Bevelled, chamferred or tapered edge

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CPC
H05K2201/09154

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09154Bevelled, chamferred or tapered edge

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image forming apparatus including a printed circuit board connectab...
- Patent number 12,085,868
- Issue date Sep 10, 2024
- Canon Kabushiki Kaisha
- Shinsuke Serizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact multi-line connector
- Patent number 11,545,771
- Issue date Jan 3, 2023
- Technical Services for Electronics, Inc.
- Ryan Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric module with a planar transformer
- Patent number 11,476,030
- Issue date Oct 18, 2022
- Phoenix Contact GmbH & Co. KG
- Peter Scholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component, method of producing a mul...
- Patent number 11,375,620
- Issue date Jun 28, 2022
- Taiyo Yuden Co., Ltd.
- Takashi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate for electrical, more particularly electronic, com...
- Patent number 11,330,707
- Issue date May 10, 2022
- Rogers Germany GmbH
- Stefan Britting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cable end connector
- Patent number 11,289,840
- Issue date Mar 29, 2022
- BIZLINK INTERNATIONAL CORPORATION
- Hsin Tuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tool for shaping contact tab interconnects at a circuit card edge
- Patent number 11,245,238
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Timothy P. Younger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layer ceramic electronic component, method of producing a mul...
- Patent number 11,083,090
- Issue date Aug 3, 2021
- Taiyo Yuden Co., Ltd.
- Takashi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 10,959,322
- Issue date Mar 23, 2021
- Tyco Electronics Japan G.K.
- Kenta Sato
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed wiring board
- Patent number 10,856,406
- Issue date Dec 1, 2020
- Rohm Co., Ltd.
- Masashi Nagasato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,790,221
- Issue date Sep 29, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, diaphragm, electronic device, and electronic...
- Patent number 10,770,215
- Issue date Sep 8, 2020
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure and display device
- Patent number 10,756,121
- Issue date Aug 25, 2020
- Innolux Corporation
- Ming-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a surface mount technology (SMT) pad struc...
- Patent number 10,617,003
- Issue date Apr 7, 2020
- Dell Products, L.P.
- Vijendera Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opto-electric hybrid board and manufacturing method for same
- Patent number 10,606,002
- Issue date Mar 31, 2020
- Nitto Denko Corporation
- Yuichi Tsujita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,580,727
- Issue date Mar 3, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, optical semiconductor element package, and optical se...
- Patent number 10,512,155
- Issue date Dec 17, 2019
- KYOCERA Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module and method of sealing
- Patent number 10,352,551
- Issue date Jul 16, 2019
- SIGNIFY HOLDING B.V.
- Robert Van Asselt
- F21 - LIGHTING
Information Patent Grant
Circuit device and method of manufacturing the same
- Patent number 10,332,816
- Issue date Jun 25, 2019
- Semiconductor Components Industries, LLC
- Hideyuki Sakamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board
- Patent number 10,296,119
- Issue date May 21, 2019
- Hewlett-Packard Development Company, L.P.
- Cameron Hutchings
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through-hole electrode substrate and semiconductor device using thr...
- Patent number 10,256,176
- Issue date Apr 9, 2019
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board module
- Patent number 10,257,934
- Issue date Apr 9, 2019
- Shinko Electric Industries Co., Ltd.
- Kenichi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle accessory control arrangement
- Patent number 10,220,762
- Issue date Mar 5, 2019
- UUSI, LLC
- David W. Shank
- B60 - VEHICLES IN GENERAL
Information Patent Grant
High-frequency signal line and manufacturing method thereof
- Patent number 10,158,157
- Issue date Dec 18, 2018
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit having thinned insulating second port...
- Patent number 10,121,503
- Issue date Nov 6, 2018
- Nitto Denko Corporation
- Yuu Sugimoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrical vacuum-compatible feedthrough structure and detector ass...
- Patent number 10,056,239
- Issue date Aug 21, 2018
- PARTICLE PHYSICS INSIDE PRODUCTS B.V.
- Dirk-Jan Spaanderdam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS
- Publication number 20250063664
- Publication date Feb 20, 2025
- Teradyne, Inc.
- Daniel L. Engel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE FORMING APPARATUS
