Bombardment with radiation

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/26Bombardment with radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 12,300,726
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Takashi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,300,747
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zheng-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus and processing method
- Patent number 12,300,495
- Issue date May 13, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Source/drain features with improved strain properties
- Patent number 12,300,749
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide band gap semiconductor electronic device having a junction-bar...
- Patent number 12,302,624
- Issue date May 13, 2025
- STMicroelectronics S.r.l.
- Simone Rascuná
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolating ion implantation of silicon channels for integrated circu...
- Patent number 12,300,493
- Issue date May 13, 2025
- Synopsys, Inc.
- Salvatore Maria Amoroso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation process to form punch through stopper
- Patent number 12,300,494
- Issue date May 13, 2025
- Applied Materials, Inc.
- Yan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistant contact method and structure
- Patent number 12,300,729
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resistivity silicon-on-insulator substrate comprising an isola...
- Patent number 12,300,535
- Issue date May 13, 2025
- GlobalWafers Co., Ltd.
- Igor Peidous
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,302,617
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Yasunori Agata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide components and methods for producing silicon carbid...
- Patent number 12,302,619
- Issue date May 13, 2025
- Infineon Technologies AG
- Roland Rupp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laser processing method
- Patent number 12,290,881
- Issue date May 6, 2025
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus and manufacturing method of semiconductor a...
- Patent number 12,294,025
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Motoyoshi Kubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond wafer dividing method and chip manufacturing method
- Patent number 12,293,915
- Issue date May 6, 2025
- Disco Corporation
- Yoshiaki Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing nitride semiconductor device and nitride s...
- Patent number 12,294,019
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, method of manufacturing display device, and electro...
- Patent number 12,289,959
- Issue date Apr 29, 2025
- Sony Group Corporation
- Hitoshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared well structure manufacturing method
- Patent number 12,288,786
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip, processed wafer, and method for manufacturing s...
- Patent number 12,288,720
- Issue date Apr 29, 2025
- Denso Corporation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact structures and fabrication for metal on both sides...
- Patent number 12,288,810
- Issue date Apr 29, 2025
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charged particle source module
- Patent number 12,288,663
- Issue date Apr 29, 2025
- ASML Netherlands B.V.
- Laura Dinu-Gurtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material processing method and material processing system for perfo...
- Patent number 12,280,445
- Issue date Apr 22, 2025
- Carl Zeiss Microscopy GmbH
- Stephan Hiller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,283,517
- Issue date Apr 22, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Pengchong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power conversion device and method of manufac...
- Patent number 12,283,628
- Issue date Apr 22, 2025
- Mitsubishi Electric Corporation
- Masanao Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma strip tool with movable insert
- Patent number 12,283,467
- Issue date Apr 22, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- B08 - CLEANING
Information Patent Grant
Semiconductor device
- Patent number 12,283,614
- Issue date Apr 22, 2025
- Kabushiki Kaisha Toshiba
- Shinji Onduka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 12,283,608
- Issue date Apr 22, 2025
- Fuji Electric Co., Ltd.
- Tetsutaro Imagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench-gated heterostructure and double-heterostructure active devices
- Patent number 12,284,817
- Issue date Apr 22, 2025
- MaxPower Semiconductor Inc.
- Jun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern decomposition lithography techniques
- Patent number 12,278,204
- Issue date Apr 15, 2025
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating device and heating method
- Patent number 12,278,122
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Takashi Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing apparatus and laser processing method
- Patent number 12,275,091
- Issue date Apr 15, 2025
- Hamamatsu Photonics K.K.
- Katsuhiro Korematsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250157822
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Naoko KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD AND RECORDING ELEMENT MANUFACTURING METHOD
- Publication number 20250157823
- Publication date May 15, 2025
- Canon Kabushiki Kaisha
- TETSURO YASUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE IMPLANT FOR WAFER CURVATURE CONTROL
- Publication number 20250157821
- Publication date May 15, 2025
- Axcelis Technologies, Inc.
- Sean Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250157933
- Publication date May 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi KOEZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR
- Publication number 20250160007
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250157854
- Publication date May 15, 2025
- Yong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING FOR SINGULATION
- Publication number 20250157858
- Publication date May 15, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250159954
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Hiroki WAKIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...
- Publication number 20250159965
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES AND FABRICATION TECHNIQUES
- Publication number 20250151395
- Publication date May 8, 2025
- STMicroelectronics, Inc.
- John H. ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250151299
- Publication date May 8, 2025
- Mitsubishi Electric Corporation
- Masanori TSUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CON...
- Publication number 20250151363
- Publication date May 8, 2025
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250149386
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES INCLUDING SELF-ALIGNED P-T...
- Publication number 20250149338
- Publication date May 8, 2025
- The Government of the United States of America, as represented by the Secreta...
- Francis J. Kub
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Depletion Type Vertical Discrete NMOS Device and Manufacturing Meth...
- Publication number 20250142873
- Publication date May 1, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Wu-Te Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250140613
- Publication date May 1, 2025
- Disco Corporation
- Tsubasa HIROSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT (IC) WITH CORRUGATED CHANNEL STRUCTURE
- Publication number 20250140560
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jackson Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
- Publication number 20250142855
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Veeraraghavan S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR HAVING AN ELECTRODE TRENCH STRUCTURE
- Publication number 20250142880
- Publication date May 1, 2025
- INFINEON TECHNOLOGIES AG
- Andreas Hoffmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A VERTICAL FIELD EFFECT TRANSISTOR STRUCTU...
- Publication number 20250142944
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Daniel Krebs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER DICING
- Publication number 20250140612
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Ming-Hui CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250142887
- Publication date May 1, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Kenichi OKAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSFET TRANSISTOR WITH AN IMPROVED BODY STRUCTURE TO INCREASE THE R...
- Publication number 20250142898
- Publication date May 1, 2025
- STMicroelectronics International N.V.
- Luigi ARCURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A REDUCED SIZE FEATURE
- Publication number 20250140557
- Publication date May 1, 2025
- NXP USA, Inc.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR GATE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250142904
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED...
- Publication number 20250142938
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND ASSOCIATED METHODS
- Publication number 20250142899
- Publication date May 1, 2025
- NEXPERIA B.V.
- Jianglong Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION OF P-GAN HEMT BY USE OF GATE RING
- Publication number 20250142865
- Publication date May 1, 2025
- STMicroelectronics International N.V.
- Aurore CONSTANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250140561
- Publication date May 1, 2025
- Disco Corporation
- Tsubasa HIROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH T...
- Publication number 20250133749
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS

