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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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last 30 patents
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Patent Grant
3DIC structure and methods of forming
Patent number
11,984,431
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuo-Ming Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
Patent number
11,984,415
Issue date
May 14, 2024
Samsung Electronics Co., Ltd.
Yukyung Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,973,016
Issue date
Apr 30, 2024
Infineon Technologies Austria AG
Elvir Kahrimanovic
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display substrate and method for detecting broken fanout wire of di...
Patent number
11,972,989
Issue date
Apr 30, 2024
BOE Technology Group Co., Ltd.
Li Xiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,961,789
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solderless interconnection structure and method of forming same
Patent number
11,961,810
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company
Yu-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor substrate structure and manufacturing method thereof
Patent number
11,948,899
Issue date
Apr 2, 2024
Dyi-Chung Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including high thermal conductivity layer
Patent number
11,948,851
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Sunjae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die and package structure
Patent number
11,948,904
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic devices in semiconductor package cavities
Patent number
11,942,386
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Christopher Daniel Manack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,935,871
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon photonic interposer with two metal redistribution layers
Patent number
11,923,327
Issue date
Mar 5, 2024
Rockley Photonics Limited
Michael Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuits with redistribution lines
Patent number
11,923,338
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LTHC as charging barrier in info package formation
Patent number
11,923,353
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
11,916,028
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating semiconductor device with graphene layers
Patent number
11,908,816
Issue date
Feb 20, 2024
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package and manufacturing method thereof
Patent number
11,894,336
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,887,840
Issue date
Jan 30, 2024
Samsung Electronics Co., Ltd.
Min Sung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a metallization structure
Patent number
11,876,041
Issue date
Jan 16, 2024
Infineon Technologies Austria AG
Oliver Blank
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Clock tree routing in a chip stack
Patent number
11,868,174
Issue date
Jan 9, 2024
Xilinx, Inc.
Brian C. Gaide
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package structures and methods of manufacturing the same
Patent number
11,862,585
Issue date
Jan 2, 2024
Advanced Semiconductor Engineering, Inc.
Syu-Tang Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,862,586
Issue date
Jan 2, 2024
Kioxia Corporation
Mizuki Tamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
11,855,014
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,855,016
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
Patent number
11,854,922
Issue date
Dec 26, 2023
Texas Instruments Incorporated
Vivek Swaminathan Sridharan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielding structures
Patent number
11,855,022
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Fan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polyimide profile control
Patent number
11,855,015
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Chi Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with pass-through clock traces and associate...
Patent number
11,855,048
Issue date
Dec 26, 2023
Thomas H. Kinsley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer structures for integrated circuit package
Patent number
11,848,271
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices including coax-like electrical connections and methods for...
Patent number
11,837,565
Issue date
Dec 5, 2023
Infineon Technologies AG
Saqib Kaleem
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
Publication number
20240153908
Publication date
May 9, 2024
HKC Corporation Limited
YANG PU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER
Publication number
20240153893
Publication date
May 9, 2024
Qorvo US, Inc.
Michael Carroll
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
Publication number
20240153897
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Fu-Chiang Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND...
Publication number
20240145404
Publication date
May 2, 2024
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240145255
Publication date
May 2, 2024
InnoLux Corporation
Ker-Yih KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145417
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Hyeongwoo JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
Publication number
20240128208
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
Publication number
20240120211
Publication date
Apr 11, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS, SEMICONDUCTOR DEVICE, AND REDISTRIBUTION LAYER STRUCTURE...
Publication number
20240105648
Publication date
Mar 28, 2024
Micron Technology, Inc.
Shigeru Sugioka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLOCK TREE ROUTING IN A CHIP STACK
Publication number
20240103562
Publication date
Mar 28, 2024
Xilinx, Inc.
Brian C. GAIDE
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
POWER DISTRIBUTION NETWORK AND SEMICONDUCTOR DEVICE
Publication number
20240105616
Publication date
Mar 28, 2024
SK HYNIX INC.
Ki Bum KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240096760
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...
Publication number
20240096825
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Layer Structures for Integrated Circuit Package
Publication number
20240079324
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jie CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POST PASSIVATION INTERCONNECT
Publication number
20240079357
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-An LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3DIC Package and Method Forming the Same
Publication number
20240072034
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BIFACIAL SEMICONDUCTOR WAFER
Publication number
20240063092
Publication date
Feb 22, 2024
Western Digital Technologies, Inc.
Sara Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240063150
Publication date
Feb 22, 2024
DENSO CORPORATION
Taro IGOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE
Publication number
20240057352
Publication date
Feb 15, 2024
ChangXin Memory Technologies, Inc.
LING-YI CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
Publication number
20240038753
Publication date
Feb 1, 2024
QUALCOMM Incorporated
Aniket PATIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS
Publication number
20240038695
Publication date
Feb 1, 2024
Celestial AI Inc.
Ankur AGGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus Including a Capacitor and a Coil, and a System Having Suc...
Publication number
20240038696
Publication date
Feb 1, 2024
INFINEON TECHNOLOGIES AG
Hermann Gruber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...
Publication number
20240038694
Publication date
Feb 1, 2024
Celestial AI Inc.
Ankur AGGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240021541
Publication date
Jan 18, 2024
RENESAS ELECTRONICS CORPORATION
Kazuo Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...
Publication number
20240021552
Publication date
Jan 18, 2024
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SUBSTRATE-VIA IN PHOTOSENSITIVE MODULE
Publication number
20240021649
Publication date
Jan 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Ming-Yao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
Publication number
20240014152
Publication date
Jan 11, 2024
NXP B.V.
Leo van Gemert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH PAD STRUCTURE RESISTANT TO PLASMA DAMAGE...
Publication number
20240014154
Publication date
Jan 11, 2024
RICHTEK TECHNOLOGY CORPORATION
Wu-Te WENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE PLATING FOR PACKAGED SEMICONDUCTOR DEVICES
Publication number
20240006351
Publication date
Jan 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Katleen Fajardo Timbol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
Publication number
20230420437
Publication date
Dec 28, 2023
Taiwan Semiconductor Manufacturing Company Limited
Chieh-Yen Chen
H01 - BASIC ELECTRIC ELEMENTS