Bases, plates or heatsinks

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CPC
H01L21/4871

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4871Bases, plates or heatsinks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Kiosk gift card system and method
- Patent number 11,967,215
- Issue date Apr 23, 2024
- James Curtis
- G07 - CHECKING-DEVICES
Information Patent Grant
Substrate manufacturing method for realizing three-dimensional pack...
- Patent number 11,961,743
- Issue date Apr 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 11,955,402
- Issue date Apr 9, 2024
- Vitesco Technologies GbmH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for an electronic component
- Patent number 11,948,856
- Issue date Apr 2, 2024
- Siemens Aktiengesellschaft
- Daniel Reznik
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Liquid cooling module and method of forming the same
- Patent number 11,948,861
- Issue date Apr 2, 2024
- Agency for Science, Technology and Research
- Yong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subsea variable speed drive apparatus
- Patent number 11,950,389
- Issue date Apr 2, 2024
- Ana Maria Guimarães Guerreiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear spacer for spacing a carrier of a package
- Patent number 11,942,383
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a module with solder body having elevated edge
- Patent number 11,942,335
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Achim Muecke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate and method of producing the composite substrate...
- Patent number 11,929,294
- Issue date Mar 12, 2024
- Nichia Corporation
- Masatsugu Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with heat dissipation conduit in sidewall i...
- Patent number 11,929,304
- Issue date Mar 12, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with lid
- Patent number 11,915,992
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of GPU-HBM package by microchannel integrated su...
- Patent number 11,915,997
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal die attach to substrate with multi-...
- Patent number 11,908,776
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with an electrode-attached frame supported by a heat sink,...
- Patent number 11,901,268
- Issue date Feb 13, 2024
- NGK Electronics Devices, Inc.
- Yoshio Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips (SoIC) and semiconductor structures with...
- Patent number 11,894,309
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
- Patent number 11,894,284
- Issue date Feb 6, 2024
- LMDJ MANAGEMENT LLC
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing for integrated circuit assembly connectors
- Patent number 11,887,944
- Issue date Jan 30, 2024
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon based polymer thermal interface materials with polymer chain...
- Patent number 11,881,440
- Issue date Jan 23, 2024
- Intel Corporation
- Marely E. Tejeda Ferrari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First-level integration of second-level thermal interface material...
- Patent number 11,881,438
- Issue date Jan 23, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising conductive metal board and ground element
- Patent number 11,869,850
- Issue date Jan 9, 2024
- Wistron NeWeb Corporation
- Lee-Cheng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal substrate contact
- Patent number 11,862,527
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having die pad with cooling fins
- Patent number 11,848,256
- Issue date Dec 19, 2023
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with alignment mark and manufacturing method...
- Patent number 11,842,902
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over and under interconnects
- Patent number 11,830,804
- Issue date Nov 28, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid device assemblies and method of fabrication
- Patent number 11,830,842
- Issue date Nov 28, 2023
- NXP USA., Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader (IHS) with heating element
- Patent number 11,798,861
- Issue date Oct 24, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 11,798,897
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,798,862
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing heat dissipation substrate and method of produc...
- Patent number 11,799,065
- Issue date Oct 24, 2023
- Nichia Corporation
- Shoichi Yamada
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
- Publication number 20240136256
- Publication date Apr 25, 2024
- NXP B.V.
- Frank.zy Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Making and Using Thermally Adva...
- Publication number 20240105551
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- Hyun-kyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240096733
- Publication date Mar 21, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIP...
- Publication number 20240087980
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING HIGH-HEAT-DISSIPATION MIXED SUBSTRATE, AND...
- Publication number 20240079287
- Publication date Mar 7, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240071854
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Kiosk Gift Card System and Method
- Publication number 20240047382
- Publication date Feb 8, 2024
- James Curtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047294
- Publication date Feb 8, 2024
- Mitsubishi Electric Corporation
- Katsuhiko KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE HEAT RADIATION FILM, METHOD OF MANUFACTURING THE SAME, A...
- Publication number 20240047299
- Publication date Feb 8, 2024
- FUJITSU LIMITED
- Shinichi Hirose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240038623
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030089
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY, ELECTRONIC ASSEMBLY, A...
- Publication number 20240030100
- Publication date Jan 25, 2024
- Audi AG
- Daniel RUPPERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20240030093
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for Processing Exfoliated Graphite Materials
- Publication number 20240021495
- Publication date Jan 18, 2024
- 0908905 B.C. Ltd.
- John Kenna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20240021540
- Publication date Jan 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...
- Publication number 20240021538
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and manufacturing method thereof
- Publication number 20240014082
- Publication date Jan 11, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Feng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411239
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Yuichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...
- Publication number 20230411235
- Publication date Dec 21, 2023
- STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
- MAN BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT AND METHOD OF MAKING
- Publication number 20230386958
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME
- Publication number 20230378007
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
- Publication number 20230369176
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Thermally Coupled to Passive Element
- Publication number 20230369160
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230369246
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION
- Publication number 20230369272
- Publication date Nov 16, 2023
- NXP USA, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUF...
- Publication number 20230361000
- Publication date Nov 9, 2023
- CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERAITON FOUNDATION
- Hyoung Soon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Kiosk Gift Card System and Method
- Publication number 20230343166
- Publication date Oct 26, 2023
- James Curtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE THERMAL MANAGEMENT THROUGH BACKSIDE METAL
- Publication number 20230343721
- Publication date Oct 26, 2023
- Qorvo US, Inc.
- MD Hasnine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING
- Publication number 20230335434
- Publication date Oct 19, 2023
- Applied Materials, Inc.
- Anqing Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE SUBSTRATE MANUFACTURING METHOD
- Publication number 20230326765
- Publication date Oct 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Bases, plates or heatsinks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Kiosk gift card system and method

