Discharge tubes with provision for introducing objects or material to be exposed to the discharge

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS

H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

H01J37/02Details H01J37/023Means for mechanically adjusting components not otherwise provided for H01J37/026Means for avoiding or neutralising unwanted electrical charges on tube components H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge H01J37/045Beam blanking or chopping H01J37/05Electron or ion-optical arrangements for separating electrons or ions according to their energy or mass H01J37/06Electron sources Electron guns H01J37/061Electron guns using electron multiplication H01J37/063Geometrical arrangement of electrodes for beam-forming H01J37/065Construction of guns or parts thereof H01J37/067Replacing parts of guns Mutual adjustment of electrodes H01J37/07Eliminating deleterious effects due to thermal effects or electric or magnetic fields H01J37/073Electron guns using field emission, photo emission, or secondary emission electron sources H01J37/075Electron guns using thermionic emission from cathodes heated by particle bombardment or by irradiation H01J37/077Electron guns using discharge in gases or vapours as electron sources H01J37/08Ion sources Ion guns H01J37/09Diaphragms Shields associated with electron or ion-optical arrangements Compensation of disturbing fields H01J37/10Lenses H01J37/12electrostatic H01J37/14magnetic H01J37/141Electromagnetic lenses H01J37/1413Means for interchanging parts of the lens H01J37/1416with supra-conducting coils H01J37/143Permanent magnetic lenses H01J37/145Combinations of electrostatic and magnetic lenses H01J37/147Arrangements for directing or deflecting the discharge along a desired path H01J37/1471for centering, aligning or positioning of ray or beam H01J37/1472Deflecting along given lines H01J37/1474Scanning means H01J37/1475magnetic H01J37/1477electrostatic H01J37/1478Beam tilting means H01J37/15External mechanical adjustment of electron or ion optical components H01J37/153Electron-optical or ion-optical arrangements for the correction of image defects H01J37/16Vessels Containers H01J37/165Means associated with the vessel for preventing the generation of or for shielding unwanted radiation H01J37/18Vacuum locks; Means for obtaining or maintaining the desired pressure within the vessel H01J37/185Means for transferring objects between different enclosures of different pressure or atmosphere H01J37/20Means for supporting or positioning the objects or the material Means for adjusting diaphragms or lenses associated with the support H01J37/21Means for adjusting the focus H01J37/22Optical or photographic arrangements associated with the tube H01J37/222Image processing arrangements associated with the tube H01J37/224Luminescent screens or photographic plates for imaging ; Apparatus specially adapted therefor H01J37/226Optical arrangements for illuminating the object; optical arrangements for collecting light from the object H01J37/228whereby illumination and light collection take place in the same area of the discharge H01J37/24Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for H01J37/241High voltage power supply or regulation circuits H01J37/242Filament heating power supply or regulation circuits H01J37/243Beam current control or regulation circuits H01J37/244Detectors Associated components or circuits therefor H01J37/248Components associated with high voltage supply H01J37/252Tubes for spot-analysing by electron or ion beams Microanalysers H01J37/256using scanning beams H01J37/26Electron or ion microscopes Electron or ion diffraction tubes H01J37/261Details H01J37/263Contrast, resolution or power of penetration H01J37/265Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided H01J37/266Measurement of magnetic- or electric fields in the object; Lorentzmicroscopy H01J37/268with scanning beams H01J37/27Shadow microscopy H01J37/28with scanning beams H01J37/285Emission microscopes H01J37/29Reflection microscopes H01J37/292using scanning ray H01J37/295Electron or ion diffraction tubes H01J37/2955using scanning ray H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects H01J37/3002Details H01J37/3005Observing the objects or the point of impact on the object H01J37/3007Electron or ion-optical systems H01J37/301Arrangements enabling beams to pass between regions of different pressure H01J37/302Controlling tubes by external information H01J37/3023Programme control H01J37/3026Patterning strategy H01J37/304Controlling tubes by information coming from the objects or from the beam H01J37/3045Object or beam position registration H01J37/305for casting, melting, evaporating or etching H01J37/3053for evaporating or etching H01J37/3056for microworking H01J37/31for cutting or drilling H01J37/315for welding H01J37/317for changing properties of the objects or for applying thin layers thereon H01J37/3171for ion implantation H01J37/3172Maskless patterned ion implantation H01J37/3174Particle-beam lithography H01J37/3175Projection methods H01J37/3177Multi-beam H01J37/3178for applying thin layers on objects H01J37/32Gas-filled discharge tubes H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects H01J37/32018Glow discharge H01J37/32027DC powered H01J37/32036AC powered H01J37/32045Circuits specially adapted for controlling the glow discharge H01J37/32055Arc discharge H01J37/32064Circuits specially adapted for controlling the arc discharge H01J37/32073Corona discharge H01J37/32082Radio frequency generated discharge H01J37/32091the radio frequency energy being capacitively coupled to the