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H01L27/14634

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14634Assemblies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus, method for controlling electronic apparatus,...
- Patent number 12,170,859
- Issue date Dec 17, 2024
- Nikon Corporation
- Takashi Shionoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensors and methods of forming the same
- Patent number 12,170,301
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic equipment
- Patent number 12,170,303
- Issue date Dec 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaaki Bairo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus and imaging system
- Patent number 12,170,855
- Issue date Dec 17, 2024
- Canon Kabushiki Kaisha
- Yukihiro Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate, semiconductor apparatus, equipment, circuit subs...
- Patent number 12,167,156
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Hideo Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,166,059
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Min-Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number 12,166,061
- Issue date Dec 10, 2024
- Sony Group Corporation
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 12,166,060
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including spider routing
- Patent number 12,160,674
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Moo Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element
- Patent number 12,154,929
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Daisuke Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional microelectronic circuit with optimised distributi...
- Patent number 12,154,930
- Issue date Nov 26, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Gilles Sicard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,874
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoto Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and electronic apparatus
- Patent number 12,148,787
- Issue date Nov 19, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshihiko Nagahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device and method of driving photoelectric...
- Patent number 12,149,856
- Issue date Nov 19, 2024
- Canon Kabushiki Kaisha
- Hideo Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,148,784
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Dae Shik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and imaging device
- Patent number 12,143,735
- Issue date Nov 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takuya Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 12,142,629
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric converter, photoelectric conversion system, and movin...
- Patent number 12,143,737
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Kohichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus, photoelectric conversion system...
- Patent number 12,142,627
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Yasuharu Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, display device including the semiconductor de...
- Patent number 12,142,694
- Issue date Nov 12, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,142,626
- Issue date Nov 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tomomi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,136,643
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Kangmook Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging devices and imaging apparatuses, and methods for the same
- Patent number 12,137,297
- Issue date Nov 5, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Sungin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for image sensor including a spring plate and an insulati...
- Patent number 12,132,065
- Issue date Oct 29, 2024
- LG Innotek Co., Ltd
- Duck Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and electronic device
- Patent number 12,125,867
- Issue date Oct 22, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hajime Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus, photo-detection system, and mov...
- Patent number 12,119,334
- Issue date Oct 15, 2024
- Canon Kabushiki Kaisha
- Yasuharu Ota
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Optical semiconductor device with integrated vias implementing inte...
- Patent number 12,119,365
- Issue date Oct 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate for fabricating III-V photodetector arrays
- Patent number 12,119,367
- Issue date Oct 15, 2024
- University of Southern California
- Rehan Rashid Kapadia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacture of semiconductor devices having redistributi...
- Patent number 12,119,235
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 12,119,359
- Issue date Oct 15, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Koichi Baba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240421172
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION DETECTOR FOR POSITION-RESOLVED DETECTION OF RADIATION
- Publication number 20240413184
- Publication date Dec 12, 2024
- Dectris AG
- Michael RISSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20240413188
- Publication date Dec 12, 2024
- Nikon Corporation
- Daiki OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240413182
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Youngrae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240413187
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- Chihiro ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT DEFLECTING DEVICE AND DISTANCE MEASURING DEVICE
- Publication number 20240413181
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- TOSHIFUMI YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR SEMICONDUCTOR-BASED SINGLE PHOTON EMISSION COMPUTED...
- Publication number 20240413186
- Publication date Dec 12, 2024
- Siemens Medical Solutions USA, Inc.
- Patanit Sanpitak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...
- Publication number 20240405044
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240405049
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240405048
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- JUNSEOK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURIN...
- Publication number 20240405050
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- Katsunori HIRAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH SHARED GATE ARCHITECTURE FOR METAL LAYER REDUCTION
- Publication number 20240405039
- Publication date Dec 5, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Yaxin Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...
- Publication number 20240395745
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jun Kyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20240395835
- Publication date Nov 28, 2024
- Sony Semiconductor Solutions Corporation
- Hironobu FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS
- Publication number 20240397229
- Publication date Nov 28, 2024
- Canon Kabushiki Kaisha
- KAZUHIRO MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A WAFER STACK AND WAFER STACK PRODUCED THEREBY
- Publication number 20240395785
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION ELEMENT AND IMAGING DEVICE
- Publication number 20240395833
- Publication date Nov 28, 2024
- Sony Semiconductor Solutions Corporation
- Yusuke TAJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...
- Publication number 20240387602
- Publication date Nov 21, 2024
- SONY GROUP CORPORATION
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240387194
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING UNIT AND IMAGING DEVICE
- Publication number 20240388781
- Publication date Nov 21, 2024
- FUJIFILM CORPORATION
- Kazuya MAYUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20240387587
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JHY-JYI SZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE
- Publication number 20240387592
- Publication date Nov 21, 2024
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STILTED PAD STRUCTURE
- Publication number 20240379716
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
- Publication number 20240377595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE
- Publication number 20240379692
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240381008
- Publication date Nov 14, 2024
- Sony Semiconductor Solutions Corporation
- DAISUKE ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR, METHOD OF MANUFACTURING PHOTODETECTOR, AND ELECTRONI...
- Publication number 20240379699
- Publication date Nov 14, 2024
- Sony Semiconductor Solutions Corporation
- Nobuya NAKAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20240379713
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-NOISE IMAGE SENSOR HAVING STACKED SEMICONDUCTOR SUBSTRATES
- Publication number 20240379720
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING WITH BOND PAD ABOVE A BONDLINE
- Publication number 20240371905
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Swarnal BORTHAKUR
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic apparatus, method for controlling electronic apparatus,...

