Boundary region between core and peripheral circuit region

Industry

CPC
H01L27/11512

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/11512Boundary region between core and peripheral circuit region

Industries

Patents Grantslast 30 patents

Information Patent Grant
Memory device comprising silicon oxide layer and conductor sharing...
- Patent number 11,557,725
- Issue date Jan 17, 2023
- Kioxia Corporation
- Yoshinori Kumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for fabricating the same
- Patent number 11,342,345
- Issue date May 24, 2022
- SK Hynix Inc.
- Hwang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density vertical thyristor memory cell array with improved iso...
- Patent number 11,282,840
- Issue date Mar 22, 2022
- Kilopass Technology, Inc.
- Harry Luan
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked memory and ASIC device
- Patent number 10,847,523
- Issue date Nov 24, 2020
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,777,424
- Issue date Sep 15, 2020
- Kabushiki Kaisha Toshiba
- Takeo Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming package structures for enhanced memory capacity...
- Patent number 10,734,393
- Issue date Aug 4, 2020
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density vertical thyristor memory cell array with improved iso...
- Patent number 10,535,657
- Issue date Jan 14, 2020
- TC Lab, Inc.
- Harry Luan
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming package structures for enhanced memory capacity...
- Patent number 10,177,161
- Issue date Jan 8, 2019
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, and electronic...
- Patent number 10,090,296
- Issue date Oct 2, 2018
- Sony Corporation
- Takushi Shigetoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having dummy patterns and methods of fabricat...
- Patent number 9,748,257
- Issue date Aug 29, 2017
- Samsung Electronics Co., Ltd.
- Jaehan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data holding device and logic operation circuit using the same
- Patent number 8,837,194
- Issue date Sep 16, 2014
- Rohm Co., Ltd.
- Yoshikazu Fujimori
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device manufacturing method, semiconductor device, an...
- Patent number 8,008,189
- Issue date Aug 30, 2011
- Fujitsu Semiconductor Limited
- Kouichi Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device with memory cells having same character...
- Patent number 6,768,151
- Issue date Jul 27, 2004
- NEC Corporation
- Naoki Kasai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD OF MEMORY DEVICE
- Publication number 20230108500
- Publication date Apr 6, 2023
- KIOXIA Corporation
- Yoshinori KUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230027308
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220254796
- Publication date Aug 11, 2022
- SK HYNIX INC.
- Hwang Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210296329
- Publication date Sep 23, 2021
- SK HYNIX INC.
- Hwang Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Vertical Thyristor Memory Cell Array with Improved Iso...
- Publication number 20200135738
- Publication date Apr 30, 2020
- TC Lab, Inc.
- Harry Luan
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...
- Publication number 20190074281
- Publication date Mar 7, 2019
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Vertical Thyristor Memory Cell Array with Improved Iso...
- Publication number 20180053766
- Publication date Feb 22, 2018
- Kilopass Technology, Inc.
- Harry Luan
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160093627
- Publication date Mar 31, 2016
- FUJITSU SEMICONDUCTOR LIMITED
- Naoya SASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY CELL INCLUDING A FERROELECTRIC CAPACITOR
- Publication number 20160064391
- Publication date Mar 3, 2016
- QUALCOMM Incorporated
- Xia Li
- G11 - INFORMATION STORAGE
Information Patent Application
DATA HOLDING DEVICE AND LOGIC OPERATION CIRCUIT USING THE SAME
- Publication number 20140362632
- Publication date Dec 11, 2014
- Yoshikazu Fujimori
- G11 - INFORMATION STORAGE
Information Patent Application
DATA HOLDING DEVICE AND LOGIC OPERATION CIRCUIT USING THE SAME
- Publication number 20120250392
- Publication date Oct 4, 2012
- Rohm Co., Ltd.
- Yoshikazu Fujimori
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100072525
- Publication date Mar 25, 2010
- Kabushiki Kaisha Toshiba
- Yoshiro Shimojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...
- Publication number 20080197506
- Publication date Aug 21, 2008
- FUJITSU LIMITED
- Kouichi Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor memory device with memory cells having same character...
- Publication number 20030104674
- Publication date Jun 5, 2003
- NEC Corporation
- Naoki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor memory device with memory cells having same character...
- Publication number 20020173111
- Publication date Nov 21, 2002
- NEC Corporation
- Naoki Kasai
- H01 - BASIC ELECTRIC ELEMENTS

Boundary region between core and peripheral circuit region

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory device comprising silicon oxide layer and conductor sharing...

Electronic device and method for fabricating the same

High density vertical thyristor memory cell array with improved iso...

Stacked memory and ASIC device

Method for manufacturing semiconductor device

Methods of forming package structures for enhanced memory capacity...

High density vertical thyristor memory cell array with improved iso...

Methods of forming package structures for enhanced memory capacity...

Semiconductor device, manufacturing method thereof, and electronic...

Semiconductor devices having dummy patterns and methods of fabricat...

Data holding device and logic operation circuit using the same

Semiconductor device manufacturing method, semiconductor device, an...

Semiconductor memory device with memory cells having same character...

Patents Applicationslast 30 patents

MEMORY DEVICE AND MANUFACTURING METHOD OF MEMORY DEVICE

Integrated Assemblies and Methods of Forming Integrated Assemblies

ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

High Density Vertical Thyristor Memory Cell Array with Improved Iso...

METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...

High Density Vertical Thyristor Memory Cell Array with Improved Iso...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DYNAMIC RANDOM ACCESS MEMORY CELL INCLUDING A FERROELECTRIC CAPACITOR

DATA HOLDING DEVICE AND LOGIC OPERATION CIRCUIT USING THE SAME

DATA HOLDING DEVICE AND LOGIC OPERATION CIRCUIT USING THE SAME

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...

Semiconductor memory device with memory cells having same character...

Semiconductor memory device with memory cells having same character...