being removed electrolytically

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CPC
H05K3/07

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/07being removed electrolytically

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 11,641,716
- Issue date May 2, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kou Noguchi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electronic circuit production
- Patent number 11,266,023
- Issue date Mar 1, 2022
- DST Innovations Limited
- Anthony Miles
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Low cost substrates
- Patent number 10,283,484
- Issue date May 7, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing an electrical circuit board, electrical ci...
- Patent number 10,102,470
- Issue date Oct 16, 2018
- Linxens Holding
- Mara Coppola
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chemical mechanical planarization apparatus and methods
- Patent number 9,950,405
- Issue date Apr 24, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Wufeng Deng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode and method of forming the master electrode
- Patent number 9,441,309
- Issue date Sep 13, 2016
- Luxembourg Institute of Science and Technology (LIST)
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and electrode for defining and replicating structures in con...
- Patent number 8,741,113
- Issue date Jun 3, 2014
- Centre de Recherche Public—Gabriel Lippmann
- Patrik Möller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode and method of forming the master electrode
- Patent number 8,617,362
- Issue date Dec 31, 2013
- Centre de Recherche Public-Gabriel Lippmann
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photoresist-free metal deposition
- Patent number 8,500,985
- Issue date Aug 6, 2013
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and electrolytic etch...
- Patent number 8,366,903
- Issue date Feb 5, 2013
- Hitachi Via Mechanics
- Toshinori Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device suitable for electrochemically processing an object as well...
- Patent number 8,221,611
- Issue date Jul 17, 2012
- Elsyca N.V.
- Bart Juul Wilhelmina Van Den Bossche
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of monitoring a substrate patterning process
- Patent number 8,114,267
- Issue date Feb 14, 2012
- Acreo AB
- Staffan Nordlinder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct nanoscale patterning of metals using polymer electrolytes
- Patent number 7,998,330
- Issue date Aug 16, 2011
- The Board of Trustees of the University of Illinois
- Nicholas X. Fang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photoresist-free metal deposition
- Patent number 7,947,163
- Issue date May 24, 2011
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and electrode for defining and replicating structures in con...
- Patent number 7,790,009
- Issue date Sep 7, 2010
- Replisaurus Technologies AB
- Patrik Möller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of etching copper on cards
- Patent number 7,767,074
- Issue date Aug 3, 2010
- Obducat AB
- Gust Bierings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-film assembly and method for producing said assembly
- Patent number 7,551,454
- Issue date Jun 23, 2009
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Wuchse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for making very low roughness copper foil
- Patent number 7,112,271
- Issue date Sep 26, 2006
- LG Cable Ltd.
- Cha Jae Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to remove copper without pattern density effect
- Patent number 6,995,089
- Issue date Feb 7, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for the electrolytic treatment of electrically co...
- Patent number 6,979,391
- Issue date Dec 27, 2005
- Atotech Deutschland GmbH
- Egon Hubel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for forming interconnects
- Patent number 6,811,658
- Issue date Nov 2, 2004
- Ebara Corporation
- Akihisa Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive interconnect structures and methods for forming conducti...
- Patent number 6,469,394
- Issue date Oct 22, 2002
- Fujitsu Limited
- Connie M. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for etching
- Patent number 6,423,207
- Issue date Jul 23, 2002
- Obducat AB
- Babak Heidari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for anisotropic etching of structures in conducting materials
- Patent number 6,245,213
- Issue date Jun 12, 2001
- Obducat AB
- Lennart Olsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Removal of metal skin from a copper-Invar-copper laminate
- Patent number 6,228,246
- Issue date May 8, 2001
- International Business Machines Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of removing and/or applying conductive material
- Patent number 6,217,787
- Issue date Apr 17, 2001
- Deutsche Thomson-Brandt GmbH
- Hans-Otto Haller
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of making microelectronic packages utilizing coining
- Patent number 6,184,140
- Issue date Feb 6, 2001
- Tessera, Inc.
- Marcus J. Millet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrochemical treatment, especially for polishing
- Patent number 6,099,715
- Issue date Aug 8, 2000
- Fritz-Herbert Frembgen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of components by coining
- Patent number 6,083,837
- Issue date Jul 4, 2000
- Tessera, Inc.
- Marcus J. Millet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for the electrochemical treatment with treatment...
- Patent number 6,071,400
- Issue date Jun 6, 2000
- Atotech Deutschland GmbH
- Rolf Schroder
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Circuit Production
- Publication number 20190246503
- Publication date Aug 8, 2019
- DST Innovations Limited
- Anthony Miles
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Manufacturing an Electrical Circuit Board, Electrical Ci...
- Publication number 20170061273
- Publication date Mar 2, 2017
- Linxens Holding
- Mara COPPOLA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Circuit Production
- Publication number 20160242297
- Publication date Aug 18, 2016
- DST Innovations Limited
- Anthony Miles
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160095215
- Publication date Mar 31, 2016
- IBIDEN CO., LTD.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR PRINTED WIRING BOARDS
- Publication number 20150034369
- Publication date Feb 5, 2015
- Mitsubishi Gas Chemical Company, Inc.
- Naoki Kashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20150027977
- Publication date Jan 29, 2015
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Kohichi OHSUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCHING DEVICE FOR THE ELECTROLYTIC ETCHING OF COPPER
- Publication number 20140251797
- Publication date Sep 11, 2014
- Christoph Herkle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrode and Method of Forming the Master Electrode
- Publication number 20140110265
- Publication date Apr 24, 2014
- Centre de Recherche Public - Gabriel Lippmann
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTORESIST-FREE METAL DEPOSITION
- Publication number 20140014522
- Publication date Jan 16, 2014
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE
- Publication number 20120305390
- Publication date Dec 6, 2012
- Replisaurus Group SAS
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING A MULTILAYER STRUCTURE
- Publication number 20120279866
- Publication date Nov 8, 2012
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MASTER ELECTRODE AND METHOD OF FORMING IT
- Publication number 20120267241
- Publication date Oct 25, 2012
- Replisaurus Technologies SAS
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND ELECTRODE FOR DEFINING AND REPLICATING STRUCTURES IN CON...
- Publication number 20120228128
- Publication date Sep 13, 2012
- Replisaurus Technologies SAS
- Patrik Möller
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and electrode for defining and replicating structures in con...
- Publication number 20110000784
- Publication date Jan 6, 2011
- REPLISAURUS TECHNOLOGIES AB
- Patrik Möller
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal Deposition
- Publication number 20100044079
- Publication date Feb 25, 2010
- Lex Kosowsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal Deposition
- Publication number 20100044080
- Publication date Feb 25, 2010
- Lex Kosowsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE SUITABLE FOR ELECTROCHEMICALLY PROCESSING AN OBJECT AS WELL...
- Publication number 20090288954
- Publication date Nov 26, 2009
- Bart Juul Wilhelmina Van Den Bossche
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photoresist-free metal deposition
- Publication number 20090277801
- Publication date Nov 12, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Photoresist-free metal deposition
- Publication number 20090280243
- Publication date Nov 12, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrode and method of forming the electrode
- Publication number 20090229854
- Publication date Sep 17, 2009
- Replisaurus Technologies AB
- Mikael FREDENBERG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRODE AND METHOD OF FORMING THE ELECTRODE
- Publication number 20090229857
- Publication date Sep 17, 2009
- Replisaurus Technologies AB
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE
- Publication number 20090229855
- Publication date Sep 17, 2009
- Replisaurus Technologies AB
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Master Electrode and Method of Forming the Master Electrode
- Publication number 20090229856
- Publication date Sep 17, 2009
- REPLISAURUS TECHNOLOGIES AB
- Mikael FREDENBERG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Forming a Multilayer Structure
- Publication number 20090218233
- Publication date Sep 3, 2009
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING A MULTILAYER STRUCTURE
- Publication number 20090205967
- Publication date Aug 20, 2009
- Replisaurus Technologies AB
- Mikael FREDENBERG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING A MULTILAYER STRUCTURE
- Publication number 20090183992
- Publication date Jul 23, 2009
- Replisaurus Technologies AB
- Mikael FREDENBERG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY
- Publication number 20090184090
- Publication date Jul 23, 2009
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Markus WUCHSE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed wiring board and electrolytic etch...
- Publication number 20090084684
- Publication date Apr 2, 2009
- Toshinori Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASTER ELECTRODE AND METHOD OF FORMING IT
- Publication number 20090071837
- Publication date Mar 19, 2009
- Mikael Fredenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Direct Nanoscale Patterning of Metals Using Polymer Electrolytes
- Publication number 20090050487
- Publication date Feb 26, 2009
- Nicholas X. FANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

being removed electrolytically

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing printed circuit board

Electronic circuit production

Low cost substrates

Method for manufacturing an electrical circuit board, electrical ci...

Chemical mechanical planarization apparatus and methods

Electrode and method of forming the master electrode

Method and electrode for defining and replicating structures in con...

Electrode and method of forming the master electrode

Photoresist-free metal deposition

Method for manufacturing printed wiring board and electrolytic etch...

Device suitable for electrochemically processing an object as well...

Method of monitoring a substrate patterning process

Direct nanoscale patterning of metals using polymer electrolytes

Photoresist-free metal deposition

Method and electrode for defining and replicating structures in con...

Method of etching copper on cards

Thin-film assembly and method for producing said assembly

Method and apparatus for making very low roughness copper foil

Method to remove copper without pattern density effect

Method and device for the electrolytic treatment of electrically co...

Apparatus for forming interconnects

Conductive interconnect structures and methods for forming conducti...

Method and apparatus for etching

Method for anisotropic etching of structures in conducting materials

Removal of metal skin from a copper-Invar-copper laminate

Method of removing and/or applying conductive material

Methods of making microelectronic packages utilizing coining

Method for electrochemical treatment, especially for polishing

Fabrication of components by coining

Method and device for the electrochemical treatment with treatment...

Patents Applicationslast 30 patents

Electronic Circuit Production

Method for Manufacturing an Electrical Circuit Board, Electrical Ci...

Electronic Circuit Production

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

RESIN COMPOSITION FOR PRINTED WIRING BOARDS

METHOD OF MANUFACTURING WIRING BOARD

ETCHING DEVICE FOR THE ELECTROLYTIC ETCHING OF COPPER

Electrode and Method of Forming the Master Electrode

PHOTORESIST-FREE METAL DEPOSITION

ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE

METHOD OF FORMING A MULTILAYER STRUCTURE

MASTER ELECTRODE AND METHOD OF FORMING IT

METHOD AND ELECTRODE FOR DEFINING AND REPLICATING STRUCTURES IN CON...

Method and electrode for defining and replicating structures in con...

Metal Deposition

Metal Deposition

DEVICE SUITABLE FOR ELECTROCHEMICALLY PROCESSING AN OBJECT AS WELL...

Photoresist-free metal deposition

Photoresist-free metal deposition

Electrode and method of forming the electrode

ELECTRODE AND METHOD OF FORMING THE ELECTRODE

ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE

Master Electrode and Method of Forming the Master Electrode

Method of Forming a Multilayer Structure

METHOD OF FORMING A MULTILAYER STRUCTURE

METHOD OF FORMING A MULTILAYER STRUCTURE

THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY

Method for manufacturing printed wiring board and electrolytic etch...

MASTER ELECTRODE AND METHOD OF FORMING IT

Direct Nanoscale Patterning of Metals Using Polymer Electrolytes