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Wafer Bonding Apparatus and Method
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Publication number 20240387451
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Publication date Nov 21, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Cheng-I Chu
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H01 - BASIC ELECTRIC ELEMENTS
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Ion Beam Etching Apparatus And Method
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Publication number 20240379333
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Publication date Nov 14, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Jung-Hao Chang
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H01 - BASIC ELECTRIC ELEMENTS
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ION BEAM ETCH SYSTEM AND METHOD
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Publication number 20240355597
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Publication date Oct 24, 2024
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LAM RESEARCH CORPORATION
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Chih-Yang CHANG
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H01 - BASIC ELECTRIC ELEMENTS
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PLASMA PROCESSING IMPROVEMENT
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Publication number 20240266146
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Publication date Aug 8, 2024
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Applied Materials, Inc.
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Christopher S. OLSEN
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H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING APPARATUS
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Publication number 20240234093
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Publication date Jul 11, 2024
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Samsung Electronics Co., Ltd.
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Sejin OH
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H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR ETCHING ATOMIC LAYER
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Publication number 20240177972
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Publication date May 30, 2024
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Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
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Geun Young YEOM
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H01 - BASIC ELECTRIC ELEMENTS
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