Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards

Industry

CPC
H05K1/145

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/145Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interposer
- Patent number 11,973,013
- Issue date Apr 30, 2024
- AMOSENSE CO., LTD.
- Changwoo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,942,260
- Issue date Mar 26, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structural lead frame
- Patent number 11,923,151
- Issue date Mar 5, 2024
- KEMET Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power system
- Patent number 11,881,344
- Issue date Jan 23, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
FPC connection structure and method for connecting to printed circu...
- Patent number 11,864,328
- Issue date Jan 2, 2024
- LG Energy Solution, Ltd.
- Dong-Kwan Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and button combinations and methods of making same
- Patent number 11,829,565
- Issue date Nov 28, 2023
- Synaptics Incorporated
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable circuit board for abstracting third-party controls
- Patent number 11,818,842
- Issue date Nov 14, 2023
- Amazon Technologies, Inc.
- David E. Carrillo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and electronic device including the same
- Patent number 11,770,898
- Issue date Sep 26, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,758,656
- Issue date Sep 12, 2023
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, power converter, and method for producing an el...
- Patent number 11,756,857
- Issue date Sep 12, 2023
- Siemens Aktiengesellschaft
- Thomas Bigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interposer
- Patent number 11,744,017
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Sangwon Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible fluid micropump system and process
- Patent number 11,739,745
- Issue date Aug 29, 2023
- Drägerwerk AG & Co. KGaA
- Hans-Ullrich Hansmann
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Component assemblies and embedding for high density electronics
- Patent number 11,744,018
- Issue date Aug 29, 2023
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulative support for very high speed electrical interconnection
- Patent number 11,699,883
- Issue date Jul 11, 2023
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power modules having an integrated clamp circuit and process thereof
- Patent number 11,652,478
- Issue date May 16, 2023
- Wolfspeed, Inc.
- Austin Curbow
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board module and electronic device
- Patent number 11,653,448
- Issue date May 16, 2023
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Wen-Hu Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module structure
- Patent number 11,647,587
- Issue date May 9, 2023
- Delta Electronics, Inc.
- Da Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate layered structure and interposer block
- Patent number 11,647,586
- Issue date May 9, 2023
- LG Electronics Inc.
- Sanggeun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing an electronic or electrical system
- Patent number 11,618,227
- Issue date Apr 4, 2023
- Friedrich-Alexander-Universitat Erlangen-Nurnberg
- Gerald Gold
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Power module
- Patent number 11,503,710
- Issue date Nov 15, 2022
- Delta Electronics, Inc.
- Yahong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical vapor deposition diamond (CVDD) wires for thermal transport
- Patent number 11,488,888
- Issue date Nov 1, 2022
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Power module structure
- Patent number 11,490,516
- Issue date Nov 1, 2022
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer printed circuit boards for power modules
- Patent number 11,490,517
- Issue date Nov 1, 2022
- ABB POWER ELECTRONICS, INC.
- John Andrew Trelford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field probe
- Patent number 11,454,661
- Issue date Sep 27, 2022
- Amplifier Research Corp.
- Sean R. O'Connor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module with single or multiple components partially surr...
- Patent number 11,452,199
- Issue date Sep 20, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer printed circuit boards for power modules
- Patent number 11,439,013
- Issue date Sep 6, 2022
- ABB POWER ELECTRONICS, INC.
- John Andrew Trelford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including in interposer
- Patent number 11,439,012
- Issue date Sep 6, 2022
- Samsung Electronics Co., Ltd.
- Junghoon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for positioning a component arranged on a substrate
- Patent number 11,375,622
- Issue date Jun 28, 2022
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Philip Beran
- G01 - MEASURING TESTING
Information Patent Grant
Power module structure and assembling method thereof
- Patent number 11,330,717
- Issue date May 10, 2022
- Delta Electronics, Inc.
- Da Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diversified assembly printed circuit board and method for making th...
- Patent number 11,324,125
- Issue date May 3, 2022
- SHENNAN CIRCUITS CO., LTD.
- Ke Leng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147634
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOPLASTIC INTERPOSER
- Publication number 20240121882
- Publication date Apr 11, 2024
- Meta Platforms Technologies, LLC
- Brian Toleno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20240107687
- Publication date Mar 28, 2024
- LG Innotek Co., Ltd.
- Kun Yong SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES
- Publication number 20240107669
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Darryl Galipeau
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
- Publication number 20240106339
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- David Paul Buehler
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES
- Publication number 20240107674
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUS AND POWER MODULE
- Publication number 20240096543
- Publication date Mar 21, 2024
- DELTA ELECTRONICS, INC.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RF CONNECTOR AND COMMUNICATION APPARATUS INCLUDING SAME
- Publication number 20240098885
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
- Publication number 20240061537
- Publication date Feb 22, 2024
- SYNAPTICS INCORPORATED
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuit Board Assembly with Interposer Circuit Board and Correspond...
- Publication number 20240064899
- Publication date Feb 22, 2024
- Motorola Mobility LLC
- Wayne G Morrison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20240049393
- Publication date Feb 8, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240023239
- Publication date Jan 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROLLER UNIT
- Publication number 20230413486
- Publication date Dec 21, 2023
- Aptiv Technologies Limited
- Peter REINHOLD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20230403795
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Sangwon HA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE
- Publication number 20230397336
- Publication date Dec 7, 2023
- Hyundai Motor Company
- Nam Sik Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20230371178
- Publication date Nov 16, 2023
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED ARRANGEMENT TYPE ELECTRONIC COMPONENT MODULE AND ELECT...
- Publication number 20230371180
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Yohan MOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE ELECTRONIC STRUCTURES
- Publication number 20230363092
- Publication date Nov 9, 2023
- X-CELEPRINT LIMITED
- António José Marques Trindade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230354521
- Publication date Nov 2, 2023
- Innolux Corporation
- Chueh-Yuan Nien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIRROR-CORE MOUNTING MULTIPLE COMPUTER PROCESSOR MODULES FOR MINIMI...
- Publication number 20230309226
- Publication date Sep 28, 2023
- Intel Corporation
- Carl WILLIAMS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPRESSION ATTACHED MEMORY MODULE (CAMM) FOR LOW-POWER DOUBLE DATA...
- Publication number 20230309227
- Publication date Sep 28, 2023
- Dell Products L.P.
- Arnold Thomas Schnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR OVERHEAD CONSOLE WITH FLEXIBLE CIRCUIT BOARD
- Publication number 20230284386
- Publication date Sep 7, 2023
- MAGNA MIRRORS OF AMERICA, INC.
- Michael T. McNally
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230269868
- Publication date Aug 24, 2023
- Fuji Electric Co., Ltd.
- Tomomi NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268256
- Publication date Aug 24, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SYSTEM
- Publication number 20230230749
- Publication date Jul 20, 2023
- Delta Electronics, Inc.
- Yahong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...
- Publication number 20230223324
- Publication date Jul 13, 2023
- Regents of the University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING ANTENNA MODULE AND COAXIAL CABLE
- Publication number 20230209701
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Seungjae BAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYNCHRONOUS RECTIFIER MODULE
- Publication number 20230170820
- Publication date Jun 1, 2023
- Aplus Power Technology (Hangzhou) Co., Ltd.
- Yuetian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Synchronous Rectification Assembly, Manufacturing Method thereof an...
- Publication number 20230171892
- Publication date Jun 1, 2023
- Aplus Power Technology (Hangzhou) Co., Ltd.
- Yuetian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20230141357
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Gidae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer

Power module

Structural lead frame

Power system

FPC connection structure and method for connecting to printed circu...

Fingerprint sensor and button combinations and methods of making same

Configurable circuit board for abstracting third-party controls

Substrate structure and electronic device including the same

Backplane footprint for high speed, high density electrical connectors

Electronic circuit, power converter, and method for producing an el...

Electronic device including interposer

Compressible fluid micropump system and process

Component assemblies and embedding for high density electronics

Insulative support for very high speed electrical interconnection

Power modules having an integrated clamp circuit and process thereof

Circuit board module and electronic device

Power module structure

Substrate layered structure and interposer block

Method for manufacturing an electronic or electrical system

Power module

Chemical vapor deposition diamond (CVDD) wires for thermal transport

Power module structure

Interposer printed circuit boards for power modules

Field probe

Electronic module with single or multiple components partially surr...

Interposer printed circuit boards for power modules

Electronic device including in interposer

Method and device for positioning a component arranged on a substrate

Power module structure and assembling method thereof

Diversified assembly printed circuit board and method for making th...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

THERMOPLASTIC INTERPOSER

ELECTRONIC CONTROL DEVICE

INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES

SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

APPARATUS AND POWER MODULE

RF CONNECTOR AND COMMUNICATION APPARATUS INCLUDING SAME

FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME

Circuit Board Assembly with Interposer Circuit Board and Correspond...

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

ELECTRONIC DEVICE

ELECTRONIC CONTROLLER UNIT

ELECTRONIC DEVICE INCLUDING INTERPOSER

POWER MODULE

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

DOUBLE-SIDED ARRANGEMENT TYPE ELECTRONIC COMPONENT MODULE AND ELECT...

FLEXIBLE ELECTRONIC STRUCTURES

ELECTRONIC DEVICE

MIRROR-CORE MOUNTING MULTIPLE COMPUTER PROCESSOR MODULES FOR MINIMI...

COMPRESSION ATTACHED MEMORY MODULE (CAMM) FOR LOW-POWER DOUBLE DATA...

VEHICULAR OVERHEAD CONSOLE WITH FLEXIBLE CIRCUIT BOARD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

POWER SYSTEM

DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...

ELECTRONIC DEVICE COMPRISING ANTENNA MODULE AND COAXIAL CABLE

SYNCHRONOUS RECTIFIER MODULE

Synchronous Rectification Assembly, Manufacturing Method thereof an...

ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE...