Binding insulating layers without adhesive

Industry

CPC
H05K2203/065

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/065Binding insulating layers without adhesive

Industries

Patents Grantslast 30 patents

Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate and method for manufacturing resin substrate
- Patent number 11,659,652
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing mini smart card
- Patent number 11,526,718
- Issue date Dec 13, 2022
- BEAUTIFUL CARD CORPORATION
- Meng-Jen Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 11,452,216
- Issue date Sep 20, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Embedded circuit board and method of manufacturing same
- Patent number 11,452,211
- Issue date Sep 20, 2022
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for manufacturing flexible laminated circuit boards
- Patent number 11,229,126
- Issue date Jan 18, 2022
- Duetto Integrated Systems, Inc.
- Anthony Faraci
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implantable thin film devices
- Patent number 11,191,952
- Issue date Dec 7, 2021
- Pacesetter, Inc.
- John R. Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of flexible electronic device
- Patent number 11,191,166
- Issue date Nov 30, 2021
- E Ink Holdings Inc.
- Kuo-Feng Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Mini smart card and method of manufacturing the same
- Patent number 11,106,961
- Issue date Aug 31, 2021
- BEAUIIFUL CARD CORPORATION
- Meng-Jen Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate bonding structure
- Patent number 11,096,282
- Issue date Aug 17, 2021
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating of printed circuit board core during laminate cure
- Patent number 11,044,819
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Eric J. Campbell
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing a component embedded package carrier
- Patent number 10,798,822
- Issue date Oct 6, 2020
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for manufacturing flexible laminated circuit boards
- Patent number 10,638,615
- Issue date Apr 28, 2020
- Duetto Integrated Systems, Inc.
- Anthony Faraci
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable circuit board and method for manufacturing stretchable...
- Patent number 10,398,024
- Issue date Aug 27, 2019
- Nippon Mektron, Ltd.
- Masayuki Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of treating metal surfaces and devices formed thereby
- Patent number 10,375,835
- Issue date Aug 6, 2019
- Atotech Deutchland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of lamination of dielectric circuit materials using ultrason...
- Patent number 10,356,914
- Issue date Jul 16, 2019
- Raytheon Company
- Patrick J. Kocurek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating of printed circuit board core during laminate cure
- Patent number 10,285,283
- Issue date May 7, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component incorporating substrate and method for manufacturing comp...
- Patent number 9,854,682
- Issue date Dec 26, 2017
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of treating metal surfaces and devices formed thereby
- Patent number 9,763,336
- Issue date Sep 12, 2017
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for welding printed circuits
- Patent number 9,603,264
- Issue date Mar 21, 2017
- Cedal Equipment Srl
- Bruno Ceraso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for manufacturing laminated circuit boards
- Patent number 9,282,651
- Issue date Mar 8, 2016
- Duetto Integrated Systems, Inc.
- Anthony Faraci
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for manufacturing laminated circuit boards
- Patent number 8,831,918
- Issue date Sep 9, 2014
- Duetto Integrated Systems, Inc.
- Anthony Faraci
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for manufacturing laminated circuit boards
- Patent number 8,594,983
- Issue date Nov 26, 2013
- Duetto Integrated Systems, Inc.
- Anthony Faraci
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies without solder and methods for their manufacture
- Patent number 8,482,110
- Issue date Jul 9, 2013
- Occam Portfolio LLC
- Joseph C Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-coated polyimide film
- Patent number 8,293,331
- Issue date Oct 23, 2012
- Kaneka Corporation
- Hisayasu Kaneshiro
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-layer substrate and manufacturing method thereof
- Patent number 8,278,562
- Issue date Oct 2, 2012
- Princo Middle East FZE
- Chih-Kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multi-layer substrate
- Patent number 8,266,797
- Issue date Sep 18, 2012
- Princo Middle East FZE
- Chih-Kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of boards, mold-releasing sheet, manufacturing...
- Patent number 8,230,891
- Issue date Jul 31, 2012
- Panasonic Corporation
- Kunio Kishimoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Polyamideimide resin, as well as a colorless and transparent flexib...
- Patent number 8,222,365
- Issue date Jul 17, 2012
- Toyo Boseki Kabushiki Kaisha
- Katsuya Shimeno
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20240206060
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20240188228
- Publication date Jun 6, 2024
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20220304166
- Publication date Sep 22, 2022
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Sheets, Methods of Manufacture, and Articles Formed Ther...
- Publication number 20220159843
- Publication date May 19, 2022
- SHPP Global Technologies B.V.
- Shijie SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLANTABLE THIN FILM DEVICES
- Publication number 20220088375
- Publication date Mar 24, 2022
- PACESETTER, INC.
- John R. Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20220015238
- Publication date Jan 13, 2022
- SHENNAN CIRCUITS CO., LTD.
- LIXIANG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MINI SMART CARD
- Publication number 20210334616
- Publication date Oct 28, 2021
- BEAUTIFUL CARD CORPORATION
- MENG-JEN CHENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
- Publication number 20210161020
- Publication date May 27, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Kazuki MATSUMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MINI SMART CARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210110230
- Publication date Apr 15, 2021
- BEAUTIFUL CARD CORPORATION
- MENG-JEN CHENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FEEDTHROUGH FABRICATION METHOD AND METHOD OF FABRICATING ENCAPSULAT...
- Publication number 20200267846
- Publication date Aug 20, 2020
- TODOC CO., LTD.
- Kyou-Sik MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR MANUFACTURING FLEXIBLE LAMINATED CIRCUIT BOARDS
- Publication number 20200214146
- Publication date Jul 2, 2020
- DUETTO INTEGRATED SYSTEMS, INC.
- Anthony FARACI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE
- Publication number 20190200463
- Publication date Jun 27, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20180352658
- Publication date Dec 6, 2018
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF FLEXIBLE ELECTRONIC DEVICE
- Publication number 20180213649
- Publication date Jul 26, 2018
- E Ink Holdings Inc.
- Kuo-Feng Chen
- B32 - LAYERED PRODUCTS
Information Patent Application
STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE...
- Publication number 20180116049
- Publication date Apr 26, 2018
- NIPPON MEKTRON, LTD.
- Masayuki Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE
- Publication number 20170354043
- Publication date Dec 7, 2017
- International Business Machines Corporation
- Eric J. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT INCORPORATING SUBSTRATE AND METHOD FOR MANUFACTURING COMP...
- Publication number 20170094798
- Publication date Mar 30, 2017
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY
- Publication number 20160360623
- Publication date Dec 8, 2016
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CROSSLINKED FLUOROPOLYMER CIRCUIT MATERIALS, CIRCUIT LAMINATES, AND...
- Publication number 20150296614
- Publication date Oct 15, 2015
- Rogers Corporation
- Shawn Paul Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS
- Publication number 20140332162
- Publication date Nov 13, 2014
- DUETTO INTEGRATED SYSTEMS, INC.
- ANTHONY FARACI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR MANUFACTURING LAMINTED CIRCUIT BOARDS
- Publication number 20140034244
- Publication date Feb 6, 2014
- DUETTO INTEGRATED SYSTEMS, INC.
- ANTHONY FARACI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR WELDING PRINTED CIRCUITS
- Publication number 20130220995
- Publication date Aug 29, 2013
- CEDAL EQUIPMENT SRL
- Bruno Ceraso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS
- Publication number 20120174387
- Publication date Jul 12, 2012
- Anthony Faraci
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-COATED POLYIMIDE FILM
- Publication number 20120156388
- Publication date Jun 21, 2012
- Kaneka Corporation
- Hisayasu Kaneshiro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LINEAR POLYIMIDE PRECURSOR, LINEAR POLYIMIDE AND HEAT-CURED PRODUCT...
- Publication number 20120088109
- Publication date Apr 12, 2012
- JFE CHEMICAL CORPORATION
- Masatoshi Hasegawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electronic Assemblies Without Solder and Methods for their Manufacture
- Publication number 20120006589
- Publication date Jan 12, 2012
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110198782
- Publication date Aug 18, 2011
- PRINCO CORP.
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING COMPONENT-EMBEDDED MODULE
- Publication number 20110100549
- Publication date May 5, 2011
- Murata Manufacturing Co., Ltd.
- Shunsuke CHISAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Building Multilayer Circuits
- Publication number 20100300734
- Publication date Dec 2, 2010
- Raytheon Company
- Billy D. Ables
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100088887
- Publication date Apr 15, 2010
- Sanyo Electric Co., Ltd.
- Makoto Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Binding insulating layers without adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin multilayer substrate and method for manufacturing resin multi...

Method for manufacturing printed wiring board

Resin substrate and method for manufacturing resin substrate

Method of manufacturing mini smart card

Method for manufacturing multilayer printed wiring board

Embedded circuit board and method of manufacturing same

System and method for manufacturing flexible laminated circuit boards

Implantable thin film devices

Fabrication method of flexible electronic device

Mini smart card and method of manufacturing the same

Substrate bonding structure

Heating of printed circuit board core during laminate cure

Method of manufacturing a component embedded package carrier

System and method for manufacturing flexible laminated circuit boards

Stretchable circuit board and method for manufacturing stretchable...

Methods of treating metal surfaces and devices formed thereby

Method of lamination of dielectric circuit materials using ultrason...

Heating of printed circuit board core during laminate cure

Component incorporating substrate and method for manufacturing comp...

Methods of treating metal surfaces and devices formed thereby

Method and apparatus for welding printed circuits

System for manufacturing laminated circuit boards

System for manufacturing laminated circuit boards

System for manufacturing laminated circuit boards

Electronic assemblies without solder and methods for their manufacture

Metal-coated polyimide film

Multi-layer substrate and manufacturing method thereof

Method of manufacturing a multi-layer substrate

Manufacturing method of boards, mold-releasing sheet, manufacturing...

Polyamideimide resin, as well as a colorless and transparent flexib...

Patents Applicationslast 30 patents

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

Multilayer Sheets, Methods of Manufacture, and Articles Formed Ther...

IMPLANTABLE THIN FILM DEVICES

EMBEDDED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME

METHOD OF MANUFACTURING MINI SMART CARD

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

MINI SMART CARD AND METHOD OF MANUFACTURING THE SAME

FEEDTHROUGH FABRICATION METHOD AND METHOD OF FABRICATING ENCAPSULAT...

SYSTEM AND METHOD FOR MANUFACTURING FLEXIBLE LAMINATED CIRCUIT BOARDS

HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE

COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

FABRICATION METHOD OF FLEXIBLE ELECTRONIC DEVICE

STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE...

HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE

COMPONENT INCORPORATING SUBSTRATE AND METHOD FOR MANUFACTURING COMP...

METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY

CROSSLINKED FLUOROPOLYMER CIRCUIT MATERIALS, CIRCUIT LAMINATES, AND...

SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS

SYSTEM FOR MANUFACTURING LAMINTED CIRCUIT BOARDS

METHOD AND APPARATUS FOR WELDING PRINTED CIRCUITS

SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS

METAL-COATED POLYIMIDE FILM

LINEAR POLYIMIDE PRECURSOR, LINEAR POLYIMIDE AND HEAT-CURED PRODUCT...

Electronic Assemblies Without Solder and Methods for their Manufacture

MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING COMPONENT-EMBEDDED MODULE

Method and Apparatus for Building Multilayer Circuits

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME