Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections; Transmitting or receiving optical signals between chips, wafers or boards; Optical backplane assemblies

Industry

CPC
G02B6/43

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections; Transmitting or receiving optical signals between chips, wafers or boards; Optical backplane assemblies

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical bridging element for separately stacked electrical ICs
- Patent number 12,216,318
- Issue date Feb 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,210,200
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Photonics processor architecture
- Patent number 12,206,220
- Issue date Jan 21, 2025
- Lightmatter, Inc.
- Nicholas C. Harris
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tapered waveguide semiconductor optical devices with increased face...
- Patent number 12,189,200
- Issue date Jan 7, 2025
- MACOM Technology Solutions Holdings, Inc.
- Wolfgang Parz
- G02 - OPTICS
Information Patent Grant
Optical coupling
- Patent number 12,189,195
- Issue date Jan 7, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,189,198
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- G02 - OPTICS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,191,257
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for optical interconnects
- Patent number 12,181,724
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics package integration
- Patent number 12,174,440
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Rabiul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Loopback waveguide
- Patent number 12,174,421
- Issue date Dec 24, 2024
- POET Technologies, Inc.
- Suresh Venkatesan
- G01 - MEASURING TESTING
Information Patent Grant
Integration of OE devices with ICS
- Patent number 12,174,441
- Issue date Dec 24, 2024
- AvicenaTech, Corp.
- Robert Kalman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short-waveband active optical component based on vertical emitting...
- Patent number 12,169,314
- Issue date Dec 17, 2024
- II-VI DELAWARE, INC.
- Guanglong Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Loopback waveguide
- Patent number 12,164,148
- Issue date Dec 10, 2024
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Optical fiber connection component and optical fiber connection str...
- Patent number 12,158,619
- Issue date Dec 3, 2024
- Sumitomo Electric Industries, Ltd.
- Tetsuya Nakanishi
- G02 - OPTICS
Information Patent Grant
Polarization locker for fiber connections and related methods
- Patent number 12,147,078
- Issue date Nov 19, 2024
- Lightmatter, Inc.
- Darius Bunandar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
PIC die and package with multiple level and multiple depth connecti...
- Patent number 12,130,470
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Grant
Manufacture of optical light guides
- Patent number 12,130,454
- Issue date Oct 29, 2024
- ams Sensors Singapore Pte. Ltd.
- Nicola Spring
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical device and optical system
- Patent number 12,124,096
- Issue date Oct 22, 2024
- TDK Corporation
- Tetsuya Shibata
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit chip
- Patent number 12,117,661
- Issue date Oct 15, 2024
- Molex, LLC
- Li-Chi Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical dielectric waveguide subassembly structures
- Patent number 12,099,236
- Issue date Sep 24, 2024
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
LED chip-to-chip vertically launched optical communications with op...
- Patent number 12,101,128
- Issue date Sep 24, 2024
- AvicenaTech, Corp.
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaging structure and packaging method of edge couplers and fiber...
- Patent number 12,085,767
- Issue date Sep 10, 2024
- SUTENG INNOVATION TECHNOLOGY CO., LTD.
- Lin Zhu
- G02 - OPTICS
Information Patent Grant
Board mounted active component assembly
- Patent number 12,078,847
- Issue date Sep 3, 2024
- CommScope Technologies LLC
- Joseph Christopher Coffey
- G02 - OPTICS
Information Patent Grant
Photonic structure and semiconductor structure and method for manuf...
- Patent number 12,078,856
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tao-Cheng Liu
- G02 - OPTICS
Information Patent Grant
Chip-scale optical interconnect using microLEDs
- Patent number 12,074,192
- Issue date Aug 27, 2024
- AvicenaTech, Corp.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with vertically stacked and laterally offset...
- Patent number 12,066,671
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Grant
Opto-electrical flexible glass interposer
- Patent number 12,066,663
- Issue date Aug 20, 2024
- Cisco Technology, Inc.
- Norbert Schlepple
- G02 - OPTICS
Information Patent Grant
Multiband QAM interface for slab waveguide
- Patent number 12,062,629
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with electro-optical interconnect circuitry
- Patent number 12,055,777
- Issue date Aug 6, 2024
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIBER-OPTIC BUNDLES FOR PARALLEL OPTICAL INTERCONNECTS
- Publication number 20250060544
- Publication date Feb 20, 2025
- Howard Rourke
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING PHOTONIC IC CHIP ADJACEN...
- Publication number 20250062300
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chan-Hong CHERN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated transceiver array
- Publication number 20250054930
- Publication date Feb 13, 2025
- Apple Inc.
- Shingo Mandai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR OPTICAL INTERPOSER MATING WITH PHOTONIC INTEGRATED...
- Publication number 20250044533
- Publication date Feb 6, 2025
- Intel Corporation
- Xavier F. Brun
- G02 - OPTICS
Information Patent Application
TUNABLE EDGE-COUPLED INTERFACE FOR SILICON PHOTONIC INTEGRATED CIRC...
- Publication number 20250044537
- Publication date Feb 6, 2025
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
Micro-LED/PD arrangements and selection in an optical interconnect...
- Publication number 20250048006
- Publication date Feb 6, 2025
- CIENA CORPORATION
- Daniel Rivaud
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC COMPONENT AND LIDAR SYSTEM
- Publication number 20250035755
- Publication date Jan 30, 2025
- ams-OSRAM International GmbH
- Hubert HALBRITTER
- G01 - MEASURING TESTING
Information Patent Application
POLARIZATION LOCKER FOR FIBER CONNECTIONS AND RELATED METHODS
- Publication number 20250035847
- Publication date Jan 30, 2025
- Lightmatter, Inc
- Darius Bunandar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20250031336
- Publication date Jan 23, 2025
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL FIBER-TO-CHIP INTERCONNECTION
- Publication number 20250020877
- Publication date Jan 16, 2025
- Nubis Communications, Inc.
- Lukas Elsinger
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20250012987
- Publication date Jan 9, 2025
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Xiaokuo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL INTEGRATED DEVICE, OPTICAL TRANSMISSION DEVICE, AND OPTICAL...
- Publication number 20250012989
- Publication date Jan 9, 2025
- FUJITSU OPTICAL COMPONENTS LIMITED
- Masaki SUGIYAMA
- G02 - OPTICS
Information Patent Application
OPTICAL DIELECTRIC WAVEGUIDE SUBASSEMBLY STRUCTURES
- Publication number 20250012972
- Publication date Jan 9, 2025
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...
- Publication number 20250015002
- Publication date Jan 9, 2025
- AOI ELECTRONICS CO., LTD.
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIBER OPTIC CABLE COUPLING ASSEMBLY
- Publication number 20240427096
- Publication date Dec 26, 2024
- Plethron, Inc.
- Eric Minami
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
- Publication number 20240427097
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
ANALOG OPTICAL INTERCONNECT FOR ANALOG SENSING AND PROCESSING
- Publication number 20240427098
- Publication date Dec 26, 2024
- University of Southern California
- Akhilesh JAISWAL
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
- Publication number 20240418951
- Publication date Dec 19, 2024
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240418934
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Younghyun KIM
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
OPTOELECTRONIC PACKAGE STRUCTURE
- Publication number 20240411096
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND OPTICAL MODULE MANUFACTURING METHOD
- Publication number 20240411092
- Publication date Dec 12, 2024
- NEC Corporation
- Taro KANEKO
- G02 - OPTICS
Information Patent Application
PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...
- Publication number 20240402421
- Publication date Dec 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- G02 - OPTICS
Information Patent Application
Multiband QAM Interface for Slab Waveguide
- Publication number 20240395738
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-D...
- Publication number 20240393552
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- G02 - OPTICS
Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240385370
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240385401
- Publication date Nov 21, 2024
- Singapore University of Technology and Design
- Dawn Tan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED SILICON LENS
- Publication number 20240385369
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES
- Publication number 20240369785
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Application
TELECOMMUNICATIONS PANEL ASSEMBLY WITH MOVABLE ADAPTERS
- Publication number 20240369790
- Publication date Nov 7, 2024
- CommScope Connectivity Belgium BVBA
- Johan GEENS
- G02 - OPTICS
Information Patent Application
TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES
- Publication number 20240371710
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections; Transmitting or receiving optical signals between chips, wafers or boards; Optical backplane assemblies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package and method of forming same

