Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method
- Patent number 12,362,228
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method thereof
- Patent number 12,354,937
- Issue date Jul 8, 2025
- Denso Corporation
- Takao Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 12,354,968
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to reduce defects in interconnects between se...
- Patent number 12,341,117
- Issue date Jun 24, 2025
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including vent openings and associated methods
- Patent number 12,334,405
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Michael Stadler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using processing oven
- Patent number 12,330,228
- Issue date Jun 17, 2025
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 12,300,638
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure radiating electromagnetic waves in horizontal d...
- Patent number 12,283,493
- Issue date Apr 22, 2025
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressing group for a sintering press for sintering electronic compo...
- Patent number 12,257,801
- Issue date Mar 25, 2025
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,224,180
- Issue date Feb 11, 2025
- Nexperia B.V.
- Ricardo Yandoc
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 12,211,804
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, and method of manufacturing electronic...
- Patent number 12,177,990
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
- Patent number 12,170,263
- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flip-chip stacking structures and methods for forming the same
- Patent number 12,166,012
- Issue date Dec 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk
- Patent number 12,148,629
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for wafer bond monitoring
- Patent number 12,085,518
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures with antenna elements and IC chips employing...
- Patent number 12,080,661
- Issue date Sep 3, 2024
- Viasat, Inc.
- Steven J. Franson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a metal-ceramic substrate
- Patent number 12,059,739
- Issue date Aug 13, 2024
- Heraeus Deutschland GmbH & Co. KG
- Andre Schwöbel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,051,668
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer and planarization layer and method of forming the...
- Patent number 12,051,622
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate for radio frequency applications
- Patent number 12,051,653
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride-based semiconductor packaged structure and method for m...
- Patent number 12,040,259
- Issue date Jul 16, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shangqing Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package architectures containing a die back side metal a...
- Patent number 12,040,246
- Issue date Jul 16, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with a paddle and ele...
- Patent number 12,033,926
- Issue date Jul 9, 2024
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 12,027,433
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fanout integration for stacked silicon package assembly
- Patent number 12,027,493
- Issue date Jul 2, 2024
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing implantable tissue stimulators
- Patent number 12,017,082
- Issue date Jun 25, 2024
- CURONIX LLC
- Graham Patrick Greene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged memory device with flip chip and wire bond dies
- Patent number 12,021,061
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS
- Publication number 20250239505
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Ludovic FALLOURD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING BONDING MATERIAL DEPOSITS
- Publication number 20250226237
- Publication date Jul 10, 2025
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210503
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210504
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Masashi ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250183168
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...
- Publication number 20250167015
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Donguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DISMANTLABLE STRUCTURE AND METHOD THEREFOR
- Publication number 20250125159
- Publication date Apr 17, 2025
- NXP B.V.
- Yu Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022850
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022851
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429142
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...
- Publication number 20240421053
- Publication date Dec 19, 2024
- Qianli MU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
- Publication number 20240404960
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...
- Publication number 20240404839
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR WAFER BOND MONITORING
- Publication number 20240385124
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, FABRICATION METHODS OF SEMICONDUCTOR DEVICES...
- Publication number 20240387408
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240387245
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...
- Publication number 20240379428
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Side Molded System...
- Publication number 20240379480
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED REFLOW DEVICE
- Publication number 20240363376
- Publication date Oct 31, 2024
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE
- Publication number 20240363994
- Publication date Oct 31, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
- Publication number 20240347433
- Publication date Oct 17, 2024
- SILICON BOX PTE. LTD.
- Sehat SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT
- Publication number 20240347369
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Frank SINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS
- Publication number 20240347386
- Publication date Oct 17, 2024
- Honeywell International Inc.
- James L. Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240312851
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20240282755
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Stacking Structure and Method of Fabricating the Same
- Publication number 20240282686
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT-MOUNTING-SUBSTRATE MANUFACTURING METHOD
- Publication number 20240282594
- Publication date Aug 22, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tadashi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240266277
- Publication date Aug 8, 2024
- AOI ELECTRONICS CO., LTD.
- Katsuhiro TAKAO
- H01 - BASIC ELECTRIC ELEMENTS

Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method

Semiconductor device and production method thereof

Reconstituted substrate structure and fabrication methods for heter...

Methods and apparatus to reduce defects in interconnects between se...

Electronic devices including vent openings and associated methods

Method of using processing oven

Method of forming an electronic device structure having an electron...

Packaging structure radiating electromagnetic waves in horizontal d...

Pressing group for a sintering press for sintering electronic compo...

Semiconductor device and a method of manufacturing a semiconductor...

Semiconductor device with partial EMI shielding removal using laser...

Electronic component module, and method of manufacturing electronic...

Fabricating active-bridge-coupled GPU chiplets

Flip-chip stacking structures and methods for forming the same

Single-shot encapsulation

Shutter disk

Method of forming semiconductor packages having through package vias

Systems and methods for wafer bond monitoring

Integrated structures with antenna elements and IC chips employing...

Method for producing a metal-ceramic substrate

Semiconductor package and method of forming the same

Passivation layer and planarization layer and method of forming the...

Reconstituted substrate for radio frequency applications

III-nitride-based semiconductor packaged structure and method for m...

Chip-scale package architectures containing a die back side metal a...

Method of manufacturing semiconductor devices with a paddle and ele...

Semiconductor package and method for making the same

Fanout integration for stacked silicon package assembly

Manufacturing implantable tissue stimulators

Packaged memory device with flip chip and wire bond dies

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS

METHOD FOR MOUNTING BONDING MATERIAL DEPOSITS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...

SEMICONDUCTOR DEVICE HAVING DISMANTLABLE STRUCTURE AND METHOD THEREFOR

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...

RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS

WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SYSTEMS AND METHODS FOR WAFER BOND MONITORING

SEMICONDUCTOR DEVICES, FABRICATION METHODS OF SEMICONDUCTOR DEVICES...

Semiconductor Package and Method

SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...

Semiconductor Device and Method of Making a Dual-Side Molded System...

INFRARED REFLOW DEVICE

ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...

DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT

BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...

3D Stacking Structure and Method of Fabricating the Same

ELECTRONIC-COMPONENT-MOUNTING-SUBSTRATE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME