Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2021/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 12,211,804
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, and method of manufacturing electronic...
- Patent number 12,177,990
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
- Patent number 12,170,263
- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flip-chip stacking structures and methods for forming the same
- Patent number 12,166,012
- Issue date Dec 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk
- Patent number 12,148,629
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for wafer bond monitoring
- Patent number 12,085,518
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures with antenna elements and IC chips employing...
- Patent number 12,080,661
- Issue date Sep 3, 2024
- Viasat, Inc.
- Steven J. Franson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a metal-ceramic substrate
- Patent number 12,059,739
- Issue date Aug 13, 2024
- Heraeus Deutschland GmbH & Co. KG
- Andre Schwöbel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,051,668
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer and planarization layer and method of forming the...
- Patent number 12,051,622
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate for radio frequency applications
- Patent number 12,051,653
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package architectures containing a die back side metal a...
- Patent number 12,040,246
- Issue date Jul 16, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride-based semiconductor packaged structure and method for m...
- Patent number 12,040,259
- Issue date Jul 16, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shangqing Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with a paddle and ele...
- Patent number 12,033,926
- Issue date Jul 9, 2024
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 12,027,433
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fanout integration for stacked silicon package assembly
- Patent number 12,027,493
- Issue date Jul 2, 2024
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing implantable tissue stimulators
- Patent number 12,017,082
- Issue date Jun 25, 2024
- CURONIX LLC
- Graham Patrick Greene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged memory device with flip chip and wire bond dies
- Patent number 12,021,061
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method for forming solder bumps
- Patent number 11,990,437
- Issue date May 21, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component-manufacturing tool and component-manufacturing method
- Patent number 11,984,341
- Issue date May 14, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated substrate structure, redistribution structure, and manuf...
- Patent number 11,984,403
- Issue date May 14, 2024
- Dyi-Chung Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,973,062
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,742
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of package components and bonding apparatus
- Patent number 11,955,378
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power die heat sink
- Patent number 11,948,853
- Issue date Apr 2, 2024
- QUALCOMM Technologies Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 11,935,840
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief for flip-chip packaged devices
- Patent number 11,930,590
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power die heat sink with vertical heat path
- Patent number 11,929,299
- Issue date Mar 12, 2024
- QUALCOMM Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022850
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022851
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429142
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...
- Publication number 20240421053
- Publication date Dec 19, 2024
- Qianli MU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
- Publication number 20240404960
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...
- Publication number 20240404839
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR WAFER BOND MONITORING
- Publication number 20240385124
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, FABRICATION METHODS OF SEMICONDUCTOR DEVICES...
- Publication number 20240387408
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240387245
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...
- Publication number 20240379428
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Side Molded System...
- Publication number 20240379480
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED REFLOW DEVICE
- Publication number 20240363376
- Publication date Oct 31, 2024
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE
- Publication number 20240363994
- Publication date Oct 31, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
- Publication number 20240347433
- Publication date Oct 17, 2024
- SILICON BOX PTE. LTD.
- Sehat SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT
- Publication number 20240347369
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Frank SINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS
- Publication number 20240347386
- Publication date Oct 17, 2024
- Honeywell International Inc.
- James L. Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240312851
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20240282755
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Stacking Structure and Method of Fabricating the Same
- Publication number 20240282686
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT-MOUNTING-SUBSTRATE MANUFACTURING METHOD
- Publication number 20240282594
- Publication date Aug 22, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tadashi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240266277
- Publication date Aug 8, 2024
- AOI ELECTRONICS CO., LTD.
- Katsuhiro TAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266189
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240250035
- Publication date Jul 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Se Hwan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20240224415
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTEGRATED SUBSTRATE STRUCTURE
- Publication number 20240222277
- Publication date Jul 4, 2024
- Dyi-Chung HU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
- Publication number 20240194572
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...
- Publication number 20240186285
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding Removal Using Laser...
- Publication number 20240170416
- Publication date May 23, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS

Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with partial EMI shielding removal using laser...

Electronic component module, and method of manufacturing electronic...

Fabricating active-bridge-coupled GPU chiplets

Flip-chip stacking structures and methods for forming the same

Single-shot encapsulation

Shutter disk

Method of forming semiconductor packages having through package vias

Systems and methods for wafer bond monitoring

Integrated structures with antenna elements and IC chips employing...

Method for producing a metal-ceramic substrate

Semiconductor package and method of forming the same

Passivation layer and planarization layer and method of forming the...

Reconstituted substrate for radio frequency applications

Chip-scale package architectures containing a die back side metal a...

III-nitride-based semiconductor packaged structure and method for m...

Method of manufacturing semiconductor devices with a paddle and ele...

Semiconductor package and method for making the same

Fanout integration for stacked silicon package assembly

Manufacturing implantable tissue stimulators

Packaged memory device with flip chip and wire bond dies

System and method for forming solder bumps

Component-manufacturing tool and component-manufacturing method

Integrated substrate structure, redistribution structure, and manuf...

High density pillar interconnect conversion with stack to substrate...

Semiconductor device and manufacturing method thereof

Bonding method of package components and bonding apparatus

High-power die heat sink

Semiconductor device with partial EMI shielding removal using laser...

Stress relief for flip-chip packaged devices

High-power die heat sink with vertical heat path

Patents Applicationslast 30 patents

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...

RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS

WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SYSTEMS AND METHODS FOR WAFER BOND MONITORING

SEMICONDUCTOR DEVICES, FABRICATION METHODS OF SEMICONDUCTOR DEVICES...

Semiconductor Package and Method

SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...

Semiconductor Device and Method of Making a Dual-Side Molded System...

INFRARED REFLOW DEVICE

ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...

DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT

BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...

3D Stacking Structure and Method of Fabricating the Same

ELECTRONIC-COMPONENT-MOUNTING-SUBSTRATE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

METHOD FOR MANUFACTURING INTEGRATED SUBSTRATE STRUCTURE

LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...

Semiconductor Device with Partial EMI Shielding Removal Using Laser...