Bombardment with radiation

Industry

CPC
H01L21/26

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/26Bombardment with radiation

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing
- Patent number 12,368,048
- Issue date Jul 22, 2025
- Fuji Electric Co., Ltd.
- Misaki Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 12,369,370
- Issue date Jul 22, 2025
- Fuji Electric Co., Ltd.
- Takahiro Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LDMOS device having isolation regions comprising DTI regions extend...
- Patent number 12,368,070
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chieh Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor device and fabrication method therefor
- Patent number 12,369,346
- Issue date Jul 22, 2025
- Rohm Co., Ltd.
- Kenji Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron extraction type free-wheeling diode device and preparation...
- Patent number 12,363,930
- Issue date Jul 15, 2025
- JSAB TECHNOLOGIES (SHENZHEN) LTD.
- Hao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 12,362,191
- Issue date Jul 15, 2025
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Schottky barrier diode with reduced leakage current and method of f...
- Patent number 12,363,925
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for laser drilling blind vias
- Patent number 12,358,073
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma based film modification for semiconductor devices
- Patent number 12,351,900
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Timothy J. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Field effect transistor with contact via structures that are latera...
- Patent number 12,356,704
- Issue date Jul 8, 2025
- SanDisk Technologies, Inc.
- Kouta Onogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile semiconductor memory device and method for manufacturin...
- Patent number 12,356,622
- Issue date Jul 8, 2025
- Kioxia Corporation
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for splitting semiconductor wafers
- Patent number 12,356,700
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage transistor
- Patent number 12,356,648
- Issue date Jul 8, 2025
- United Microelectronics Corp.
- Kai-Kuen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure, and semiconductor struc...
- Patent number 12,356,655
- Issue date Jul 8, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qing Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical image capturing system, image capturing device and electron...
- Patent number 12,352,932
- Issue date Jul 8, 2025
- LARGAN PRECISION CO., LTD
- Lin-Yao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element forming wafer and method for manufacturing the same
- Patent number 12,354,875
- Issue date Jul 8, 2025
- Denso Corporation
- Akihiko Teshigahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer
- Patent number 12,354,916
- Issue date Jul 8, 2025
- Disco Corporation
- Hayato Iga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,356,650
- Issue date Jul 8, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Ziming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate device and related methods
- Patent number 12,356,660
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing same
- Patent number 12,349,429
- Issue date Jul 1, 2025
- mqSemi AG
- Munaf Rahimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and method of manufacturing si...
- Patent number 12,349,451
- Issue date Jul 1, 2025
- Fuji Electric Co., Ltd.
- Shingo Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures in multi-gate semiconductor devices and method...
- Patent number 12,349,384
- Issue date Jul 1, 2025
- TAIWAN SEMICONDUCTOR MANUFACTUIRNG CO., LTD.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced ignition in inductively coupled plasmas for workpiece proc...
- Patent number 12,347,677
- Issue date Jul 1, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Stephen E. Savas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,349,376
- Issue date Jul 1, 2025
- Fuji Electric Co., Ltd.
- Hiroshi Takishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device and method of manufacturing same
- Patent number 12,349,397
- Issue date Jul 1, 2025
- DB HiTek Co., Ltd.
- Byung Hwa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage device and manufacturing method thereof
- Patent number 12,349,398
- Issue date Jul 1, 2025
- Richtek Technology Corporation
- Kuo-Hsuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch rate modulation of FinFET through high-temperature ion implant...
- Patent number 12,347,687
- Issue date Jul 1, 2025
- Applied Materials, Inc.
- Qintao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral transistor with self-aligned body implant
- Patent number 12,347,688
- Issue date Jul 1, 2025
- Infineon Technologies Dresden GmbH & Co. KG
- Achim Gratz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising insulated-gate bipolar transistor
- Patent number 12,349,453
- Issue date Jul 1, 2025
- Fuji Electric Co., Ltd.
- Yuichi Onozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 12,341,069
- Issue date Jun 24, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR PERFORMING HIGH-SPEED, SCANNED LASER STRUCTURING OF MUL...
- Publication number 20250235960
- Publication date Jul 24, 2025
- Northwestern University
- John A. Rogers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250241006
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Long CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVEYANCE APPARATUS, TRANSFER METHOD, CONVEYANCE METHOD, AND SEMIC...
- Publication number 20250239475
- Publication date Jul 24, 2025
- JSW Aktina System Co., Ltd.
- Takahiro FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A TYPE III-NI...
- Publication number 20250240993
- Publication date Jul 24, 2025
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A WIDE BAN...
- Publication number 20250239459
- Publication date Jul 24, 2025
- INFINEON TECHNOLOGIES AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20250239478
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Kota HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING NON-CONTACT PROTECTION FEATURES I...
- Publication number 20250239540
- Publication date Jul 24, 2025
- The Charles Stark Draper Laboratory, Inc.
- William Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDMOS Transistor Devices
- Publication number 20250241007
- Publication date Jul 24, 2025
- pSemi Corporation
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR AUTO-ALIGNED MANUFACTURING OF A VDMOS TRANSISTOR, AND AU...
- Publication number 20250241044
- Publication date Jul 24, 2025
- STMicroelectronics S.r.l.
- Vincenzo ENEA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...
- Publication number 20250232977
- Publication date Jul 17, 2025
- II-VI Delaware, Inc.
- Jeremy Andre Turcaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250233021
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250234617
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BAND GAP SEMICONDUCTOR ELECTRONIC DEVICE HAVING A JUNCTION-BAR...
- Publication number 20250234570
- Publication date Jul 17, 2025
- STMicroelectronics S.r.l.
- Simone RASCUNÁ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TRENCH BOTTOM PROTECTIVE REGION FOR A TRENCH-GATE META...
- Publication number 20250234587
- Publication date Jul 17, 2025
- STMicroelectronics International N.V.
- Cateno Marco CAMALLERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MODULATION OF NITRIDE LAYERS USING CHEMICAL VAPOR DEPOSITION...
- Publication number 20250226226
- Publication date Jul 10, 2025
- Applied Materials, Inc.
- Rajesh PRASAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE AND TRANSISTOR DEVICES AND FABRICATION TECHNIQUES
- Publication number 20250227944
- Publication date Jul 10, 2025
- Murata Manufactunng Co., Ltd.
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250218780
- Publication date Jul 3, 2025
- Fuji Electric Co., Ltd.
- Kaname MITSUZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Strip Tool With Movable Insert
- Publication number 20250218740
- Publication date Jul 3, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- B08 - CLEANING
Information Patent Application
BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...
- Publication number 20250220952
- Publication date Jul 3, 2025
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTO...
- Publication number 20250216690
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Youngchul KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPITAXIAL STRUCTURE FOR SEMICONDUCTOR DEVICES AND METHOD FORMING TH...
- Publication number 20250218779
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250218781
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Tae Shin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MOSFET DEVICE HAVING IMPROVED SAFE-OPERATING AREA AND ON RESI...
- Publication number 20250220955
- Publication date Jul 3, 2025
- STMicroelectronics S.r.l.
- Angelo MAGRI'
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATION START POINT FORMING METHOD AND SEPARATION METHOD
- Publication number 20250205826
- Publication date Jun 26, 2025
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP MANUFACTURING METHOD
- Publication number 20250210355
- Publication date Jun 26, 2025
- Disco Corporation
- Yuki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A DEFECT REGION AND METHOD OF FABRICATION...
- Publication number 20250210546
- Publication date Jun 26, 2025
- NXP B.V.
- Petrus Hubertus Cornelis Magnee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250212473
- Publication date Jun 26, 2025
- Fuji Electric Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250210354
- Publication date Jun 26, 2025
- DB HITEK CO., LTD.
- Won Kook CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250203921
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Yotaro GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250201542
- Publication date Jun 19, 2025
- SEMES CO., LTD.
- Jinhyeok KIM
- H01 - BASIC ELECTRIC ELEMENTS

