Printed circuits

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

H05K1/00Printed circuits

H05K1/02Details H05K1/0201Thermal arrangements H05K1/0203Cooling of mounted components H05K1/0204using means for thermal conduction connection in the thickness direction of the substrate H05K1/0206by printed thermal vias H05K1/0207using internal conductor planes parallel to the surface for thermal conduction H05K1/0209External configuration of printed circuit board adapted for heat dissipation H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting H05K1/0212Printed circuits or mounted components having integral heating means H05K1/0213Electrical arrangements not otherwise provided for H05K1/0215Grounding of printed circuits by connection to external grounding means H05K1/0216Reduction of cross-talk, and noise or electromagnetic interference H05K1/0218by printed shielding conductors, ground planes or power plane H05K1/0219Printed shielding conductors for shielding around or between signal conductors H05K1/0221Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines H05K1/0222for shielding around a single via or around a group of vias H05K1/0224Patterned shielding planes, ground planes or power planes H05K1/0225Single or multiple openings in a shielding, ground or power plane H05K1/0227Split or nearly split shielding or ground planes H05K1/0228Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces H05K1/023using auxiliary mounted passive components or auxiliary substances H05K1/0231Capacitors or dielectric substances H05K1/0233Filters, inductors or a magnetic substance H05K1/0234Resistors or by disposing resistive or lossy substances in or near power planes H05K1/0236Electromagnetic band-gap structures H05K1/0237High frequency adaptations H05K1/0239Signal transmission by AC coupling H05K1/024Dielectric details H05K1/0242Structural details of individual signal conductors H05K1/0243Printed circuits associated with mounted high frequency components H05K1/0245Lay-out of balanced signal pairs H05K1/0246Termination of transmission lines H05K1/0248Skew reduction or using delay lines H05K1/025Impedance arrangements H05K1/0251related to vias or transitions between vias and transmission lines H05K1/0253Impedance adaptations of transmission lines by special lay-out of power planes H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages H05K1/0256Electrical insulation details H05K1/0257Overvoltage protection H05K1/0259Electrostatic discharge [ESD] protection H05K1/026Spark gaps H05K1/0262Arrangements for regulating voltages or for using plural voltages H05K1/0263High current adaptations H05K1/0265characterized by the lay-out of or details of the printed conductors H05K1/0266Marks, test patterns, inspection means or identification means H05K1/0268for electrical inspection or testing H05K1/0269for visual or optical inspection H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards H05K1/0272Adaptations for fluid transport H05K1/0274Optical details H05K1/0275Security details H05K1/0277Bendability or stretchability details H05K1/0278Rigid circuit boards or rigid supports of circuit boards locally made bendable H05K1/028Bending or folding regions of flexible printed circuits H05K1/0281Reinforcement details thereof H05K1/0283Stretchable printed circuits H05K1/0284Details of three-dimensional rigid printed circuit boards H05K1/0286Programmable, customizable or modifiable circuits H05K1/0287having an universal lay-out H05K1/0289having a matrix lay-out H05K1/029having a programmable lay-out H05K1/0292having a modifiable lay-out H05K1/0293Individual printed conductors which are adapted for modification H05K1/0295adapted for choosing between different types or different locations of mounted components H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/0298Multilayer circuits H05K1/03Use of materials for the substrate H05K1/0306Inorganic insulating substrates H05K1/0313Organic insulating material H05K1/032consisting of one material H05K1/0326containing O H05K1/0333containing S H05K1/034containing halogen H05K1/0346containing N H05K1/0353consisting of two or more materials H05K1/036Multilayers with layers of different types H05K1/0366reinforced H05K1/0373containing additives H05K1/038Textiles H05K1/0386Paper sheets H05K1/0393Flexible materials H05K1/05Insulated metal substrate or other insulated electrically conductive substrate H05K1/053the metal substrate being covered by an inorganic insulating layer H05K1/056the metal substrate being covered by an organic insulating layer H05K1/09Use of materials for the metallic pattern or other conductive pattern H05K1/092Dispersed materials H05K1/095for polymer thick films H05K1/097Inks comprising nanoparticles H05K1/11Printed elements for providing electric connections to or between printed circuits H05K1/111Pads for surface mounting H05K1/112directly combined with via connections H05K1/113Via provided in pad; Pad over filled via H05K1/114Pad being close to via, but not surrounding the via H05K1/115Via connections; Lands around holes or via connections H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via H05K1/117Pads along the edge of rigid circuit boards H05K1/118specially for flexible printed circuits H05K1/119Details of rigid insulating substrates therefor H05K1/14Structural association of two or more printed circuits H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit H05K1/142Arrangements of planar printed circuit boards in the same plane H05K1/144Stacked arrangements of planar printed circuit boards H05K1/145Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards H05K1/147at least one of the printed circuits being bent or folded H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards H05K1/16incorporating printed electric components H05K1/162incorporating printed capacitors H05K1/165incorporating printed inductors H05K1/167incorporating printed resistors H05K1/18Printed circuits structurally associated with non-printed electric components H05K1/181associated with surface mounted components H05K1/182associated with components mounted in the printed circuit board H05K1/183Components mounted in and supported by recessed areas of the printed circuit board H05K1/184Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit H05K1/186manufactured by mounting on or connecting to patterned circuits before or during embedding H05K1/187the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate H05K1/188manufactured by mounting on or attaching to a structure having a conductive layer H05K1/189characterised by the use of a flexible or folded printed circuit