between different workstations

Industry

CPC
H01L21/67703

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67703between different workstations

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Atomic layer etching for smoothing of arbitrary surfaces
- Patent number 12,217,968
- Issue date Feb 4, 2025
- California Institute of Technology
- Harold Frank Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having closed loop IR camera heat detection system and me...
- Patent number 12,205,835
- Issue date Jan 21, 2025
- Illinois Tool Works Inc.
- Eric Wayne Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airborne contaminant management method and system
- Patent number 12,202,015
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Ming Tsao
- B08 - CLEANING
Information Patent Grant
Enclosure system having walls comprising sidewalls and radio-freque...
- Patent number 12,159,795
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- John C. Menk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer processing tools and methods thereof
- Patent number 12,142,513
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Jagan Rangarajan
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing apparatus and wafer transfer method
- Patent number 12,099,309
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xueyu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer transfer device and wafer transfer method of semiconductor ma...
- Patent number 12,080,579
- Issue date Sep 3, 2024
- SCIENTECH CORPORATION
- Wen-Ping Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system, substrate processing method, and contr...
- Patent number 12,062,559
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Takafumi Matsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing chamber architecture for higher throughput...
- Patent number 12,062,526
- Issue date Aug 13, 2024
- Applied Materials, Inc.
- Viren Kalsekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming silicon nitride films using microwave plasma
- Patent number 11,955,331
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Hanhong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for processing a substrate
- Patent number 11,935,772
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Seohyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of fabricating semiconduc...
- Patent number 11,927,890
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Seok Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for poling polymer thin films
- Patent number 11,929,274
- Issue date Mar 12, 2024
- CREESENSE MICROSYSTEMS INC.
- Hongwei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-flip semiconductor die sorter tool
- Patent number 11,915,954
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece inspection apparatus
- Patent number 11,915,955
- Issue date Feb 27, 2024
- TAKAOKA TOKO CO., LTD.
- Mitsuhiro Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular pressurized workstation
- Patent number 11,901,206
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device maintenance in semiconductor manufacturing environment
- Patent number 11,850,692
- Issue date Dec 26, 2023
- TAIWAN SEMICONDUCTORMANUFACTURING COMPANY LIMITED
- Vincent Chien
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for poling polymer thin films
- Patent number 11,830,748
- Issue date Nov 28, 2023
- CREESENSE MICROSYSTEMS INC.
- Hongwei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device maintenance in semiconductor manufacturing environment
- Patent number 11,819,965
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Vincent Chien
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer unit, and apparatus and method for treating substrate
- Patent number 11,804,386
- Issue date Oct 31, 2023
- Semes Co., Ltd.
- Young Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing tools and methods thereof
- Patent number 11,749,552
- Issue date Sep 5, 2023
- Applied Materials, Inc.
- Jagan Rangarajan
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing system and method for supplying processing fluid
- Patent number 11,735,439
- Issue date Aug 22, 2023
- Tokyo Electron Limited
- Yasuo Kiyohara
- B08 - CLEANING
Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,640,916
- Issue date May 2, 2023
- SCREEN Holdings Co., Ltd.
- Takahiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 11,630,392
- Issue date Apr 18, 2023
- Tokyo Electron Limited
- Tsunenaga Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform and method of operating for integrated end-to-end fully se...
- Patent number 11,594,451
- Issue date Feb 28, 2023
- Tokyo Electron Limited
- Robert Clark
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Modular pressurized workstation
- Patent number 11,587,811
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark evaluation method and alignment mark evaluation system
- Patent number 11,586,118
- Issue date Feb 21, 2023
- GHANGXIN MEMORY TECHNOLOGIES, INC.
- Liyuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Orientation chamber of substrate processing system with purging fun...
- Patent number 11,581,181
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hua Houng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-flip semiconductor die sorter tool
- Patent number 11,569,105
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE
- Publication number 20250022826
- Publication date Jan 16, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...
- Publication number 20250014928
- Publication date Jan 9, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240383093
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chien HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER APPARATUS
- Publication number 20240310740
- Publication date Sep 19, 2024
- TOKYO ELECTRON LIMITED
- Kenichirou MATSUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF FABRICATING SEMICONDUC...
- Publication number 20240248418
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Seok HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL
- Publication number 20240162064
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung HUANG
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Application
MODULAR PRESSURIZED WORKSTATION
- Publication number 20240136213
- Publication date Apr 25, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chun-Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING T...
- Publication number 20240112933
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Jeonghee Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MAINTENANCE IN SEMICONDUCTOR MANUFACTURING ENVIRONMENT
- Publication number 20240082964
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Vincent Chien
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR MANUFACTURING A BONDED SEMICONDUCTOR STRUCTURE AND ME...
- Publication number 20240047242
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANNEALING APPARATUS AND METHOD OF OPERATING THE SAME
- Publication number 20230377914
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-FAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING TOOLS AND METHODS THEREOF
- Publication number 20230352337
- Publication date Nov 2, 2023
- Applied Materials, Inc.
- Jagan Rangarajan
- B24 - GRINDING POLISHING
Information Patent Application
Method and Apparatus for Poling Polymer Thin Films
- Publication number 20230352329
- Publication date Nov 2, 2023
- Creesense Microsystems Inc.
- Hongwei Lu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20230307277
- Publication date Sep 28, 2023
- SCREEN Holdings Co., Ltd.
- Takahiro YAMAGUCHI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING A GAS CURTAIN OF PURGE GAS IN A...
- Publication number 20230287566
- Publication date Sep 14, 2023
- Siltronic AG
- Patrick MOOS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EXCLUSION RING FOR SUBSTRATE PROCESSING
- Publication number 20230260814
- Publication date Aug 17, 2023
- LAM RESEARCH CORPORATION
- Vinayakaraddy Gulabal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MODULAR PRESSURIZED WORKSTATION
- Publication number 20230178401
- Publication date Jun 8, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chun-Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL
- Publication number 20230170234
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung HUANG
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Application
JIGS AND METHODS OF TEACHING SUBSTRATE HANDLING IN SEMICONDUCTOR PR...
- Publication number 20230105844
- Publication date Apr 6, 2023
- ASM IP HOLDING, B.V.
- Dongyang Chen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
PROCESS TOOL AND METHOD FOR HANDLING SEMICONDUCTOR SUBSTRATE
- Publication number 20230069085
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Fung-Chih HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANNEALING APPARATUS AND METHOD OF OPERATING THE SAME
- Publication number 20230060692
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-FAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER TRANSFER METHOD
- Publication number 20230057774
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xueyu LIANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20230008278
- Publication date Jan 12, 2023
- TOKYO ELECTRON LIMITED
- Shuhei Goto
- B08 - CLEANING
Information Patent Application
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TRANSFER ROBOT
- Publication number 20220367221
- Publication date Nov 17, 2022
- SEMES CO., LTD.
- Do Hyeon YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MAINTENANCE IN SEMICONDUCTOR MANUFACTURING ENVIRONMENT
- Publication number 20220355425
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Vincent Chien
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220310386
- Publication date Sep 29, 2022
- Kokusai Electric Corporation
- Toshiyuki KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL SYSTEM FOR WAFER TRANSPORT VEHICLE AND METHOD FOR OPERATING...
- Publication number 20220310430
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- KAI PING CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRBORNE CONTAMINANT MANAGEMENT METHOD AND SYSTEM
- Publication number 20220297170
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Ming TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCLOSURE SYSTEM STRUCTURE
- Publication number 20220285180
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- John C. Menk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220199440
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- Seohyun Kim
- H01 - BASIC ELECTRIC ELEMENTS

