Bombardment with radiation

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CPC
H01L21/26

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/26Bombardment with radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ion implantation with annealing for substrate cutting
- Patent number 12,327,811
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact with a silicide region
- Patent number 12,328,890
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate polishing method
- Patent number 12,327,719
- Issue date Jun 10, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device including buried oxide layer
- Patent number 12,328,898
- Issue date Jun 10, 2025
- United Microelectronics Corp.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bidirectional conduction trench gate power MOS device and manufactu...
- Patent number 12,328,901
- Issue date Jun 10, 2025
- University of Electronic Science and Technology of China
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate
- Patent number 12,322,598
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate laser processing method and substrate laser processing ap...
- Patent number 12,322,656
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Yohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, modification device and substrate proc...
- Patent number 12,322,599
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Norifumi Kohama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method
- Patent number 12,317,524
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ling Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, semiconductor device...
- Patent number 12,315,728
- Issue date May 27, 2025
- Hitachi Power Semiconductor Device, Ltd.
- Tomoyasu Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,317,560
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Yasunori Agata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with low leakage current and methods of fabri...
- Patent number 12,317,578
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grin lens structure in micro-LED devices
- Patent number 12,313,859
- Issue date May 27, 2025
- Meta Platforms Technologies, LLC
- James Ronald Bonar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-based processing for semiconductor wafers
- Patent number 12,315,729
- Issue date May 27, 2025
- Wolfspeed, Inc.
- Devon Michael Diehl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contaminant collection on SOI
- Patent number 12,317,519
- Issue date May 27, 2025
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high voltage transistor and structure resulting t...
- Patent number 12,317,584
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuan-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 12,315,716
- Issue date May 27, 2025
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,315,795
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS top source/drain region doping and epitaxial growth for a vert...
- Patent number 12,310,090
- Issue date May 20, 2025
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT device and method of making the same
- Patent number 12,310,069
- Issue date May 20, 2025
- Shanghai Huahong Grace Semiconductor Manufacturing Corporation
- Jia Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device having contact plugs with re-ent...
- Patent number 12,310,051
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,308,371
- Issue date May 20, 2025
- NATIONAL TAIWAN UNIVERSITY
- Fang-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation to increase MOSFET threshold voltage
- Patent number 12,308,237
- Issue date May 20, 2025
- Applied Materials, Inc.
- Qintao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,310,093
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 12,300,726
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Takashi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,300,747
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zheng-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide band gap semiconductor electronic device having a junction-bar...
- Patent number 12,302,624
- Issue date May 13, 2025
- STMicroelectronics S.r.l.
- Simone Rascuná
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus and processing method
- Patent number 12,300,495
- Issue date May 13, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Source/drain features with improved strain properties
- Patent number 12,300,749
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolating ion implantation of silicon channels for integrated circu...
- Patent number 12,300,493
- Issue date May 13, 2025
- Synopsys, Inc.
- Salvatore Maria Amoroso
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of Forming WBG and UWBG Semiconductors with P- and N-type C...
- Publication number 20250183038
- Publication date Jun 5, 2025
- The Government of the United States of America, as represented by the Secreta...
- Boris N. Feigelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming Backside Power Rails
- Publication number 20250185330
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEM...
- Publication number 20250183035
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Alexander Viktorovich BOLOTNIKOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING OXIDE FILM WITH UNIFORM THICKNESS
- Publication number 20250183095
- Publication date Jun 5, 2025
- DB HiTek Co., Ltd.
- Jong Won Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For FinFET Fabrication And Structure Thereof
- Publication number 20250185346
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PI-TYPE TRENCH GATE SILICON CARBIDE MOSFET DEVICE AND FABRICATION M...
- Publication number 20250176207
- Publication date May 29, 2025
- JSAB Technologies (Shenzhen) Ltd.
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OHMIC CONTACT FORMATION IN A SIC-BASED ELECTRONIC DEVICE
- Publication number 20250176235
- Publication date May 29, 2025
- STMicroelectronics International N.V.
- Simone RASCUNÁ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SEMICONDUCTOR D...
- Publication number 20250176242
- Publication date May 29, 2025
- SK HYNIX INC.
- Na Hye WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC LASER-ASSISTED ETCHING
- Publication number 20250174461
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Yu Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...
- Publication number 20250176240
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Tai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DOSE IMPLANTATION FOR ULTRATHIN SEMICONDUCTOR-ON-INSULATOR SUB...
- Publication number 20250169120
- Publication date May 22, 2025
- STMicroelectronics, Inc.
- JOCELYNE GIMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20250169135
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250169140
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Chia-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE FOR IC WITH EPI REGIONS SHARING THE SAME TANK
- Publication number 20250169193
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- HENRY LITZMANN EDWARDS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SUBSTRATE WAFER FOR BUILDING GROUP III-V...
- Publication number 20250167005
- Publication date May 22, 2025
- Siltronic AG
- Brian MURPHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250157822
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Naoko KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD AND RECORDING ELEMENT MANUFACTURING METHOD
- Publication number 20250157823
- Publication date May 15, 2025
- Canon Kabushiki Kaisha
- TETSURO YASUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE IMPLANT FOR WAFER CURVATURE CONTROL
- Publication number 20250157821
- Publication date May 15, 2025
- Axcelis Technologies, Inc.
- Sean Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250157933
- Publication date May 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi KOEZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR
- Publication number 20250160007
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250159954
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Hiroki WAKIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...
- Publication number 20250159965
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250157854
- Publication date May 15, 2025
- Yong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING FOR SINGULATION
- Publication number 20250157858
- Publication date May 15, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250151299
- Publication date May 8, 2025
- Mitsubishi Electric Corporation
- Masanori TSUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES AND FABRICATION TECHNIQUES
- Publication number 20250151395
- Publication date May 8, 2025
- STMicroelectronics, Inc.
- John H. ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CON...
- Publication number 20250151363
- Publication date May 8, 2025
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250149386
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES INCLUDING SELF-ALIGNED P-T...
- Publication number 20250149338
- Publication date May 8, 2025
- The Government of the United States of America, as represented by the Secreta...
- Francis J. Kub
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250140613
- Publication date May 1, 2025
- Disco Corporation
- Tsubasa HIROSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Bombardment with radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ion implantation with annealing for substrate cutting

