Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections; Transmitting or receiving optical signals between chips, wafers or boards; Optical backplane assemblies

Industry

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G02B6/43

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections; Transmitting or receiving optical signals between chips, wafers or boards; Optical backplane assemblies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Photonics optoelectrical system
- Patent number 12,366,705
- Issue date Jul 22, 2025
- THE RESEARCH FOUNDATION FOR THE STATE UNIVERISTY OF NEWYORK
- William Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical circuit board
- Patent number 12,360,322
- Issue date Jul 15, 2025
- Kyocera Corporation
- Yoshinori Nakatomi
- G02 - OPTICS
Information Patent Grant
Electro-photonic network for machine learning
- Patent number 12,353,006
- Issue date Jul 8, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Die last and waveguide last architecture for silicon photonic packa...
- Patent number 12,345,932
- Issue date Jul 1, 2025
- Intel Corporation
- Bai Nie
- G02 - OPTICS
Information Patent Grant
Crosspoint switch with μLED IO ports and imaging fiber cables
- Patent number 12,348,913
- Issue date Jul 1, 2025
- Ciena Corporation
- Daniel Rivaud
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adaptable lens assembly
- Patent number 12,339,502
- Issue date Jun 24, 2025
- Mellanox Technologies, Ltd.
- Hen Seri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clock signal distribution using photonic fabric
- Patent number 12,339,490
- Issue date Jun 24, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electro-photonic network for machine learning
- Patent number 12,339,492
- Issue date Jun 24, 2025
- Celestial AI Inc.
- Martinus Bos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical module
- Patent number 12,332,487
- Issue date Jun 17, 2025
- Hisense Broadband Multimedia Technologies Co., Ltd
- Honghao Zhang
- G02 - OPTICS
Information Patent Grant
Media adaptor for multimode waveguide interconnects
- Patent number 12,332,490
- Issue date Jun 17, 2025
- HIROSE ELECTRIC CO., LTD.
- Kihong Kim
- G02 - OPTICS
Information Patent Grant
Primary communication apparatus, coupling module and communication...
- Patent number 12,326,825
- Issue date Jun 10, 2025
- Phoenix Contact GmbH & Co. KG
- Martin Kogelheide
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical device including laterally guided vertical-cavity surface-e...
- Patent number 12,322,928
- Issue date Jun 3, 2025
- Eagle Technology, LLC
- Stephen J. Bauman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module and method
- Patent number 12,321,008
- Issue date Jun 3, 2025
- Technische Universität Dresden
- Niels Neumann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical coupling
- Patent number 12,321,021
- Issue date Jun 3, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Through mold via frame
- Patent number 12,308,307
- Issue date May 20, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having photon integrated circuit (PIC) chips
- Patent number 12,300,680
- Issue date May 13, 2025
- Micron Technology, Inc.
- Omar J. Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package
- Patent number 12,292,607
- Issue date May 6, 2025
- STMicroelectronics (Alps) SAS
- Deborah Cogoni
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,292,609
- Issue date May 6, 2025
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Long Zheng
- G02 - OPTICS
Information Patent Grant
Optical element-including opto-electric hybrid board
- Patent number 12,282,200
- Issue date Apr 22, 2025
- Nitto Denko Corporation
- Naoto Konegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fanout module integrating a photonic integrated circuit
- Patent number 12,276,850
- Issue date Apr 15, 2025
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- G02 - OPTICS
Information Patent Grant
Reverse clamping compression device for CPO or NPO
- Patent number 12,271,045
- Issue date Apr 8, 2025
- CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD.
- Chao Sun
- G02 - OPTICS
Information Patent Grant
Optical interconnects using microLEDs
- Patent number 12,271,046
- Issue date Apr 8, 2025
- AvicenaTech, Corp.
- Bardia Pezeshki
- G02 - OPTICS
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 12,274,036
- Issue date Apr 8, 2025
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,266,673
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clock signal distribution using photonic fabric
- Patent number 12,259,575
- Issue date Mar 25, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device
- Patent number 12,253,727
- Issue date Mar 18, 2025
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic detection device
- Patent number 12,253,456
- Issue date Mar 18, 2025
- AUO Corporation
- Shu-Jiang Liu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Fiber shuffle embedded optical connector
- Patent number 12,253,724
- Issue date Mar 18, 2025
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Photonic chip, field programmable photonic array and photonic integ...
- Patent number 12,248,180
- Issue date Mar 11, 2025
- Universitat Politecnica de Valencia
- Daniel Pérez López
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multicomponent photonically intra-die bridged assembly