between different workstations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Atomic layer etching for smoothing of arbitrary surfaces

Apparatus having closed loop IR camera heat detection system and me...

Airborne contaminant management method and system

Enclosure system having walls comprising sidewalls and radio-freque...

Wafer processing tools and methods thereof

Wafer processing apparatus and wafer transfer method

Wafer transfer device and wafer transfer method of semiconductor ma...

Substrate processing system, substrate processing method, and contr...

Semiconductor processing chamber architecture for higher throughput...

Method of forming silicon nitride films using microwave plasma

Apparatus for processing a substrate

Substrate processing apparatus and method of fabricating semiconduc...

Method and apparatus for poling polymer thin films

Multi-flip semiconductor die sorter tool

Workpiece inspection apparatus

Modular pressurized workstation

Device maintenance in semiconductor manufacturing environment

Method and apparatus for poling polymer thin films

Device maintenance in semiconductor manufacturing environment

Transfer unit, and apparatus and method for treating substrate

Wafer processing tools and methods thereof

Substrate processing system and method for supplying processing fluid

Flat lead package formation method

Substrate processing apparatus and substrate processing method

Substrate processing apparatus

Platform and method of operating for integrated end-to-end fully se...

Modular pressurized workstation

Alignment mark evaluation method and alignment mark evaluation system

Orientation chamber of substrate processing system with purging fun...

Multi-flip semiconductor die sorter tool

Patents Applicationslast 30 patents

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER APPARATUS

SUBSTRATE PROCESSING APPARATUS AND METHOD OF FABRICATING SEMICONDUC...

MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL

MODULAR PRESSURIZED WORKSTATION

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING T...

DEVICE MAINTENANCE IN SEMICONDUCTOR MANUFACTURING ENVIRONMENT

APPARATUS FOR MANUFACTURING A BONDED SEMICONDUCTOR STRUCTURE AND ME...

ANNEALING APPARATUS AND METHOD OF OPERATING THE SAME

WAFER PROCESSING TOOLS AND METHODS THEREOF

Method and Apparatus for Poling Polymer Thin Films

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHOD AND APPARATUS FOR PRODUCING A GAS CURTAIN OF PURGE GAS IN A...

EXCLUSION RING FOR SUBSTRATE PROCESSING

MODULAR PRESSURIZED WORKSTATION

MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL

JIGS AND METHODS OF TEACHING SUBSTRATE HANDLING IN SEMICONDUCTOR PR...

PROCESS TOOL AND METHOD FOR HANDLING SEMICONDUCTOR SUBSTRATE

ANNEALING APPARATUS AND METHOD OF OPERATING THE SAME

WAFER PROCESSING APPARATUS AND WAFER TRANSFER METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE TREATING APPARATUS AND SUBSTRATE TRANSFER ROBOT

DEVICE MAINTENANCE IN SEMICONDUCTOR MANUFACTURING ENVIRONMENT

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CONTROL SYSTEM FOR WAFER TRANSPORT VEHICLE AND METHOD FOR OPERATING...

AIRBORNE CONTAMINANT MANAGEMENT METHOD AND SYSTEM

ENCLOSURE SYSTEM STRUCTURE

APPARATUS FOR PROCESSING A SUBSTRATE