- Publication number 20240369951
- Publication date Nov 7, 2024
- Canon Kabushiki Kaisha
- SHINSUKE SERIZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240188221
- Publication date Jun 6, 2024
- AUO Corporation
- Chun-Yueh Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
- Publication number 20230380062
- Publication date Nov 23, 2023
- Corning Incorporated
- DHANANJAY JOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE, IN PARTICULAR INVERTER OR CONVERTER
- Publication number 20220377892
- Publication date Nov 24, 2022
- SEW-EURODRIVE GMBH & CO. KG
- Werner GROß
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER SUBSTRATE FOR ELECTRICAL, MORE PARTICULARLY ELECTRONIC, COM...
- Publication number 20210410282
- Publication date Dec 30, 2021
- Rogers Germany GmbH
- Stefan Britting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING A MUL...
- Publication number 20210329786
- Publication date Oct 21, 2021
- Taiyo Yuden Co., Ltd.
- Takashi SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND CONNECTOR COMPRISING THE SAME
- Publication number 20210175650
- Publication date Jun 10, 2021
- Bizlink International Corporation
- Hsin Tuan HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC MODULE WITH A PLANAR TRANSFORMER
- Publication number 20200203053
- Publication date Jun 25, 2020
- Phoenix Contact GmbH & Co. KG
- Peter Scholz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECIPROCAL PCB MANUFACTURING PROCESS
- Publication number 20200120808
- Publication date Apr 16, 2020
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNT TECHNOLOGY (SMT) PAD DESIGN FOR NEXT GENERATION SPEEDS
- Publication number 20190289714
- Publication date Sep 19, 2019
- DELL PRODUCTS, L.P.
- VIJENDERA KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190267300
- Publication date Aug 29, 2019
- Semiconductor Components Industries, LLC
- Hideyuki Sakamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT BOARD MODULE
- Publication number 20180317321
- Publication date Nov 1, 2018
- Shinko Electric Industries Co., Ltd.
- Kenichi MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICLE ACCESSORY CONTROL ARRANGEMENT
- Publication number 20180065538
- Publication date Mar 8, 2018
- UUSI, LLC
- David W. Shank
- B60 - VEHICLES IN GENERAL
Information Patent Application
LED MODULE AND METHOD OF SEALING
- Publication number 20180017247
- Publication date Jan 18, 2018
- PHILIPS LIGHTING HOLDING B.V.
- ROBERT VAN ASSELT
- F21 - LIGHTING
Information Patent Application
LED DEVICE
- Publication number 20170343204
- Publication date Nov 30, 2017
- Molex, LLC
- Yi-Tse HO
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DIE AND PACKAGE JIGSAW SUBMOUNT
- Publication number 20160163610
- Publication date Jun 9, 2016
- QUBEICON LTD.
- Shimon Podval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Display Device With Side Crack Protection Structure And Ma...
- Publication number 20160066409
- Publication date Mar 3, 2016
- LG Display Co., Ltd.
- SeYeoul Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE COMPONENTS FOR PACKAGING IC CHIPS AND ELECTRONIC DEVICE P...
- Publication number 20150334823
- Publication date Nov 19, 2015
- Dyi-Chung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRIP AND MANUFACTURIN...
- Publication number 20150319852
- Publication date Nov 5, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
CONNECTOR INSERTS AND RECEPTACLE TONGUES FORMED USING PRINTED CIRCU...
- Publication number 20150131245
- Publication date May 14, 2015
- Apple Inc.
- Mahmoud R. Amini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBSTRATE AND FANOUT LINE STRUCTURE OF THE ARRAY SUBSTRATE
- Publication number 20140291846
- Publication date Oct 2, 2014
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Li Chai
- G02 - OPTICS
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140268587
- Publication date Sep 18, 2014
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SOURCE MODULE AND LIGHTING DEVICE HAVING THE SAME
- Publication number 20140218909
- Publication date Aug 7, 2014
- Samsung Electronics Co., Ltd.
- Ariyoshi TETSUO
- F21 - LIGHTING
Information Patent Application
FLEXIBLE DISPLAY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140177182
- Publication date Jun 26, 2014
- LG Display Co., Ltd.
- Minsu CHO
- G02 - OPTICS
Information Patent Application
LIGHT EMITTING MODULE AND SURFACE LIGHTING DEVICE HAVING THE SAME
- Publication number 20140160754
- Publication date Jun 12, 2014
- Samsung Electronics Co., Ltd.
- Ki Un LEE
- F21 - LIGHTING
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20140144686
- Publication date May 29, 2014
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Devices With Components Mounted to Touch Sensor Substrates
- Publication number 20140111953
- Publication date Apr 24, 2014
- Apple Inc.
- Stephen R. McClure
- G06 - COMPUTING CALCULATING COUNTING

