Boundary region between core and peripheral circuit region

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H01L27/11575

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/11575Boundary region between core and peripheral circuit region

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Patents Grantslast 30 patents

Information Patent Grant
Nonvolatile memory device and method for fabricating the same
- Patent number 11,683,934
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Young-Jin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D memory device including shared select gate connections between m...
- Patent number 11,670,370
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Aaron Yip
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device and method for manufacturing same
- Patent number 11,672,117
- Issue date Jun 6, 2023
- Kioxia Corporation
- Kotaro Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure in three-dimensional memory device and method f...
- Patent number 11,670,592
- Issue date Jun 6, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including staircase structures
- Patent number 11,653,499
- Issue date May 16, 2023
- Micron Technology, Inc.
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,641,743
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Kwangyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,637,116
- Issue date Apr 25, 2023
- Kioxia Corporation
- Takuya Inatsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing auxiliary support pillar...
- Patent number 11,637,118
- Issue date Apr 25, 2023
- SanDisk Technologies LLC
- Shunsuke Takuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing auxiliary support pillar...
- Patent number 11,637,119
- Issue date Apr 25, 2023
- SanDisk Technologies LLC
- Kohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor devices
- Patent number 11,637,120
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Manjoong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including trench-isolated memory pl...
- Patent number 11,631,690
- Issue date Apr 18, 2023
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,626,422
- Issue date Apr 11, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including gate layer and vertical structure
- Patent number 11,626,413
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,621,272
- Issue date Apr 4, 2023
- SK hynix Inc.
- Jae Taek Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel memory stack structure with tapered inter-tier joint reg...
- Patent number 11,621,277
- Issue date Apr 4, 2023
- SanDisk Technologies LLC
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,616,072
- Issue date Mar 28, 2023
- Kioxia Corporation
- Tetsuya Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having 2-transistor vertical memory cell and wrapped...
- Patent number 11,616,073
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,610,912
- Issue date Mar 21, 2023
- Kioxia Corporation
- Hidenobu Nagashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method of manufacturing the same
- Patent number 11,605,646
- Issue date Mar 14, 2023
- Kioxia Corporation
- Kazuhiro Nojima
- G11 - INFORMATION STORAGE
Information Patent Grant
Devices including staircase structures, and related memory devices...
- Patent number 11,600,631
- Issue date Mar 7, 2023
- Micron Technology, Inc.
- Toru Tanzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,594,548
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Sangmin Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical-type non-volatile memory devices having dummy channel holes
- Patent number RE49440
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Chang-hyun Lee
Information Patent Grant
Semiconductor device
- Patent number 11,587,951
- Issue date Feb 21, 2023
- Hitachi Astemo, Ltd.
- Takayuki Oshima
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,581,326
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Tae-Jong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming memory device
- Patent number 11,574,917
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chien Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile semiconductor storage device and method of manufacturi...
- Patent number 11,574,926
- Issue date Feb 7, 2023
- Kioxia Corporation
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with cell region, method of generating layout...
- Patent number 11,568,125
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having first memory section and second memory...
- Patent number 11,557,631
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Kilho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,557,605
- Issue date Jan 17, 2023
- Kioxia Corporation
- Go Oike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,557,600
- Issue date Jan 17, 2023
- SK hynix Inc.
- Kang Sik Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES EXHIBITING A WEAV...
- Publication number 20240081076
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240015974
- Publication date Jan 11, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230413570
- Publication date Dec 21, 2023
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230380174
- Publication date Nov 23, 2023
- Macronix International Co., Ltd.
- Li-Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230301111
- Publication date Sep 21, 2023
- KIOXIA Corporation
- Kenta YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING MEMORY DEVICE
- Publication number 20230180480
- Publication date Jun 8, 2023
- SK HYNIX INC.
- Sung Yong CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230157027
- Publication date May 18, 2023
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURI...
- Publication number 20230146470
- Publication date May 11, 2023
- KIOXIA Corporation
- Yoshiaki FUKUZUMI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230139596
- Publication date May 4, 2023
- KIOXIA Corporation
- Hidenobu NAGASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING 2-TRANSISTOR VERTICAL MEMORY CELL AND CONDUCTI...
- Publication number 20230138322
- Publication date May 4, 2023
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...
- Publication number 20230134878
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Seung Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES
- Publication number 20230123297
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Byungsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM THEREWITH
- Publication number 20230115503
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- SUJEONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230113904
- Publication date Apr 13, 2023
- KIOXIA Corporation
- Go OIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY...
- Publication number 20230095343
- Publication date Mar 30, 2023
- Yangtze Memory Technologies Co., Ltd.
- Xinxin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230093758
- Publication date Mar 23, 2023
- SK HYNIX INC.
- Go Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20230088310
- Publication date Mar 23, 2023
- KIOXIA Corporation
- Tomoo HISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230087468
- Publication date Mar 23, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Publication number 20230081373
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Bosuk KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING A STAIR STEP STRUCTURE ADJACENT A SUBSTANTIALLY P...
- Publication number 20230077163
- Publication date Mar 9, 2023
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230070357
- Publication date Mar 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND WITH IO CONTACTS IN ISOLATION TRENCH
- Publication number 20230076831
- Publication date Mar 9, 2023
- Intel Corporation
- Praveen Kumar Kalsani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES
- Publication number 20230061327
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- John D. Hopkins
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A STACK OF DATA LINES WITH CONDUCTIVE S...
- Publication number 20230043786
- Publication date Feb 9, 2023
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCK-TO-BLOCK ISOLATION AND DEEP CONTACT USING PILLARS IN A MEMORY...
- Publication number 20230036595
- Publication date Feb 2, 2023
- Intel Corporation
- Deepak THIMMEGOWDA
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY TRANSISTOR WITH MULTIPLE CHARGE STORING LAYERS AND A HIGH WO...
- Publication number 20230023852
- Publication date Jan 26, 2023
- Igor Polishchuk
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230023666
- Publication date Jan 26, 2023
- Kioxia Corporation
- Shinya ARAI
- G11 - INFORMATION STORAGE
Information Patent Application
THROUGH ARRAY CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230005950
- Publication date Jan 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20230005949
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Seungmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220399289
- Publication date Dec 15, 2022
- SK HYNIX INC.
- Byeong Chan BANG
- H01 - BASIC ELECTRIC ELEMENTS