Substrate manufacturing method for realizing three-dimensional pack...

Power semiconductor component and method for producing a power semi...

Semiconductor device

Heat sink for an electronic component

Liquid cooling module and method of forming the same

Subsea variable speed drive apparatus

Linear spacer for spacing a carrier of a package

Manufacturing a module with solder body having elevated edge

Composite substrate and method of producing the composite substrate...

Semiconductor apparatus with heat dissipation conduit in sidewall i...

Method for forming package structure with lid

Thermal management of GPU-HBM package by microchannel integrated su...

Semiconductor device with metal die attach to substrate with multi-...

Package with an electrode-attached frame supported by a heat sink,...

System on integrated chips (SoIC) and semiconductor structures with...

Semiconductor structure having silver-indium transient liquid phase...

Additive manufacturing for integrated circuit assembly connectors

Carbon based polymer thermal interface materials with polymer chain...

First-level integration of second-level thermal interface material...

Package structure comprising conductive metal board and ground element

Thermal substrate contact

Semiconductor package having die pad with cooling fins

Semiconductor package with alignment mark and manufacturing method...

Over and under interconnects

Hybrid device assemblies and method of fabrication

Integrated heat spreader (IHS) with heating element

Package structure and methods of manufacturing the same

Semiconductor package

Method of producing heat dissipation substrate and method of produc...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR

Semiconductor Device and Methods of Making and Using Thermally Adva...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIP...

METHOD FOR MANUFACTURING HIGH-HEAT-DISSIPATION MIXED SUBSTRATE, AND...

MULTI-DIE PACKAGE AND METHODS OF FORMATION

Kiosk Gift Card System and Method

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CONDUCTIVE HEAT RADIATION FILM, METHOD OF MANUFACTURING THE SAME, A...

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE

METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY, ELECTRONIC ASSEMBLY, A...

MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT

Apparatus and Methods for Processing Exfoliated Graphite Materials

PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...

MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...

Semiconductor structure and manufacturing method thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...

SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT AND METHOD OF MAKING

PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME

POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN

Semiconductor Device Package Thermally Coupled to Passive Element

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION

PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUF...

Kiosk Gift Card System and Method

MULTICHIP MODULE THERMAL MANAGEMENT THROUGH BACKSIDE METAL

THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING

PACKAGE SUBSTRATE MANUFACTURING METHOD