Contact with a silicide region

Semiconductor substrate polishing method

High voltage semiconductor device including buried oxide layer

Bidirectional conduction trench gate power MOS device and manufactu...

Method of processing substrate

Substrate laser processing method and substrate laser processing ap...

Substrate processing method, modification device and substrate proc...

Semiconductor device and method

Method for manufacturing semiconductor device, semiconductor device...

Semiconductor device

Semiconductor devices with low leakage current and methods of fabri...

Grin lens structure in micro-LED devices

Laser-based processing for semiconductor wafers

Contaminant collection on SOI

Method of forming high voltage transistor and structure resulting t...

Wafer processing method

Semiconductor structure and manufacturing method thereof

CMOS top source/drain region doping and epitaxial growth for a vert...

IGBT device and method of making the same

Fin field-effect transistor device having contact plugs with re-ent...

Semiconductor device and manufacturing method thereof

Ion implantation to increase MOSFET threshold voltage

Semiconductor device and manufacturing method thereof

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and manufacturing method thereof

Wide band gap semiconductor electronic device having a junction-bar...

Processing apparatus and processing method

Source/drain features with improved strain properties

Isolating ion implantation of silicon channels for integrated circu...

Patents Applicationslast 30 patents

Methods of Forming WBG and UWBG Semiconductors with P- and N-type C...

Method Of Forming Backside Power Rails

METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEM...

METHOD OF FABRICATING OXIDE FILM WITH UNIFORM THICKNESS

Method For FinFET Fabrication And Structure Thereof

PI-TYPE TRENCH GATE SILICON CARBIDE MOSFET DEVICE AND FABRICATION M...

OHMIC CONTACT FORMATION IN A SIC-BASED ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SEMICONDUCTOR D...

DYNAMIC LASER-ASSISTED ETCHING

SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...

HIGH DOSE IMPLANTATION FOR ULTRATHIN SEMICONDUCTOR-ON-INSULATOR SUB...

Semiconductor Device and Method of Forming the Same

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ISOLATION STRUCTURE FOR IC WITH EPI REGIONS SHARING THE SAME TANK

METHOD FOR MANUFACTURING A SUBSTRATE WAFER FOR BUILDING GROUP III-V...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DICING METHOD AND RECORDING ELEMENT MANUFACTURING METHOD

BACKSIDE IMPLANT FOR WAFER CURVATURE CONTROL

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

METHOD OF MAKING COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

LASER DICING FOR SINGULATION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICES AND FABRICATION TECHNIQUES

CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CON...

DIE CLEANING SYSTEMS AND RELATED METHODS

METHODS OF FORMING SEMICONDUCTOR DEVICES INCLUDING SELF-ALIGNED P-T...

METHOD OF PROCESSING WAFER