- Patent number 12,242,122
- Issue date Mar 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250237830
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC COMPONENT
- Publication number 20250237829
- Publication date Jul 24, 2025
- ams-OSRAM International GmbH
- Martin HETZL
- G02 - OPTICS
Information Patent Application
OPTICAL INTERCONNECTS USING MICROLEDS
- Publication number 20250231359
- Publication date Jul 17, 2025
- AvicenaTech, Corp.
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LENS UNIT, OPTICAL TRANSMITTER UNIT, OPTICAL SYSTEM AND OPTICAL TRA...
- Publication number 20250226886
- Publication date Jul 10, 2025
- Microsoft Technology Licensing, LLC
- Paola COSTA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FILTERING UNIT, OPTICAL TRANSMITTER UNIT, OPTICAL RECEIVER UNIT AND...
- Publication number 20250224567
- Publication date Jul 10, 2025
- Microsoft Technology Licensing, LLC
- Paola COSTA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
- Publication number 20250227888
- Publication date Jul 10, 2025
- Marvell Asia Pte Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BRIDGE FOR PHOTONIC INTERPOSER TO PHOTONIC INTERPOSER COMMU...
- Publication number 20250216636
- Publication date Jul 3, 2025
- Intel Corporation
- Vinod ADIVARAHAN
- G02 - OPTICS
Information Patent Application
FIBER ARRAY UNIT ASSEMBLY AND CO-PACKAGED OPTICS USING THE SAME
- Publication number 20250216627
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Subal Sahni
- G02 - OPTICS
Information Patent Application
EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...
- Publication number 20250216632
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- G02 - OPTICS
Information Patent Application
INTERPOSER HAVING INTEGRATED OPTICAL WAVEGUIDE
- Publication number 20250216623
- Publication date Jul 3, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250204074
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND OPTICAL TRANSCEIVER
- Publication number 20250189735
- Publication date Jun 12, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Yuta ISHIGE
- G02 - OPTICS
Information Patent Application
OPTICAL CIRCUITS AND SIGNAL PROCESSING
- Publication number 20250189739
- Publication date Jun 12, 2025
- University of Southern California
- Hossein Hashemi
- G02 - OPTICS
Information Patent Application
IMAGING COUPLERS FOR MICROLED LINKS
- Publication number 20250189740
- Publication date Jun 12, 2025
- Robert Kalman
- G02 - OPTICS
Information Patent Application
OPTICAL ALIGNMENT SYSTEMS AND METHODS USING SILICON DIODES
- Publication number 20250180835
- Publication date Jun 5, 2025
- Alpine Optoelectronics Inc.
- Dawei Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-COATED OPTICAL FIBER PHOTOVOLTAIC CONVERSION MODULE BASED ON M...
- Publication number 20250180838
- Publication date Jun 5, 2025
- Shenzhen 8k-link Optoelectronics Technology Co., Ltd.
- Xinghui JIN
- G02 - OPTICS
Information Patent Application
PHOTONIC COMMUNICATION PLATFORM AND RELATED METHODS FOR INCREASING...
- Publication number 20250175260
- Publication date May 29, 2025
- Lightmatter, Inc
- Mykhailo Tymchenko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CO-PACKAGED OPTICS DEVICE AND OPTO-ELECTRONIC MODULE
- Publication number 20250172777
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Ting Kuo
- G02 - OPTICS
Information Patent Application
APPARATUS AND METHOD FOR SUPPORTING OPTICAL ALIGNER
- Publication number 20250164723
- Publication date May 22, 2025
- Avago Technologies International Sales Pte. Limited
- David Meadowcroft
- G02 - OPTICS
Information Patent Application
Optical Packages with LED Interconnects
- Publication number 20250140766
- Publication date May 1, 2025
- Google LLC
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC TRANSDUCER AND OPTICAL FIBER TRANSCEIVER MODULE USIN...
- Publication number 20250138265
- Publication date May 1, 2025
- TSO HAN CHIEN
- G02 - OPTICS
Information Patent Application
PHOTONICS PACKAGE INTEGRATION
- Publication number 20250130384
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Rabiul Islam
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP
- Publication number 20250125312
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS
- Publication number 20250123453
- Publication date Apr 17, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- G02 - OPTICS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20250123458
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20250123448
- Publication date Apr 17, 2025
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Sigeng YANG
- G02 - OPTICS
Information Patent Application
CHIP-SCALE OPTICAL INTERCONNECT USING MICROLEDS
- Publication number 20250126947
- Publication date Apr 17, 2025
- AvicenaTech, Corp.
- Bardia Pezeshki
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250125321
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COUPLING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, A...
- Publication number 20250116831
- Publication date Apr 10, 2025
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer based...
- Publication number 20250112192
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections; Transmitting or receiving optical signals between chips, wafers or boards; Optical backplane assemblies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photonics optoelectrical system

