Bases, plates or heatsinks

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4871Bases, plates or heatsinks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,176,262
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,176,299
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a thermal contact and method of making
- Patent number 12,142,542
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package baseplate with step recess design
- Patent number 12,131,981
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system and methods
- Patent number 12,133,365
- Issue date Oct 29, 2024
- Shuaib Badat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping element and method for producing a power semiconductor device
- Patent number 12,125,767
- Issue date Oct 22, 2024
- HITACHI ENERGY LTD
- Lluis Santolaria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Kiosk gift card system and method
- Patent number 12,125,807
- Issue date Oct 22, 2024
- James Curtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure, method for forming heat dissipation str...
- Patent number 12,119,283
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced FCBGA package
- Patent number 12,107,028
- Issue date Oct 1, 2024
- STATS ChipPAC Pte. Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip heat dissipating structure, chip structure, circuit board and...
- Patent number 12,100,636
- Issue date Sep 24, 2024
- BITMAIN TECHNOLOGIES INC.
- Tao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electromagnet...
- Patent number 12,100,669
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,100,642
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat dissipation structure of curved pr...
- Patent number 12,094,836
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a thermal contact
- Patent number 12,094,799
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method
- Patent number 12,085,769
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture utilizing wafer to wafer bonding
- Patent number 12,087,656
- Issue date Sep 10, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of wafer bonding
- Patent number 12,080,622
- Issue date Sep 3, 2024
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in semiconductor packages and methods of forming same
- Patent number 12,074,148
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation-electromagnetic shielding embedded packaging struc...
- Patent number 12,074,115
- Issue date Aug 27, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dispersion layers for double sided interconnect
- Patent number 12,074,084
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame member with a porous material between a semiconductor module...
- Patent number 12,068,217
- Issue date Aug 20, 2024
- Mitsubishi Electric Corporation
- Takashi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface interconnect structure for efficient heat dissipation of...
- Patent number 12,068,220
- Issue date Aug 20, 2024
- Dalian University of Technology
- Mingliang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including recesses to contain solder
- Patent number 12,062,589
- Issue date Aug 13, 2024
- Infineon Technologies AG
- Adrian Lis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bridge interposer structure
- Patent number 12,046,530
- Issue date Jul 23, 2024
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shielding package structure comprising electroplati...
- Patent number 12,033,955
- Issue date Jul 9, 2024
- JCET GROUP CO., LTD.
- Man Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive heat radiation film, method of manufacturing the same, a...
- Patent number 12,027,441
- Issue date Jul 2, 2024
- Fujitsu Limited
- Shinichi Hirose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,021,043
- Issue date Jun 25, 2024
- Fuji Electric Co., Ltd.
- Hiroaki Hokazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor die and a plurality...
- Patent number 12,021,024
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid device assemblies and method of fabrication
- Patent number 12,015,004
- Issue date Jun 18, 2024
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermally Enhanced FCBGA Package
- Publication number 20240421024
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20240379487
- Publication date Nov 14, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371794
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20240371839
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240361546
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVER AND UNDER INTERCONNECTS
- Publication number 20240347443
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT
- Publication number 20240347412
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321672
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Cheng-Lun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240312904
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTUR...
- Publication number 20240304514
- Publication date Sep 12, 2024
- Sumitomo Electric Industries, Ltd.
- Toru MAEDA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIO...
- Publication number 20240290680
- Publication date Aug 29, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274495
- Publication date Aug 15, 2024
- Siliconware Precision Industries Co., Ltd.
- Shuai-Lin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMPING ELEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE
- Publication number 20240266250
- Publication date Aug 8, 2024
- Lluis SANTOLARIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COOLING STRUCTURES
- Publication number 20240266255
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Compartment Shield Formed from Metal Bars...
- Publication number 20240258246
- Publication date Aug 1, 2024
- STATS ChipPAC Pte Ltd.
- YongKook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES AND RELATED METHODS
- Publication number 20240258181
- Publication date Aug 1, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240249994
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR ALUMINUM-DIAMOND COMPOSITE
- Publication number 20240226997
- Publication date Jul 11, 2024
- DENKA COMPANY LIMITED
- Hiroaki OTA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
- Publication number 20240234258
- Publication date Jul 11, 2024
- NXP B.V.
- Frank.zy Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND METHOD OF PRODUCING THE COMPOSITE SUBSTRATE...
- Publication number 20240222209
- Publication date Jul 4, 2024
- Nichia Corporation.
- Masatsugu ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...
- Publication number 20240222143
- Publication date Jul 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...
- Publication number 20240222335
- Publication date Jul 4, 2024
- ROBERT BOSCH GmbH
- Bo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...
- Publication number 20240203827
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF BORON ARSENIDE INTO POWER DEVICES AND SEMICONDUCTORS...
- Publication number 20240186216
- Publication date Jun 6, 2024
- The Regents of the University of California
- Yongjie HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
- Publication number 20240153840
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips (SoIC) and Semiconductor Structures with...
- Publication number 20240153881
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE INTERCONNECT STRUCTURE FOR EFFICIENT HEAT DISSIPATION OF...
- Publication number 20240145336
- Publication date May 2, 2024
- DALIAN UNIVERSITY OF TECHNOLOGY
- Mingliang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
- Publication number 20240136256
- Publication date Apr 25, 2024
- NXP B.V.
- Frank.zy Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Making and Using Thermally Adva...
- Publication number 20240105551
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- Hyun-kyu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Bases, plates or heatsinks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor device having a thermal contact and method of making