Optical bridging element for separately stacked electrical ICs

Photonic semiconductor device and method of manufacture

Photonics processor architecture

Tapered waveguide semiconductor optical devices with increased face...

Optical coupling

Manufacturing optically accessible co-packaged optics

Electrical bridge package with integrated off-bridge photonic chann...

Apparatus and methods for optical interconnects

Photonics package integration

Loopback waveguide

Integration of OE devices with ICS

Short-waveband active optical component based on vertical emitting...

Loopback waveguide

Optical fiber connection component and optical fiber connection str...

Polarization locker for fiber connections and related methods

PIC die and package with multiple level and multiple depth connecti...

Manufacture of optical light guides

Optical device and optical system

Photonic integrated circuit chip

Optical dielectric waveguide subassembly structures

LED chip-to-chip vertically launched optical communications with op...

Packaging structure and packaging method of edge couplers and fiber...

Board mounted active component assembly

Photonic structure and semiconductor structure and method for manuf...

Chip-scale optical interconnect using microLEDs

Semiconductor devices with vertically stacked and laterally offset...

Opto-electrical flexible glass interposer

Multiband QAM interface for slab waveguide

Integrated circuit package with electro-optical interconnect circuitry

Patents Applicationslast 30 patents

FIBER-OPTIC BUNDLES FOR PARALLEL OPTICAL INTERCONNECTS

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING PHOTONIC IC CHIP ADJACEN...

Integrated transceiver array

TECHNOLOGIES FOR OPTICAL INTERPOSER MATING WITH PHOTONIC INTEGRATED...

TUNABLE EDGE-COUPLED INTERFACE FOR SILICON PHOTONIC INTEGRATED CIRC...

Micro-LED/PD arrangements and selection in an optical interconnect...

OPTOELECTRONIC COMPONENT AND LIDAR SYSTEM

POLARIZATION LOCKER FOR FIBER CONNECTIONS AND RELATED METHODS

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

OPTICAL FIBER-TO-CHIP INTERCONNECTION

OPTICAL MODULE

OPTICAL INTEGRATED DEVICE, OPTICAL TRANSMISSION DEVICE, AND OPTICAL...

OPTICAL DIELECTRIC WAVEGUIDE SUBASSEMBLY STRUCTURES

SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...

FIBER OPTIC CABLE COUPLING ASSEMBLY

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

ANALOG OPTICAL INTERCONNECT FOR ANALOG SENSING AND PROCESSING

INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY

OPTICAL SENSOR AND ELECTRONIC DEVICE COMPRISING SAME

OPTOELECTRONIC PACKAGE STRUCTURE

OPTICAL MODULE AND OPTICAL MODULE MANUFACTURING METHOD

PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTI...

Multiband QAM Interface for Slab Waveguide

METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-D...

PACKAGE AND METHOD OF FORMING SAME

OPTICAL DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES WITH EMBEDDED SILICON LENS

SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES

TELECOMMUNICATIONS PANEL ASSEMBLY WITH MOVABLE ADAPTERS

TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES