Bipolar transistors in combination with diodes, or capacitors, or resistors

Industry

CPC
H01L27/0647

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0647Bipolar transistors in combination with diodes, or capacitors, or resistors

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices comprising failure detectors for detecting fa...
- Patent number 12,181,512
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Donghun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,323
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,894,426
- Issue date Feb 6, 2024
- Fuji Electric Co., Ltd.
- Takahiro Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction bipolar transistor with buried trap rich isolation r...
- Patent number 11,791,334
- Issue date Oct 17, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Vibhor Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier apparatus
- Patent number 11,616,479
- Issue date Mar 28, 2023
- Murata Manufacturing Co., Ltd.
- Toshikazu Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct substrate to solder bump connection for thermal management i...
- Patent number 11,515,845
- Issue date Nov 29, 2022
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,302,659
- Issue date Apr 12, 2022
- Murata Manufacturing Co., Ltd.
- Hisanori Namie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a semiconductor body or an isolation st...
- Patent number 11,251,263
- Issue date Feb 15, 2022
- Semiconductor Components Industries, LLC
- Moshe Agam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with passive electrical component and method...
- Patent number 11,217,504
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge handling for sense IGBT using Zener diode
- Patent number 11,201,144
- Issue date Dec 14, 2021
- Semiconductor Components Industries, LLC
- Hye-Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with carrier lifetime control
- Patent number 11,195,908
- Issue date Dec 7, 2021
- Fuji Electric Co., Ltd.
- Tatsuya Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,158,630
- Issue date Oct 26, 2021
- Mitsubishi Electric Corporation
- Tetsuo Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor arrangement comprising semic...
- Patent number 11,133,303
- Issue date Sep 28, 2021
- Infineon Technologies AG
- Christian Robert Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode linearizer
- Patent number 11,031,914
- Issue date Jun 8, 2021
- Mitsubishi Electric Corporation
- Ko Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,924,071
- Issue date Feb 16, 2021
- Murata Manufacturing Co., Ltd.
- Satoshi Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,840,236
- Issue date Nov 17, 2020
- Murata Manufacturing Co., Ltd.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,825,785
- Issue date Nov 3, 2020
- Murata Manufacturing Co., Ltd.
- Hisanori Namie
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Direct substrate to solder bump connection for thermal management i...
- Patent number 10,790,788
- Issue date Sep 29, 2020
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SCRs with checker board layouts
- Patent number 10,790,274
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ti Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device including an edge termination structur...
- Patent number 10,734,476
- Issue date Aug 4, 2020
- STMicroelectronics S.r.l.
- Fernando Giovanni Menta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for automotive and communication systems transceiver inte...
- Patent number 10,700,056
- Issue date Jun 30, 2020
- Analog Devices, Inc.
- James Zhao
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Driver for driving a capacitive load
- Patent number 10,658,357
- Issue date May 19, 2020
- Texas Instruments Incorporated
- Pranav Kumar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
E-fuse cells
- Patent number 10,651,166
- Issue date May 12, 2020
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Handoko Linewih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,637,413
- Issue date Apr 28, 2020
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Three-level I-type inverter and semiconductor module
- Patent number 10,541,624
- Issue date Jan 21, 2020
- Mitsubishi Electric Corporation
- Masaaki Ishino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flip chip amplifier for wireless device
- Patent number 10,447,210
- Issue date Oct 15, 2019
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device, manufacturing method therefor and semiconduct...
- Patent number 10,438,947
- Issue date Oct 8, 2019
- Mitsubishi Electric Corporation
- Kazuhiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient voltage suppression device
- Patent number 10,388,647
- Issue date Aug 20, 2019
- Amazing Microelectronic Corp.
- Kun-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic protection circuit, semiconductor integrated circuit...
- Patent number 10,389,111
- Issue date Aug 20, 2019
- Seiko Epson Corporation
- Masuhide Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for on-chip mechanical stress sensing
- Patent number 10,352,792
- Issue date Jul 16, 2019
- Texas Instruments Incorporated
- Umidjon Nurmetov
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421234
- Publication date Dec 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Fumitoshi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR STRUCTURE AND FABRICATING METHOD OF THE SAME
- Publication number 20240213304
- Publication date Jun 27, 2024
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240162294
- Publication date May 16, 2024
- Fuji Electric Co., Ltd.
- Takahiro TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROJUNCTION BIPOLAR TRANSISTOR WITH BURIED TRAP RICH ISOLATION R...
- Publication number 20230402453
- Publication date Dec 14, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Vibhor JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING FAILURE DETECTORS FOR DETECTING FA...
- Publication number 20230296661
- Publication date Sep 21, 2023
- Samsung Electronics Co., Ltd.
- Donghun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
- Publication number 20230155555
- Publication date May 18, 2023
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROJUNCTION BIPOLAR TRANSISTOR WITH BURIED TRAP RICH ISOLATION R...
- Publication number 20220122968
- Publication date Apr 21, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Vibhor JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220059527
- Publication date Feb 24, 2022
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20220013635
- Publication date Jan 13, 2022
- Fuji Electric Co., Ltd.
- Takahiro TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
- Publication number 20210119584
- Publication date Apr 22, 2021
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE HANDLING FOR SENSE IGBT USING ZENER DIODE
- Publication number 20210111171
- Publication date Apr 15, 2021
- Semiconductor Components Industries, LLC
- Hye-Mi KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210013165
- Publication date Jan 14, 2021
- MURATA MANUFACTURING CO., LTD.
- Hisanori NAMIE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor Device and Semiconductor Arrangement Comprising Semic...
- Publication number 20200388612
- Publication date Dec 10, 2020
- Christian Robert Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER APPARATUS
- Publication number 20200321927
- Publication date Oct 8, 2020
- MURATA MANUFACTURING CO., LTD.
- Toshikazu TERASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device Including a Semiconductor Body or an Isolation St...
- Publication number 20200295126
- Publication date Sep 17, 2020
- Semiconductor Components Industries, LLC
- Moshe AGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200135717
- Publication date Apr 30, 2020
- Mitsubishi Electric Corporation
- Tetsuo TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AUTOMOTIVE AND COMMUNICATION SYSTEMS TRANSCEIVER INTE...
- Publication number 20200083212
- Publication date Mar 12, 2020
- Analog Devices, Inc.
- James Zhao
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200058735
- Publication date Feb 20, 2020
- Fuji Electric Co., Ltd.
- Tatsuya NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Passive Electrical Component and Method...
- Publication number 20200035581
- Publication date Jan 30, 2020
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200021255
- Publication date Jan 16, 2020
- Murata Manufacturing Co., Ltd.
- Satoshi GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PLACEMENT OF RESISTOR AND OTHER DEVICES TO IMPROVE AREA & PERFOR...
- Publication number 20190304905
- Publication date Oct 3, 2019
- QUALCOMM Incorporated
- Tin Tin WEE
- G05 - CONTROLLING REGULATING
Information Patent Application
THREE-LEVEL I-TYPE INVERTER AND SEMICONDUCTOR MODULE
- Publication number 20190267912
- Publication date Aug 29, 2019
- Mitsubishi Electric Corporation
- Masaaki ISHINO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DRIVER FOR DRIVING A CAPACITIVE LOAD
- Publication number 20190252373
- Publication date Aug 15, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Pranav KUMAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS FOR THERMAL MANAGEMENT IN AMPLIFIERS
- Publication number 20190199294
- Publication date Jun 27, 2019
- SKYWORKS SOLUTIONS, INC.
- Michael Joseph McPartlin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED ELECTRONIC DEVICE INCLUDING AN EDGE TERMINATION STRUCTUR...
- Publication number 20190148483
- Publication date May 16, 2019
- STMicroelectronics S.r.l.
- Fernando Giovanni Menta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190123003
- Publication date Apr 25, 2019
- MURATA MANUFACTURING CO., LTD.
- Hisanori NAMIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP AMPLIFIER FOR WIRELESS DEVICE
- Publication number 20190123693
- Publication date Apr 25, 2019
- SKYWORKS SOLUTIONS, INC.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190068142
- Publication date Feb 28, 2019
- MURATA MANUFACTURING CO., LTD.
- Takayuki Tsutsui
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190051645
- Publication date Feb 14, 2019
- Murata Manufacturing Co., Ltd.
- Kenji SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
- Publication number 20190028067
- Publication date Jan 24, 2019
- SKYWORKS SOLUTIONS, INC.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS

Bipolar transistors in combination with diodes, or capacitors, or resistors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices comprising failure detectors for detecting fa...

Semiconductor device

Semiconductor device and manufacturing method for semiconductor device

Heterojunction bipolar transistor with buried trap rich isolation r...

Power amplifier apparatus

Direct substrate to solder bump connection for thermal management i...

Semiconductor device

Electronic device including a semiconductor body or an isolation st...

Semiconductor package with passive electrical component and method...

Electrostatic discharge handling for sense IGBT using Zener diode

Semiconductor device with carrier lifetime control

Semiconductor device

Semiconductor device and semiconductor arrangement comprising semic...

Diode linearizer

Semiconductor device

Semiconductor device

Semiconductor device

Direct substrate to solder bump connection for thermal management i...

SCRs with checker board layouts

Integrated electronic device including an edge termination structur...

Apparatus for automotive and communication systems transceiver inte...

Driver for driving a capacitive load

E-fuse cells

Semiconductor device

Three-level I-type inverter and semiconductor module

Flip chip amplifier for wireless device

Semiconductor device, manufacturing method therefor and semiconduct...

Transient voltage suppression device

Electrostatic protection circuit, semiconductor integrated circuit...

Device and method for on-chip mechanical stress sensing

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MIM CAPACITOR STRUCTURE AND FABRICATING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

HETEROJUNCTION BIPOLAR TRANSISTOR WITH BURIED TRAP RICH ISOLATION R...

SEMICONDUCTOR DEVICES COMPRISING FAILURE DETECTORS FOR DETECTING FA...

DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...

HETEROJUNCTION BIPOLAR TRANSISTOR WITH BURIED TRAP RICH ISOLATION R...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...

ELECTROSTATIC DISCHARGE HANDLING FOR SENSE IGBT USING ZENER DIODE

SEMICONDUCTOR DEVICE

Semiconductor Device and Semiconductor Arrangement Comprising Semic...

POWER AMPLIFIER APPARATUS

Electronic Device Including a Semiconductor Body or an Isolation St...

SEMICONDUCTOR DEVICE

APPARATUS FOR AUTOMOTIVE AND COMMUNICATION SYSTEMS TRANSCEIVER INTE...

SEMICONDUCTOR DEVICE

Semiconductor Package with Passive Electrical Component and Method...

SEMICONDUCTOR DEVICE

CO-PLACEMENT OF RESISTOR AND OTHER DEVICES TO IMPROVE AREA & PERFOR...

THREE-LEVEL I-TYPE INVERTER AND SEMICONDUCTOR MODULE

DRIVER FOR DRIVING A CAPACITIVE LOAD

METHODS FOR THERMAL MANAGEMENT IN AMPLIFIERS

INTEGRATED ELECTRONIC DEVICE INCLUDING AN EDGE TERMINATION STRUCTUR...

SEMICONDUCTOR DEVICE

FLIP CHIP AMPLIFIER FOR WIRELESS DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...