Power module package baseplate with step recess design

Cooling system and methods

Clamping element and method for producing a power semiconductor device

Kiosk gift card system and method

Heat dissipation structure, method for forming heat dissipation str...

Thermally enhanced FCBGA package

Chip heat dissipating structure, chip structure, circuit board and...

Multi-component modules (MCMs) including configurable electromagnet...

Electronic package and fabrication method thereof

Semiconductor device having heat dissipation structure of curved pr...

Method of making a semiconductor device having a thermal contact

Integrated circuit device and method

Package architecture utilizing wafer to wafer bonding

Semiconductor structure and method of wafer bonding

Heat dissipation in semiconductor packages and methods of forming same

Heat dissipation-electromagnetic shielding embedded packaging struc...

Heat dispersion layers for double sided interconnect

Frame member with a porous material between a semiconductor module...

Interface interconnect structure for efficient heat dissipation of...

Semiconductor packages including recesses to contain solder

Thermal bridge interposer structure

Electromagnetic shielding package structure comprising electroplati...

Conductive heat radiation film, method of manufacturing the same, a...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device including a semiconductor die and a plurality...

Hybrid device assemblies and method of fabrication

Patents Applicationslast 30 patents

Thermally Enhanced FCBGA Package

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

OVER AND UNDER INTERCONNECTS

HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF FABRICATING PACKAGE STRUCTURE

COMPOSITE MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTUR...

LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIO...

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CLAMPING ELEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE COOLING STRUCTURES

Semiconductor Device with Compartment Shield Formed from Metal Bars...

SUBSTRATES AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

PRODUCTION METHOD FOR ALUMINUM-DIAMOND COMPOSITE

SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR

COMPOSITE SUBSTRATE AND METHOD OF PRODUCING THE COMPOSITE SUBSTRATE...

EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...

ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...

THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...

INTEGRATION OF BORON ARSENIDE INTO POWER DEVICES AND SEMICONDUCTORS...

PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME

System on Integrated Chips (SoIC) and Semiconductor Structures with...

INTERFACE INTERCONNECT STRUCTURE FOR EFFICIENT HEAT DISSIPATION OF...

SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR

Semiconductor Device and Methods of Making and Using Thermally Adva...