Assembling printed circuits with other printed circuits

Industry

CPC
H05K3/36

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/36Assembling printed circuits with other printed circuits

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart connector and method of manufacturing same using an applicati...
- Patent number 12,176,659
- Issue date Dec 24, 2024
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 12,177,977
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module, and method of manufacturing electronic...
- Patent number 12,177,990
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal aperture engine sensors and mesh network
- Patent number 12,146,769
- Issue date Nov 19, 2024
- Fractal Antenna Systems, Inc.
- Nathan Cohen
- G01 - MEASURING TESTING
Information Patent Grant
Button deck assembly for an electronic gaming machine and method fo...
- Patent number 12,147,101
- Issue date Nov 19, 2024
- Aristocrat Technologies Australia Pty Limited
- Timothy Seckel
- G07 - CHECKING-DEVICES
Information Patent Grant
Method of mounting and electrically contacting a first printed circ...
- Patent number 12,150,253
- Issue date Nov 19, 2024
- ABB AG
- Stefan Gutermuth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power conversion device
- Patent number 12,133,369
- Issue date Oct 29, 2024
- Mitsubishi Electric Corporation
- Yuta Yoshimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly
- Patent number 12,133,331
- Issue date Oct 29, 2024
- WAGO Verwaltungsgesellschaft mbH
- Gerald Schauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board interconnection device and circuit board assembly
- Patent number 12,127,344
- Issue date Oct 22, 2024
- BorgWarner Inc.
- Sisay Tadele
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and assembly for board to board connection of active devices
- Patent number 12,127,351
- Issue date Oct 22, 2024
- Smiths Interconnect Canada Inc.
- David R. Rolston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring harness assembly
- Patent number 12,122,308
- Issue date Oct 22, 2024
- Aptiv Technologies AG
- Jared Bilas
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Flexible jumper with a mounting frame
- Patent number 12,120,821
- Issue date Oct 15, 2024
- Ennovi Industries, Inc.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integration method
- Patent number 12,117,648
- Issue date Oct 15, 2024
- Huazhong University of Science & Technology
- Weihua Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite circuit board and method of manufacturing the same
- Patent number 12,114,436
- Issue date Oct 8, 2024
- SHENNAN CIRCUITS CO., LTD.
- Zhicheng Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting electronic components to substrates
- Patent number 12,094,811
- Issue date Sep 17, 2024
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package structure and method for fabricating the same
- Patent number 12,089,346
- Issue date Sep 10, 2024
- Realtek Semiconductor Corp.
- Hai-Tao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and proximity sensor
- Patent number 12,075,567
- Issue date Aug 27, 2024
- Omron Corporation
- Naoki Nishimori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,057,670
- Issue date Aug 6, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,058,817
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Hayoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and manufacturing method thereof
- Patent number 12,058,814
- Issue date Aug 6, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart ring and methods for manufacturing
- Patent number 12,052,816
- Issue date Jul 30, 2024
- Ouraring Inc.
- Denis Mars
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and process for creating high-performance coax sockets
- Patent number 12,052,830
- Issue date Jul 30, 2024
- Advantest America, Inc
- Donald Eric Thompson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Camera module and manufacturing method thereof
- Patent number 12,047,662
- Issue date Jul 23, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Kuei-Feng Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic assembly for a vehicle display
- Patent number 12,041,732
- Issue date Jul 16, 2024
- Polaris Industries Inc.
- Mark A. Powell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective soldering with photonic soldering technology
- Patent number 12,041,728
- Issue date Jul 16, 2024
- Apple Inc.
- Maryam Rahimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,041,720
- Issue date Jul 16, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE HAVING A PCB CAP STRUCTURE
- Publication number 20250008677
- Publication date Jan 2, 2025
- DSBJ PTE. LTD.
- Jan Hendrik BERKEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20240422919
- Publication date Dec 19, 2024
- Murata Manufacturing Co., Ltd.
- Hiromitsu ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20240422918
- Publication date Dec 19, 2024
- Murata Manufacturing Co., Ltd.
- Yui NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER
- Publication number 20240414852
- Publication date Dec 12, 2024
- Seoul National University R&DB Foundation
- Seung Hwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular Printed Circuit Boards with Connectors
- Publication number 20240405459
- Publication date Dec 5, 2024
- Intel Corporation
- Navneet K. SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...
- Publication number 20240407096
- Publication date Dec 5, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Ihab KHOURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...
- Publication number 20240397634
- Publication date Nov 28, 2024
- FIND HOW ENTERPRISE CO. LTD.
- Kuo-Ching Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240389232
- Publication date Nov 21, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY, DISPLAY MODULE AND MANUFACTURING METHOD THE...
- Publication number 20240389236
- Publication date Nov 21, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qijun ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB SPACER
- Publication number 20240373556
- Publication date Nov 7, 2024
- Intel Corporation
- Gabriel Khouri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLIES AND COMPONENTS THEREOF FOR PACKAGING
- Publication number 20240365471
- Publication date Oct 31, 2024
- WestRock MWV, LLC
- Ronald J. BINSHTOK
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
TARGET MATERIAL SEPARATION CONTROL DEVICE USING LASER DIODE
- Publication number 20240365470
- Publication date Oct 31, 2024
- CTCELLS, INC.
- Seung Hoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240357751
- Publication date Oct 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsin-Yu CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240349428
- Publication date Oct 17, 2024
- U-BLOX AG
- Anthony Gergis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...
- Publication number 20240341029
- Publication date Oct 10, 2024
- Spreadtrum Communications (Shanghai) CO., Ltd.
- Li YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SYSTEM ASSEMBLY
- Publication number 20240341041
- Publication date Oct 10, 2024
- EPIRUS, INC.
- Meletios Mastrodemos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20240334603
- Publication date Oct 3, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren XIONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE JOINING STRUCTURE
- Publication number 20240314943
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Hiromitsu Itamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE WITH TOUCH PANEL HAVING X, Y AND DUMMY ELECTRODES
- Publication number 20240310945
- Publication date Sep 19, 2024
- Paneltouch Technologies LLC
- Shinya HASHIMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Coating of Nanowires
- Publication number 20240304581
- Publication date Sep 12, 2024
- NanoWired GmbH
- Olav Birlem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240306306
- Publication date Sep 12, 2024
- Canon Kabushiki Kaisha
- JUN TSUKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240298407
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD INTERCONNECT INTERPOSER AND METHOD
- Publication number 20240292539
- Publication date Aug 29, 2024
- Intel Corporation
- Juha Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENDOSCOPE, PRINTED CIRCUIT BOARD OF AN ENDOSCOPE, AND METHOD FOR EL...
- Publication number 20240292524
- Publication date Aug 29, 2024
- OLYMPUS WINTER & IBE GMBH
- Martin WIETERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20240284594
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND DISPLAY APPARATUS
- Publication number 20240284589
- Publication date Aug 22, 2024
- Xiamen Tianma Optoelectronics Co., Ltd.
- Ningyang ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMB...
- Publication number 20240269759
- Publication date Aug 15, 2024
- Honor Device Co., Ltd.
- Jianqiang GUO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240276652
- Publication date Aug 15, 2024
- LEOTEK CORPORATION
- Cheng-Ta TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20240269780
- Publication date Aug 15, 2024
- NITTO DENKO CORPORATION
- Masatoshi KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ARRANGEMENT
- Publication number 20240268028
- Publication date Aug 8, 2024
- HARTING ELECTRONICS GMBH
- Marc GENAU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Assembling printed circuits with other printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for flexible circuit cable attachment

