Boundary region between core and peripheral circuit region

Industry

CPC
H01L27/11595

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/11595Boundary region between core and peripheral circuit region

Industries

Patents Grantslast 30 patents

Information Patent Grant
Protective structure and fabrication methods for the peripheral cir...
- Patent number 11,404,442
- Issue date Aug 2, 2022
- Yangtze Memory Technologies Co., Ltd.
- Zongliang Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional NOR array including active region pillars and met...
- Patent number 11,251,199
- Issue date Feb 15, 2022
- SanDisk Technologies LLC
- Yanli Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a MFMIS memory device
- Patent number 11,171,157
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective structure and fabrication methods for the peripheral cir...
- Patent number 10,756,113
- Issue date Aug 25, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zongliang Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor devices including gate electrodes
- Patent number 10,468,433
- Issue date Nov 5, 2019
- Samsung Electronics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230014289
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Giorgio Servalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH FINNED SUPPORT PILLAR STRUCTUR...
- Publication number 20220375958
- Publication date Nov 24, 2022
- SANDISK TECHNOLOGIES LLC
- Seiji SHIMABUKURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20220328524
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-En Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A MFMIS MEMORY DEVICE
- Publication number 20220059549
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SYSTEM INCLUDING THE SAME
- Publication number 20210399010
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A MFMIS MEMORY DEVICE
- Publication number 20210351191
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Sheng-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NOR ARRAY INCLUDING ACTIVE REGION PILLARS AND ME...
- Publication number 20210175251
- Publication date Jun 10, 2021
- SANDISK TECHNOLOGIES LLC
- Yanli ZHANG
- G11 - INFORMATION STORAGE
Information Patent Application
PROTECTIVE STRUCTURE AND FABRICATION METHODS FOR THE PERIPHERAL CIR...
- Publication number 20200335521
- Publication date Oct 22, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zongliang Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE STRUCTURE AND FABRICATION METHODS FOR THE PERIPHERAL CIR...
- Publication number 20190157298
- Publication date May 23, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zongliang Huo
- H01 - BASIC ELECTRIC ELEMENTS

Boundary region between core and peripheral circuit region

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Protective structure and fabrication methods for the peripheral cir...

Three-dimensional NOR array including active region pillars and met...

Method for forming a MFMIS memory device

Protective structure and fabrication methods for the peripheral cir...

Three-dimensional semiconductor devices including gate electrodes

Patents Applicationslast 30 patents

Integrated Assemblies and Methods of Forming Integrated Assemblies

THREE-DIMENSIONAL MEMORY DEVICE WITH FINNED SUPPORT PILLAR STRUCTUR...

SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF

METHOD FOR FORMING A MFMIS MEMORY DEVICE

MEMORY DEVICE AND SYSTEM INCLUDING THE SAME

METHOD FOR FORMING A MFMIS MEMORY DEVICE

THREE-DIMENSIONAL NOR ARRAY INCLUDING ACTIVE REGION PILLARS AND ME...

PROTECTIVE STRUCTURE AND FABRICATION METHODS FOR THE PERIPHERAL CIR...

PROTECTIVE STRUCTURE AND FABRICATION METHODS FOR THE PERIPHERAL CIR...