Bombardment with radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and manufacturing method thereof

Processing apparatus and processing method

Source/drain features with improved strain properties

Wide band gap semiconductor electronic device having a junction-bar...

Isolating ion implantation of silicon channels for integrated circu...

Ion implantation process to form punch through stopper

Low resistant contact method and structure

High resistivity silicon-on-insulator substrate comprising an isola...

Semiconductor device and manufacturing method of semiconductor device

Silicon carbide components and methods for producing silicon carbid...

Laser processing method

Semiconductor apparatus and manufacturing method of semiconductor a...

Diamond wafer dividing method and chip manufacturing method

Method for manufacturing nitride semiconductor device and nitride s...

Display device, method of manufacturing display device, and electro...

Shared well structure manufacturing method

Semiconductor chip, processed wafer, and method for manufacturing s...

Backside contact structures and fabrication for metal on both sides...

Charged particle source module

Material processing method and material processing system for perfo...

Method for forming semiconductor structure

Semiconductor device, power conversion device and method of manufac...

Plasma strip tool with movable insert

Semiconductor device

Semiconductor device and manufacturing method of the same

Trench-gated heterostructure and double-heterostructure active devices

Pattern decomposition lithography techniques

Heating device and heating method

Laser processing apparatus and laser processing method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DICING METHOD AND RECORDING ELEMENT MANUFACTURING METHOD

BACKSIDE IMPLANT FOR WAFER CURVATURE CONTROL

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

METHOD OF MAKING COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

LASER DICING FOR SINGULATION

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...

INTEGRATED CIRCUIT DEVICES AND FABRICATION TECHNIQUES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CONTACT ARCHITECTURE FOR CAPACITANCE REDUCTION AND SATISFACTORY CON...

DIE CLEANING SYSTEMS AND RELATED METHODS

METHODS OF FORMING SEMICONDUCTOR DEVICES INCLUDING SELF-ALIGNED P-T...

Depletion Type Vertical Discrete NMOS Device and Manufacturing Meth...

METHOD OF PROCESSING WAFER

INTEGRATED CIRCUIT (IC) WITH CORRUGATED CHANNEL STRUCTURE

PUNCH THROUGH STOPPER IN BULK FINFET DEVICE

FIELD EFFECT TRANSISTOR HAVING AN ELECTRODE TRENCH STRUCTURE

METHOD FOR MANUFACTURING A VERTICAL FIELD EFFECT TRANSISTOR STRUCTU...

METHOD FOR WAFER DICING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MOSFET TRANSISTOR WITH AN IMPROVED BODY STRUCTURE TO INCREASE THE R...

METHOD FOR FORMING A REDUCED SIZE FEATURE

TRANSISTOR GATE STRUCTURES AND METHODS OF FORMING THE SAME

FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED...

POWER SEMICONDUCTOR DEVICE AND ASSOCIATED METHODS

ISOLATION OF P-GAN HEMT BY USE OF GATE RING

PROCESSING METHOD OF WAFER

METHOD FOR PRODUCING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH T...