Smart connector and method of manufacturing same using an applicati...

Flexible printed circuit board and method of manufacturing flexible...

Electronic component module, and method of manufacturing electronic...

Component carrier with embedded interposer laterally between electr...

Wiring circuit board, producing method thereof, and wiring circuit...

Conformal aperture engine sensors and mesh network

Button deck assembly for an electronic gaming machine and method fo...

Method of mounting and electrically contacting a first printed circ...

Power conversion device

Circuit board assembly

Circuit board interconnection device and circuit board assembly

Method and assembly for board to board connection of active devices

Wiring harness assembly

Flexible jumper with a mounting frame

Hybrid integration method

Composite circuit board and method of manufacturing the same

Connection structure and manufacturing method therefor

Connecting electronic components to substrates

Die package structure and method for fabricating the same

Electronic apparatus and proximity sensor

Semiconductor package structure and method for manufacturing the same

Electronic device and method of manufacturing the same

Power module and manufacturing method thereof

Smart ring and methods for manufacturing

Method and process for creating high-performance coax sockets

Camera module and manufacturing method thereof

Electronic assembly for a vehicle display

Selective soldering with photonic soldering technology

Display device and manufacturing method thereof

Patents Applicationslast 30 patents

ELECTRONIC MODULE HAVING A PCB CAP STRUCTURE

STRETCHABLE DEVICE

STRETCHABLE DEVICE

METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER

Modular Printed Circuit Boards with Connectors

ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...

SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD ASSEMBLY, DISPLAY MODULE AND MANUFACTURING METHOD THE...

PCB SPACER

CIRCUIT ASSEMBLIES AND COMPONENTS THEREOF FOR PACKAGING

TARGET MATERIAL SEPARATION CONTROL DEVICE USING LASER DIODE

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD

MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...

ELECTRONIC SYSTEM ASSEMBLY

DISPLAY DEVICE

SUBSTRATE JOINING STRUCTURE

DISPLAY DEVICE WITH TOUCH PANEL HAVING X, Y AND DUMMY ELECTRODES

Coating of Nanowires

ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME

CIRCUIT BOARD INTERCONNECT INTERPOSER AND METHOD

ENDOSCOPE, PRINTED CIRCUIT BOARD OF AN ENDOSCOPE, AND METHOD FOR EL...

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

DISPLAY MODULE AND DISPLAY APPARATUS

CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMB...

CIRCUIT BOARD MODULE AND MANUFACTURING METHOD THEREOF

BONDING SHEET AND METHOD FOR PRODUCING SAME

PRINTED CIRCUIT BOARD ARRANGEMENT