Pixel sensors and methods of forming the same

Semiconductor device and electronic equipment

Photoelectric conversion apparatus and imaging system

Circuit substrate, semiconductor apparatus, equipment, circuit subs...

Image sensor

Semiconductor device and method of manufacturing the same, and elec...

Image pickup device and electronic apparatus

Image sensor including spider routing

Semiconductor element

Three-dimensional microelectronic circuit with optimised distributi...

Semiconductor device

Image sensor and electronic apparatus

Photoelectric conversion device and method of driving photoelectric...

Image sensor

Solid-state imaging device and imaging device

Member for solid-state image pickup device and method for manufactu...

Photoelectric converter, photoelectric conversion system, and movin...

Photoelectric conversion apparatus, photoelectric conversion system...

Semiconductor device, display device including the semiconductor de...

Image sensor

Image sensor

Imaging devices and imaging apparatuses, and methods for the same

Substrate for image sensor including a spring plate and an insulati...

Imaging device and electronic device

Photoelectric conversion apparatus, photo-detection system, and mov...

Optical semiconductor device with integrated vias implementing inte...

Composite substrate for fabricating III-V photodetector arrays

Methods of manufacture of semiconductor devices having redistributi...

Imaging device

Patents Applicationslast 30 patents

TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

RADIATION DETECTOR FOR POSITION-RESOLVED DETECTION OF RADIATION

IMAGING ELEMENT AND IMAGING DEVICE

IMAGE SENSOR

SEMICONDUCTOR APPARATUS

LIGHT DEFLECTING DEVICE AND DISTANCE MEASURING DEVICE

INTERPOSER FOR SEMICONDUCTOR-BASED SINGLE PHOTON EMISSION COMPUTED...

SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...

SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

IMAGE SENSOR

SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURIN...

IMAGE SENSOR WITH SHARED GATE ARCHITECTURE FOR METAL LAYER REDUCTION

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...

SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE

PHOTOELECTRIC CONVERSION APPARATUS

METHOD OF FABRICATING A WAFER STACK AND WAFER STACK PRODUCED THEREBY

PHOTOELECTRIC CONVERSION ELEMENT AND IMAGING DEVICE

IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

IMAGING UNIT AND IMAGING DEVICE

SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FORMING THE SAME

SOLID-STATE IMAGE PICKUP DEVICE

STILTED PAD STRUCTURE

PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME

IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE

IMAGING DEVICE

PHOTODETECTOR, METHOD OF MANUFACTURING PHOTODETECTOR, AND ELECTRONI...

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

LOW-NOISE IMAGE SENSOR HAVING STACKED SEMICONDUCTOR SUBSTRATES

CHIP STACKING WITH BOND PAD ABOVE A BONDLINE