Bevelled, chamferred or tapered edge

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Beveled overburden for vias and method of making the same

Reciprocal PCB manufacturing process

Image forming apparatus including a printed circuit board connectab...

Through-hole electrode substrate

Compact multi-line connector

Electric module with a planar transformer

Multi-layer ceramic electronic component, method of producing a mul...

Through-hole electrode substrate

Carrier substrate for electrical, more particularly electronic, com...

Cable end connector

Tool for shaping contact tab interconnects at a circuit card edge

Multi-layer ceramic electronic component, method of producing a mul...

Printed circuit board

Printed wiring board

Through-hole electrode substrate

Electronic component, diaphragm, electronic device, and electronic...

Conductor structure and display device

Method for manufacturing a surface mount technology (SMT) pad struc...

Opto-electric hybrid board and manufacturing method for same

Through-hole electrode substrate

Wiring board, optical semiconductor element package, and optical se...

LED module and method of sealing

Circuit device and method of manufacturing the same

Printed circuit board

Through-hole electrode substrate and semiconductor device using thr...

Circuit board module

Vehicle accessory control arrangement

High-frequency signal line and manufacturing method thereof

Suspension board with circuit having thinned insulating second port...

Electrical vacuum-compatible feedthrough structure and detector ass...

Patents Applicationslast 30 patents

CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS

THROUGH-HOLE ELECTRODE SUBSTRATE

IMAGE FORMING APPARATUS

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREOF

BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME

ELECTRICAL DEVICE, IN PARTICULAR INVERTER OR CONVERTER

CARRIER SUBSTRATE FOR ELECTRICAL, MORE PARTICULARLY ELECTRONIC, COM...

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING A MUL...

CIRCUIT BOARD STRUCTURE AND CONNECTOR COMPRISING THE SAME

ELECTRIC MODULE WITH A PLANAR TRANSFORMER

RECIPROCAL PCB MANUFACTURING PROCESS

SURFACE MOUNT TECHNOLOGY (SMT) PAD DESIGN FOR NEXT GENERATION SPEEDS

CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD MODULE

VEHICLE ACCESSORY CONTROL ARRANGEMENT

LED MODULE AND METHOD OF SEALING

LED DEVICE

SEMICONDUCTOR DIE AND PACKAGE JIGSAW SUBMOUNT

Flexible Display Device With Side Crack Protection Structure And Ma...

SUBSTRATE COMPONENTS FOR PACKAGING IC CHIPS AND ELECTRONIC DEVICE P...

PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRIP AND MANUFACTURIN...

CONNECTOR INSERTS AND RECEPTACLE TONGUES FORMED USING PRINTED CIRCU...

ARRAY SUBSTRATE AND FANOUT LINE STRUCTURE OF THE ARRAY SUBSTRATE

MODULE AND METHOD OF MANUFACTURING THE SAME

LIGHT SOURCE MODULE AND LIGHTING DEVICE HAVING THE SAME

FLEXIBLE DISPLAY AND METHOD FOR MANUFACTURING THE SAME

LIGHT EMITTING MODULE AND SURFACE LIGHTING DEVICE HAVING THE SAME

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

Electronic Devices With Components Mounted to Touch Sensor Substrates