plasma H01J37/321the radio frequency energy being inductively coupled to the plasma H01J37/3211Antennas H01J37/32119Windows H01J37/32128using particular waveforms H01J37/32137controlling of the discharge by modulation of energy H01J37/32146Amplitude modulation, includes pulsing H01J37/32155Frequency modulation H01J37/32165Plural frequencies H01J37/32174Circuits specially adapted for controlling the RF discharge H01J37/32183Matching circuits, impedance matching circuits per se H03H7/38 and H03H7/40 H01J37/32192Microwave generated discharge H01J37/32201Generating means H01J37/32211Means for coupling power to the plasma H01J37/3222Antennas H01J37/32229Waveguides H01J37/32238Windows H01J37/32247Resonators H01J37/32256Tuning means H01J37/32266Means for controlling power transmitted to the plasma H01J37/32275Microwave reflectors H01J37/32284Means for controlling or selecting resonance mode H01J37/32293using particular waveforms H01J37/32302Plural frequencies H01J37/32311Circuits specially adapted for controlling the microwave discharge H01J37/32321Discharge generated by other radiation H01J37/3233using charged particles H01J37/32339using electromagnetic radiation H01J37/32348Dielectric barrier discharge H01J37/32357Generation remote from the workpiece H01J37/32366Localised processing H01J37/32376Scanning across large workpieces H01J37/32385Treating the edge of the workpieces H01J37/32394Treating interior parts of workpieces H01J37/32403Treating multiple sides of workpieces H01J37/32412Plasma immersion ion implantation H01J37/32422Arrangement for selecting ions or species in the plasma H01J37/32431Constructional details of the reactor H01J37/3244Gas supply means H01J37/32449Gas control H01J37/32458Vessel H01J37/32467Material H01J37/32477characterised by the means for protecting vessels or internal parts H01J37/32486Means for reducing recombination coefficient H01J37/32495Means for protecting the vessel against plasma H01J37/32504Means for preventing sputtering of the vessel H01J37/32513Sealing means H01J37/32522Temperature H01J37/32532Electrodes H01J37/32541Shape H01J37/3255Material H01J37/32559Protection means H01J37/32568Relative arrangement or disposition of electrodes; moving means H01J37/32577Electrical connecting means H01J37/32587Triode systems H01J37/32596Hollow cathodes H01J37/32605Removable or replaceable electrodes or electrode systems H01J37/32614Consumable cathodes for arc discharge H01J37/32623Mechanical discharge control means H01J37/32633Baffles H01J37/32642Focus rings H01J37/32651Shields H01J37/3266Magnetic control means H01J37/32669Particular magnets or magnet arrangements for controlling the discharge H01J37/32678Electron cyclotron resonance H01J37/32688Multi-cusp fields H01J37/32697Electrostatic control H01J37/32706Polarising the substrate H01J37/32715Workpiece holder H01J37/32724Temperature H01J37/32733Means for moving the material to be treated H01J37/32743for introducing the material into processing chamber H01J37/32752for moving the material across the discharge H01J37/32761Continuous moving H01J37/3277of continuous material H01J37/32779of batches of workpieces H01J37/32788for extracting the material from the process chamber H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus H01J37/32807Construction (includes replacing parts of the apparatus) H01J37/32816Pressure H01J37/32825Working under atmospheric pressure or higher H01J37/32834Exhausting H01J37/32844Treating effluent gases H01J37/32853Hygiene H01J37/32862In situ cleaning of vessels and/or internal parts H01J37/32871Means for trapping or directing unwanted particles H01J37/3288Maintenance H01J37/32889Connection or combination with other apparatus H01J37/32899Multiple chambers H01J37/32908Utilities H01J37/32917Plasma diagnostics H01J37/32926Software, data control or modelling H01J37/32935Monitoring and controlling tubes by information coming from the object and/or discharge H01J37/32944Arc detection H01J37/32954Electron temperature measurement H01J37/32963End-point detection H01J37/32972Spectral analysis H01J37/32981Gas analysis H01J37/3299Feedback systems H01J37/34operating with cathodic sputtering H01J37/3402using supplementary magnetic fields H01J37/3405Magnetron sputtering H01J37/3408Planar magnetron sputtering H01J37/3411Constructional aspects of the reactor H01J37/3414Targets H01J37/3417Arrangements H01J37/342Hollow targets H01J37/3423Shape H01J37/3426Material H01J37/3429Plural materials H01J37/3432Target-material dispenser H01J37/3435Target holders (includes backing plates and endblocks) H01J37/3438Electrodes other than cathode H01J37/3441Dark space shields H01J37/3444Associated circuits H01J37/3447Collimators, shutters, apertures H01J37/345Magnet arrangements in particular for cathodic sputtering apparatus H01J37/3452Magnet distribution H01J37/3455Movable magnets H01J37/3458Electromagnets in particular for cathodic sputtering apparatus H01J37/3461Means for shaping the magnetic field H01J37/3464Operating strategies H01J37/3467Pulsed operation H01J37/347Thickness uniformity of coated layers or desired profile of target erosion H01J37/3473Composition uniformity or desired gradient H01J37/3476Testing and control H01J37/3479Detecting exhaustion of target material H01J37/3482Detecting or avoiding eroding through H01J37/3485Means for avoiding target poisoning H01J37/3488Constructional details of particle beam apparatus not otherwise provided for H01J37/3491Manufacturing of targets H01J37/3494Adaptation to extreme pressure conditions H01J37/3497Temperature of target H01J37/36for cleaning surfaces while plating with ions of materials introduced into the discharge