDEN CO., LTD.
- Sho AKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR IMPROVING THE CORROSION RESISTANCE OF AN ELECTRONIC COMP...
- Publication number 20110171367
- Publication date Jul 14, 2011
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLUTION FOR INHIBITING PALLADIUM ACTIVITY INCLUDING HALOGENIC ACID...
- Publication number 20110135811
- Publication date Jun 9, 2011
- Samsung Electro-Mechanics CO., LTD.
- Hyuk-Jin Kwon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS COPPER PLATING METHOD, PRINTED WIRING BOARD, METHOD FOR...
- Publication number 20110120760
- Publication date May 26, 2011
- Ryoichi Okada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Aqueous acid solution

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Single step electrolytic method of filling through holes in printed...

Triazole silane compound, method for synthesizing said compound and...

Flexible circuit electrode array and method of manufacturing the same

Microetching agent for copper, copper surface roughening method and...

Method for manufacturing ceramic circuit board

Microcircuit forming method and etching fluid composition

Microetchant for copper and method for producing wiring board

Patterning of a composition comprising silver nanowires

Manufacturing method for printed circuit board

Etching solution for copper and copper alloy surfaces

Flexible circuit electrode array and method of manufacturing the same

Etchant, replenishment solution and method for forming copper wiring

Method for producing ceramic circuit board

Patterning of a composition comprising silver nanowires

Microetching solution for copper, replenishment solution therefor a...

Method for manufacture of fine line circuitry

Wiring board, semiconductor device, and method of manufacturing wir...

Metal stripping additive, composition containing the same, and meth...

Wiring substrate and method for manufacturing wiring substrate

Cleaning solution, cleaning facility and method of cleaning mount s...

Microetching solution for copper, replenishment solution therefor a...

Aqueous composition for etching of copper and copper alloys

Pretreatment agent for electroless plating, and pretreatment and pr...

Metal surface treatment aqueous solution and method for inhibiting...

Process to form highly conductive feature from silver nanoparticles...

Multilayer printed wiring board and method for manufacturing multil...

Microetching solution for copper, replenishment solution therefor a...

Multilayer printed wiring board and method for manufacturing multil...

Metal surface treatment aqueous solution and method for inhibiting...

Flexible circuit electrode array and method of manufacturing the same

Patents Applicationslast 30 patents

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING ELECTRONIC CIRCUIT AND METAL ION SOLUTION

PLATING METHOD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

Single Step Electrolytic Method of Filling Through Holes in Printed...

MICROETCHING AGENT FOR COPPER, COPPER SURFACE ROUGHENING METHOD AND...

METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD

MICROCIRCUIT FORMING METHOD AND ETCHING FLUID COMPOSITION

MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD

TRIAZOLE SILANE COMPOUND, METHOD FOR SYNTHESIZING SAID COMPOUND AND...

SILVER-BASED TRANSPARENT CONDUCTIVE LAYERS INTERFACED WITH COPPER T...

CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD OF MANUFACTURI...

ETCHING SOLUTION FOR COPPER AND COPPER ALLOY SURFACES

MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD

PATTERNING OF A COMPOSITION COMPRISING SILVER NANOWIRES

METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD

AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS

MICROETCHING SOLUTION FOR COPPER, REPLENISHMENT SOLUTION THEREFOR A...

METHOD OF TREATING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTUR...

COMPOSITION OF AN AQUEOUS ETCHANT CONTAINING A PRECURSOR OF OXIDANT...

AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS

METAL STRIPPING ADDITIVE, COMPOSITION CONTAINING THE SAME, AND METH...

TREATMENT OF SHAPED BODIES COMPRISING COPPER WITH A MIXTURE COMPRIS...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

Flexible Circuit Electrode Array and Method of Manufacturing the Same

METAL SURFACE TREATMENT AQUEOUS SOLUTION AND METHOD FOR INHIBITING...

THIN METAL FILM ELECTRODE AND FABRICATING METHOD THEREOF

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

METHOD FOR IMPROVING THE CORROSION RESISTANCE OF AN ELECTRONIC COMP...

SOLUTION FOR INHIBITING PALLADIUM ACTIVITY INCLUDING HALOGENIC ACID...

ELECTROLESS COPPER PLATING METHOD, PRINTED WIRING BOARD, METHOD FOR...