Optical circuit board

Electro-photonic network for machine learning

Die last and waveguide last architecture for silicon photonic packa...

Crosspoint switch with μLED IO ports and imaging fiber cables

Adaptable lens assembly

Clock signal distribution using photonic fabric

Electro-photonic network for machine learning

Optical module

Media adaptor for multimode waveguide interconnects

Primary communication apparatus, coupling module and communication...

Optical device including laterally guided vertical-cavity surface-e...

Multi-chip module and method

Optical coupling

Through mold via frame

Semiconductor packages having photon integrated circuit (PIC) chips

Optical package

Optical module

Optical element-including opto-electric hybrid board

Fanout module integrating a photonic integrated circuit

Reverse clamping compression device for CPO or NPO

Optical interconnects using microLEDs

Heatsink for co-packaged optical switch rack package

Semiconductor package and method of forming the same

Clock signal distribution using photonic fabric

Electronic device

Microfluidic detection device

Fiber shuffle embedded optical connector

Photonic chip, field programmable photonic array and photonic integ...

Multicomponent photonically intra-die bridged assembly

Patents Applicationslast 30 patents

OPTICAL DEVICES AND METHODS OF MANUFACTURE

OPTOELECTRONIC COMPONENT

OPTICAL INTERCONNECTS USING MICROLEDS

LENS UNIT, OPTICAL TRANSMITTER UNIT, OPTICAL SYSTEM AND OPTICAL TRA...

FILTERING UNIT, OPTICAL TRANSMITTER UNIT, OPTICAL RECEIVER UNIT AND...

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

OPTICAL BRIDGE FOR PHOTONIC INTERPOSER TO PHOTONIC INTERPOSER COMMU...

FIBER ARRAY UNIT ASSEMBLY AND CO-PACKAGED OPTICS USING THE SAME

EMBEDDING A PHOTONIC INTEGRATED CIRCUIT IN A SEMICONDUCTOR PACKAGE...

INTERPOSER HAVING INTEGRATED OPTICAL WAVEGUIDE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

OPTICAL DEVICE AND OPTICAL TRANSCEIVER

OPTICAL CIRCUITS AND SIGNAL PROCESSING

IMAGING COUPLERS FOR MICROLED LINKS

OPTICAL ALIGNMENT SYSTEMS AND METHODS USING SILICON DIODES

FILM-COATED OPTICAL FIBER PHOTOVOLTAIC CONVERSION MODULE BASED ON M...

PHOTONIC COMMUNICATION PLATFORM AND RELATED METHODS FOR INCREASING...

CO-PACKAGED OPTICS DEVICE AND OPTO-ELECTRONIC MODULE

APPARATUS AND METHOD FOR SUPPORTING OPTICAL ALIGNER

Optical Packages with LED Interconnects

OPTOELECTRONIC TRANSDUCER AND OPTICAL FIBER TRANSCEIVER MODULE USIN...

PHOTONICS PACKAGE INTEGRATION

SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP

MANUFACTURING OPTICALLY ACCESSIBLE CO-PACKAGED OPTICS

Photonic Semiconductor Device and Method of Manufacture

OPTICAL MODULE

CHIP-SCALE OPTICAL INTERCONNECT USING MICROLEDS

SEMICONDUCTOR PACKAGE

OPTICAL COUPLING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, A...

3D System and Wafer Reconstitution with Mid-layer Interposer based...