Bi as the principal constituent

Industry

CPC
B23K35/264

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting

Current Industry

B23K35/264Bi as the principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
SnIn solder alloys
- Patent number 12,240,060
- Issue date Mar 4, 2025
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature soldering solutions for polymer substrates, printed...
- Patent number 12,233,483
- Issue date Feb 25, 2025
- Alpha Assembly Solutions Inc.
- Rahul Raut
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder materials including supercooled micro-capsules and alloyed p...
- Patent number 12,208,471
- Issue date Jan 28, 2025
- THE INDIUM CORPORATION OF AMERICA
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Lead-free solder alloy composition suitable for use in high-tempera...
- Patent number 12,103,114
- Issue date Oct 1, 2024
- KYUNG DONG MTEC CO., LTD.
- Heung Rak Sohn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy and method of manufacturing electronic devic...
- Patent number 12,030,140
- Issue date Jul 9, 2024
- MK Electron Co., Ltd.
- Young Woo Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SnBi and SnIn solder alloys
- Patent number 11,999,018
- Issue date Jun 4, 2024
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
- Patent number 11,813,686
- Issue date Nov 14, 2023
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-temperature superconducting striated tape combinations
- Patent number 11,711,983
- Issue date Jul 25, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal member made of plurality of metal layers between two heat...
- Patent number 11,710,709
- Issue date Jul 25, 2023
- Denso Corporation
- Ryoichi Kaizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stable undercooled metallic particles for filling a void
- Patent number 11,685,977
- Issue date Jun 27, 2023
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder paste
- Patent number 11,633,815
- Issue date Apr 25, 2023
- Senju Metal Industry Co., Ltd.
- Toru Hayashida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste and mounting structure
- Patent number 11,618,110
- Issue date Apr 4, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Naomichi Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of high-temperature superconducting striated tape combi...
- Patent number 11,600,762
- Issue date Mar 7, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stable undercooled metallic particles for engineering at ambient co...
- Patent number 11,584,978
- Issue date Feb 21, 2023
- Iowa State University Research Foundation
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
SnBiSb series low-temperature lead-free solder and its preparation...
- Patent number 11,479,835
- Issue date Oct 25, 2022
- BEIJING COMPO ADVANCED TECHNOLOGY CO., LTD.
- Shaoming Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder ball, resin flux-cored solder an...
- Patent number 11,241,760
- Issue date Feb 8, 2022
- Senju Metal Industry Co., Ltd.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stable undercooled metallic particles for engineering at ambient co...
- Patent number 11,220,730
- Issue date Jan 11, 2022
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Low temperature solder in a photonic device
- Patent number 11,181,689
- Issue date Nov 23, 2021
- Cisco Technology, Inc.
- Sandeep Razdan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pathways within a wellbore using no-heat liquid solder
- Patent number 11,180,987
- Issue date Nov 23, 2021
- Halliburton Energy Services, Inc.
- William Cecil Pearl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, solder preform, solder paste and solder...
- Patent number 11,167,379
- Issue date Nov 9, 2021
- Senju Metal Industry Co., Ltd.
- Yuki Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of an alloy as a brazing alloy for an electric switch braze joi...
- Patent number 11,052,492
- Issue date Jul 6, 2021
- ABB Schweiz AG
- Moritz Boehm
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal paste and thermoelectric module
- Patent number 10,998,482
- Issue date May 4, 2021
- LG Chem, Ltd.
- Dae Ki Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid high temperature lead-free solder preform
- Patent number 10,888,958
- Issue date Jan 12, 2021
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing low alpha-ray emitting bismuth, and low alpha-r...
- Patent number 10,711,358
- Issue date Jul 14, 2020
- JX Nippon Mining & Metals Corporation
- Yu Hosokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preparation and application of Pb-free nanosolder
- Patent number 10,668,573
- Issue date Jun 2, 2020
- University of Massachusetts
- Zhiyong Gu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder compositions
- Patent number 10,661,393
- Issue date May 26, 2020
- Honeywell International Inc.
- Jianxing Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal paste and thermoelectric module
- Patent number 10,622,533
- Issue date Apr 14, 2020
- LG Chem, Ltd.
- Dae Ki Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal material for 3-dimensional printing, method for manufacturing...
- Patent number 10,563,292
- Issue date Feb 18, 2020
- Electronics and Telecommunications Research Institute
- Yong Suk Yang
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
SOLDER ALLOY, JOINED PART, JOINING MATERIAL, SOLDER PASTE, JOINED S...