Boundary region between core and peripheral circuit region

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nonvolatile memory device and method for fabricating the same

3D memory device including shared select gate connections between m...

Semiconductor memory device and method for manufacturing same

Staircase structure in three-dimensional memory device and method f...

Semiconductor devices including staircase structures

Semiconductor devices

Semiconductor memory device

Three-dimensional memory device containing auxiliary support pillar...

Three-dimensional memory device containing auxiliary support pillar...

Vertical semiconductor devices

Three-dimensional memory device including trench-isolated memory pl...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device including gate layer and vertical structure

Semiconductor memory device

Multilevel memory stack structure with tapered inter-tier joint reg...

Semiconductor memory device

Memory device having 2-transistor vertical memory cell and wrapped...

Semiconductor memory device

Semiconductor storage device and method of manufacturing the same

Devices including staircase structures, and related memory devices...

Semiconductor device

Vertical-type non-volatile memory devices having dummy channel holes

Semiconductor device

Three-dimensional semiconductor memory device

Method of forming memory device

Non-volatile semiconductor storage device and method of manufacturi...

Semiconductor device with cell region, method of generating layout...

Semiconductor device having first memory section and second memory...

Semiconductor memory device

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

ELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES EXHIBITING A WEAV...

THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME

MEMORY DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICE AND METHOD OF MANUFACTURING MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME

NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURI...

SEMICONDUCTOR MEMORY DEVICE

MEMORY DEVICE HAVING 2-TRANSISTOR VERTICAL MEMORY CELL AND CONDUCTI...

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...

MEMORY DEVICES

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM THEREWITH

SEMICONDUCTOR MEMORY DEVICE

METHOD AND STRUCTURE FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR MEMORY

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME

DEVICES INCLUDING A STAIR STEP STRUCTURE ADJACENT A SUBSTANTIALLY P...

STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE

3D NAND WITH IO CONTACTS IN ISOLATION TRENCH

METHODS OF FORMING MICROELECTRONIC DEVICES

SEMICONDUCTOR DEVICE HAVING A STACK OF DATA LINES WITH CONDUCTIVE S...

BLOCK-TO-BLOCK ISOLATION AND DEEP CONTACT USING PILLARS IN A MEMORY...

MEMORY TRANSISTOR WITH MULTIPLE CHARGE STORING LAYERS AND A HIGH WO...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

THROUGH ARRAY CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...