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H01L2023/4025

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2023/4025Base discrete devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pressure balancing clamp for press-pack insulated gate bipolar tran...
- Patent number 11,699,633
- Issue date Jul 11, 2023
- Beijing University of Technology
- Tong An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,282,766
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company
- Shih-Chang Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same and wire...
- Patent number 11,081,449
- Issue date Aug 3, 2021
- Mitsubishi Electric Corporation
- Tsuneo Hamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting an LED element on a flat carrier
- Patent number 11,056,629
- Issue date Jul 6, 2021
- Lumileds LLC
- Michael Deckers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power switching module and electronic power device integrating said...
- Patent number 10,998,831
- Issue date May 4, 2021
- INSTITUT VEDECOM
- Friedbald Kiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device and manufacturing method and appara...
- Patent number 10,950,391
- Issue date Mar 16, 2021
- Kabushiki Kaisha Toshiba
- Shigehiko Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,770,371
- Issue date Sep 8, 2020
- Mitsubishi Electric Corporation
- Yoichi Hironaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device
- Patent number 10,674,640
- Issue date Jun 2, 2020
- Delta Electronics, Inc.
- Chao-Li Kao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for manufacturing electronic device and electronic device
- Patent number 10,559,478
- Issue date Feb 11, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Hideki Kamada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 10,504,817
- Issue date Dec 10, 2019
- Mitsubishi Electric Corporation
- Kazuya Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamping assembly having a pressure element
- Patent number 10,103,085
- Issue date Oct 16, 2018
- Siemens Aktiengesellschaft
- Holger Siegmund Brehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a pressure application body and a...
- Patent number 10,002,812
- Issue date Jun 19, 2018
- Semikron GmbH & Co., KG
- Christian Göbl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lightweight liquid-cooling-plate assembly having plastic frame and...
- Patent number 9,984,955
- Issue date May 29, 2018
- Enzotechnology Corp.
- Kuo-An Liang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electric power converter
- Patent number 9,713,293
- Issue date Jul 18, 2017
- Denso Corporation
- Kazuya Takeuchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Heat dissipating structure base board, module using heat dissipatin...
- Patent number 8,130,499
- Issue date Mar 6, 2012
- Panasonic Corporation
- Tohru Ohnishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor clamping device
- Patent number 5,940,273
- Issue date Aug 17, 1999
- Inductotherm Corp.
- Oleg S. Fishman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Means for clamping a semi-conductor to a support
- Patent number 5,483,103
- Issue date Jan 9, 1996
- Harris Corporation
- Joseph D. Blickhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting arrangements for high voltage/high power semiconductors
- Patent number 5,168,425
- Issue date Dec 1, 1992
- General Electric Company
- Stephen T. Radack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrostatic clamp and method for compression type power semiconductors
- Patent number 5,040,051
- Issue date Aug 13, 1991
- Sundstrand Corporation
- Clifford G. Thiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for mounting and cooling power semiconductor devices
- Patent number 4,965,658
- Issue date Oct 23, 1990
- York International Corporation
- Dean K. Norbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack
- Patent number 4,866,503
- Issue date Sep 12, 1989
- Kabushiki Kaisha Toshiba
- Ryouichi Kushibiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and tool for assembling power semiconductor and heat sink
- Patent number 4,766,653
- Issue date Aug 30, 1988
- Otis Elevator Company
- Joseph L. Della Porta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting and connection device for power semi-conductors
- Patent number 4,739,447
- Issue date Apr 19, 1988
- La Telemecanique Electrique
- Rene Lecomte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-packed semiconductor device
- Patent number 4,694,322
- Issue date Sep 15, 1987
- Kabushiki Kaisha Toshiba
- Hiroshi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor assembly
- Patent number 4,642,671
- Issue date Feb 10, 1987
- Lucas Industries public limited company
- Ivor C. Rohsler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamping device for plate-shaped semiconductor components
- Patent number 4,638,404
- Issue date Jan 20, 1987
- Siemens Aktiengesellschaft
- Kurt Grossmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly-heat sink for semiconductor devices
- Patent number 4,518,983
- Issue date May 21, 1985
- Westinghouse Electric Corp.
- Kenneth G. Longenecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor unit
- Patent number 4,499,485
- Issue date Feb 12, 1985
- Semikron Gesellschaft fur Gleichrichterbau und Elektronik m.b.H.
- Winfried Schierz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rectifying device
- Patent number 4,460,956
- Issue date Jul 17, 1984
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor heat sink assembly including thermally responsive mea...
- Patent number 4,414,562
- Issue date Nov 8, 1983
- Thermal Associates, Inc.
- Richard F. Kiley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE BALANCING CLAMP FOR PRESS-PACK INSULATED GATE BIPOLAR TRAN...
- Publication number 20230245946
- Publication date Aug 3, 2023
- BEIJING UNIVERSITY OF TECHNOLOGY
- Tong AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210098333
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Chang Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE
- Publication number 20200196480
- Publication date Jun 18, 2020
- Delta Electronics, Inc.
- Chao-Li KAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MOUNTING AN LED ELEMENT ON A FLAT CARRIER
- Publication number 20200161519
- Publication date May 21, 2020
- Lumileds LLC
- Michael DECKERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME AND WIRE...
- Publication number 20190259711
- Publication date Aug 22, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Tsuneo HAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190074238
- Publication date Mar 7, 2019
- Mitsubishi Electric Corporation
- Kazuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTWEIGHT LIQUID-COOLING-PLATE ASSEMBLY HAVING PLASTIC FRAME AND...
- Publication number 20180151473
- Publication date May 31, 2018
- ENZOTECHNOLOGY CORP.
- Kuo-An Liang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Power semiconductor module having a pressure application body and a...
- Publication number 20170221785
- Publication date Aug 3, 2017
- SEMIKRON Elektronik GmbH & Co., KG
- Christian GÖBL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170170096
- Publication date Jun 15, 2017
- Mitsubishi Electric Corporation
- Yoichi HIRONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clamping Assembly Having A Pressure Element
- Publication number 20170162470
- Publication date Jun 8, 2017
- Siemens Aktiengesellschaft
- Holger Siegmund BREHM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE UNIT AND ELECTRONIC DEVICE
- Publication number 20140340847
- Publication date Nov 20, 2014
- Fujitsu Limited
- Yoshihisa IWAKIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Devices/Heatsinks Stack Assembly And A Method To Pull Apart...
- Publication number 20140231869
- Publication date Aug 21, 2014
- ALSTOM Technology Ltd.
- Roman Raubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING STRUCTURE BASE BOARD, MODULE USING HEAT DISSIPATIN...
- Publication number 20100091464
- Publication date Apr 15, 2010
- PANASONIC CORPORATION
- Tohru Ohnishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Base discrete devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure balancing clamp for press-pack insulated gate bipolar tran...

Package structure

Semiconductor device and method for manufacturing the same and wire...

Mounting an LED element on a flat carrier

Power switching module and electronic power device integrating said...

Photoelectric conversion device and manufacturing method and appara...

Semiconductor device

Integrated electronic device

Method for manufacturing electronic device and electronic device

Semiconductor device

Clamping assembly having a pressure element

Power semiconductor module having a pressure application body and a...

Lightweight liquid-cooling-plate assembly having plastic frame and...

Electric power converter

Heat dissipating structure base board, module using heat dissipatin...

Semiconductor clamping device

Means for clamping a semi-conductor to a support

Mounting arrangements for high voltage/high power semiconductors

Hydrostatic clamp and method for compression type power semiconductors

System for mounting and cooling power semiconductor devices

Semiconductor stack

Method and tool for assembling power semiconductor and heat sink

Mounting and connection device for power semi-conductors

Press-packed semiconductor device

Semi-conductor assembly

Clamping device for plate-shaped semiconductor components

Assembly-heat sink for semiconductor devices

Semiconductor unit

Rectifying device

Semiconductor heat sink assembly including thermally responsive mea...

Patents Applicationslast 30 patents

PRESSURE BALANCING CLAMP FOR PRESS-PACK INSULATED GATE BIPOLAR TRAN...

PACKAGE STRUCTURE

INTEGRATED ELECTRONIC DEVICE

MOUNTING AN LED ELEMENT ON A FLAT CARRIER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME AND WIRE...

SEMICONDUCTOR DEVICE

LIGHTWEIGHT LIQUID-COOLING-PLATE ASSEMBLY HAVING PLASTIC FRAME AND...

Power semiconductor module having a pressure application body and a...

SEMICONDUCTOR DEVICE

Clamping Assembly Having A Pressure Element

SUBSTRATE UNIT AND ELECTRONIC DEVICE

Silicon Devices/Heatsinks Stack Assembly And A Method To Pull Apart...

HEAT DISSIPATING STRUCTURE BASE BOARD, MODULE USING HEAT DISSIPATIN...