- Publication number 20250018509
- Publication date Jan 16, 2025
- TAMURA CORPORATION
- Takanori SHIMAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES, SOLDER PARTICLE PRODUCTION METHOD, AND CONDUCTIVE...
- Publication number 20250001528
- Publication date Jan 2, 2025
- Dexerials Corporation
- Hidetsugu NAMIKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER PARTICLES, METHOD FOR PRODUCING SOLDER PARTICLES, AND CONDUC...
- Publication number 20240367270
- Publication date Nov 7, 2024
- Dexerials Corporation
- Hidetsugu NAMIKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20240269780
- Publication date Aug 15, 2024
- NITTO DENKO CORPORATION
- Masatoshi KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE
- Publication number 20240238915
- Publication date Jul 18, 2024
- NIHON SUPERIOR CO., LTD.
- Tetsuro NISHIMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING SHEET
- Publication number 20240139887
- Publication date May 2, 2024
- NITTO DENKO CORPORATION
- Ayumi NITTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME,...
- Publication number 20240100634
- Publication date Mar 28, 2024
- Research & Business Foundation Sungkyunkwan University
- Jaeseok JANG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER ALLOY, JOINT PORTION, JOINING MATERIAL, SOLDER PASTE, JOINT...
- Publication number 20240066638
- Publication date Feb 29, 2024
- TAMURA CORPORATION
- Takanori SHIMAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STABLE UNDERCOOLED METALLIC PARTICLES FOR FILLING A VOID
- Publication number 20230383388
- Publication date Nov 30, 2023
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LOW MELTING-POINT BONDING MEMBER, METHOD FOR PRODUCING SAME, SEMICO...
- Publication number 20230347453
- Publication date Nov 2, 2023
- SHINRYO CORPORATION
- Hirotoshi NISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTES AND METHODS OF USING THE SAME
- Publication number 20230241725
- Publication date Aug 3, 2023
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Materials Including Supercooled Micro-Capsules And Alloyed P...
- Publication number 20230182236
- Publication date Jun 15, 2023
- SAFI-Tech, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING SHEET
- Publication number 20230125153
- Publication date Apr 27, 2023
- NITTO DENKO CORPORATION
- Akiko TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX AND SOLDER PASTE
- Publication number 20230089879
- Publication date Mar 23, 2023
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SNIN SOLDER ALLOYS
- Publication number 20220362890
- Publication date Nov 17, 2022
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STABLE UNDERCOOLED METALLIC PARTICLES FOR ENGINEERING AT AMBIENT CO...
- Publication number 20220220592
- Publication date Jul 14, 2022
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Application
STABLE UNDERCOOLED METALLIC PARTICLES FOR ENGINEERING AT AMBIENT CO...
- Publication number 20220098709
- Publication date Mar 31, 2022
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...
- Publication number 20220088723
- Publication date Mar 24, 2022
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CORED WIRE ELECTRODE FOR HIGH DEPOSITION RATE WELDING PROCESSES
- Publication number 20210402501
- Publication date Dec 30, 2021
- Hobart Brothers LLC
- Joseph C. Bundy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE SOLDERING SOLUTIONS FOR POLYMER SUBSTRATES, PRINTED...
- Publication number 20210283727
- Publication date Sep 16, 2021
- Alpha Assembly Solutions Inc.
- Rahul RAUT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER POWDER, SOLDER PASTE, AND A SOLDER JOINT USING...
- Publication number 20210245305
- Publication date Aug 12, 2021
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233871
- Publication date Jul 29, 2021
- DENSO CORPORATION
- RYOICHI KAIZU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
- Publication number 20210229222
- Publication date Jul 29, 2021
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR COUPLING A WIRE TO CONDUCTIVE FABRIC WITH LOW-TEMPERATUR...
- Publication number 20210197322
- Publication date Jul 1, 2021
- Joyson Safety Systems Acquisition LLC
- Dwayne Van'tZelfde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE AND MOUNTING STRUCTURE
- Publication number 20210129273
- Publication date May 6, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- NAOMICHI OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE
- Publication number 20210114143
- Publication date Apr 22, 2021
- SENJU METAL INDUSTRY CO., LTD
- Toru HAYASHIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE
- Publication number 20210088722
- Publication date Mar 25, 2021
- Cisco Technology, Inc.
- Sandeep RAZDAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AN...
- Publication number 20200376608
- Publication date Dec 3, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro YOKOYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free Solder Alloy Composition Suitable for Use in High-Tempera...
- Publication number 20200238443
- Publication date Jul 30, 2020
- KYUNG DONG MTEC CO., LTD.
- Heung Rak SOHN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE AND THERMOELECTRIC MODULE
- Publication number 20200212280
- Publication date Jul 2, 2020
- LG CHEM, LTD.
- Dae Ki Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Bi as the principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SnIn solder alloys

Low temperature soldering solutions for polymer substrates, printed...

Solder materials including supercooled micro-capsules and alloyed p...

Lead-free solder alloy composition suitable for use in high-tempera...

Lead-free solder alloy and method of manufacturing electronic devic...

SnBi and SnIn solder alloys

Solder alloy, solder paste, solder ball, solder preform, solder joi...

High-temperature superconducting striated tape combinations

Terminal member made of plurality of metal layers between two heat...

Stable undercooled metallic particles for filling a void

Solder paste

Solder paste and mounting structure

Fabrication of high-temperature superconducting striated tape combi...

Stable undercooled metallic particles for engineering at ambient co...

SnBiSb series low-temperature lead-free solder and its preparation...

Alternative compositions for high temperature soldering applications

Solder alloy, solder paste, solder ball, resin flux-cored solder an...

Stable undercooled metallic particles for engineering at ambient co...

Low temperature solder in a photonic device

Conductive pathways within a wellbore using no-heat liquid solder

Solder alloy, solder ball, solder preform, solder paste and solder...

Use of an alloy as a brazing alloy for an electric switch braze joi...

Metal paste and thermoelectric module

Hybrid high temperature lead-free solder preform

Method of producing low alpha-ray emitting bismuth, and low alpha-r...

Preparation and application of Pb-free nanosolder

Lead-free solder compositions

Low-temperature bonding with spaced nanorods and eutectic alloys

Metal paste and thermoelectric module

Metal material for 3-dimensional printing, method for manufacturing...

Patents Applicationslast 30 patents

SOLDER ALLOY, JOINED PART, JOINING MATERIAL, SOLDER PASTE, JOINED S...

SOLDER PARTICLES, SOLDER PARTICLE PRODUCTION METHOD, AND CONDUCTIVE...

SOLDER PARTICLES, METHOD FOR PRODUCING SOLDER PARTICLES, AND CONDUC...

BONDING SHEET AND METHOD FOR PRODUCING SAME

LEAD-FREE SOLDER PASTE

BONDING SHEET

LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME,...

SOLDER ALLOY, JOINT PORTION, JOINING MATERIAL, SOLDER PASTE, JOINT...

STABLE UNDERCOOLED METALLIC PARTICLES FOR FILLING A VOID

LOW MELTING-POINT BONDING MEMBER, METHOD FOR PRODUCING SAME, SEMICO...

SOLDER PASTES AND METHODS OF USING THE SAME

Solder Materials Including Supercooled Micro-Capsules And Alloyed P...

BONDING SHEET

FLUX AND SOLDER PASTE

SNIN SOLDER ALLOYS

STABLE UNDERCOOLED METALLIC PARTICLES FOR ENGINEERING AT AMBIENT CO...

STABLE UNDERCOOLED METALLIC PARTICLES FOR ENGINEERING AT AMBIENT CO...

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOI...

METAL-CORED WIRE ELECTRODE FOR HIGH DEPOSITION RATE WELDING PROCESSES

LOW TEMPERATURE SOLDERING SOLUTIONS FOR POLYMER SUBSTRATES, PRINTED...

SOLDER ALLOY, SOLDER POWDER, SOLDER PASTE, AND A SOLDER JOINT USING...

SEMICONDUCTOR DEVICE

SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES

METHOD FOR COUPLING A WIRE TO CONDUCTIVE FABRIC WITH LOW-TEMPERATUR...

SOLDER PASTE AND MOUNTING STRUCTURE

SOLDER PASTE

LOW TEMPERATURE SOLDER IN A PHOTONIC DEVICE

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AN...

Lead-Free Solder Alloy Composition Suitable for Use in High-Tempera...

METAL PASTE AND THERMOELECTRIC MODULE