Bombardment with radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing

Semiconductor device and manufacturing method for semiconductor device

LDMOS device having isolation regions comprising DTI regions extend...

Nitride semiconductor device and fabrication method therefor

Electron extraction type free-wheeling diode device and preparation...

Methods and devices related to radio frequency devices

Schottky barrier diode with reduced leakage current and method of f...

Method and apparatus for laser drilling blind vias

Plasma based film modification for semiconductor devices

Field effect transistor with contact via structures that are latera...

Nonvolatile semiconductor memory device and method for manufacturin...

Method for splitting semiconductor wafers

High voltage transistor

Method for forming semiconductor structure, and semiconductor struc...

Optical image capturing system, image capturing device and electron...

Element forming wafer and method for manufacturing the same

Method of processing wafer

Semiconductor device and method for manufacturing the same

Multi-gate device and related methods

Semiconductor device and method for producing same

Silicon carbide semiconductor device and method of manufacturing si...

Isolation structures in multi-gate semiconductor devices and method...

Enhanced ignition in inductively coupled plasmas for workpiece proc...

Semiconductor device and manufacturing method of semiconductor device

High voltage semiconductor device and method of manufacturing same

High voltage device and manufacturing method thereof

Etch rate modulation of FinFET through high-temperature ion implant...

Lateral transistor with self-aligned body implant

Semiconductor device comprising insulated-gate bipolar transistor

Backside metal patterning die singulation system and related methods

Patents Applicationslast 30 patents

METHODS FOR PERFORMING HIGH-SPEED, SCANNED LASER STRUCTURING OF MUL...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CONVEYANCE APPARATUS, TRANSFER METHOD, CONVEYANCE METHOD, AND SEMIC...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR BODY HAVING A TYPE III-NI...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A WIDE BAN...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

SYSTEMS AND METHODS FOR PROVIDING NON-CONTACT PROTECTION FEATURES I...

PEDMOS Transistor Devices

METHOD FOR AUTO-ALIGNED MANUFACTURING OF A VDMOS TRANSISTOR, AND AU...

IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...

DIE CLEANING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

WIDE BAND GAP SEMICONDUCTOR ELECTRONIC DEVICE HAVING A JUNCTION-BAR...

SELF-ALIGNED TRENCH BOTTOM PROTECTIVE REGION FOR A TRENCH-GATE META...

STRESS MODULATION OF NITRIDE LAYERS USING CHEMICAL VAPOR DEPOSITION...

DIODE AND TRANSISTOR DEVICES AND FABRICATION TECHNIQUES

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

Plasma Strip Tool With Movable Insert

BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...

WAFER PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTO...

EPITAXIAL STRUCTURE FOR SEMICONDUCTOR DEVICES AND METHOD FORMING TH...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

POWER MOSFET DEVICE HAVING IMPROVED SAFE-OPERATING AREA AND ON RESI...

SEPARATION START POINT FORMING METHOD AND SEPARATION METHOD

CHIP MANUFACTURING METHOD

SEMICONDUCTOR DEVICE WITH A DEFECT REGION AND METHOD OF FABRICATION...

NITRIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD