Brazing of electronic components

Industry

CPC
B23K1/0016

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K1/00Soldering

Current Industry

B23K1/0016Brazing of electronic components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Gas control system and method for a reflow soldering furnace
- Patent number 12,325,089
- Issue date Jun 10, 2025
- Illinois Tool Works Inc.
- Shenghu Yan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling an ejector, and related system
- Patent number 12,318,871
- Issue date Jun 3, 2025
- Mycronic AB
- Gustaf Martensson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High voltage direct insert string lights
- Patent number 12,313,247
- Issue date May 27, 2025
- DONGGUAN YONGFENG LIGHT CO., LTD
- Zhumei Deng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly soldering apparatus and circuit board assemb...
- Patent number 12,303,990
- Issue date May 20, 2025
- HONOR DEVICE CO., LTD.
- Jianqiang Guo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low melting-point bonding member, method for producing same, semico...
- Patent number 12,285,823
- Issue date Apr 29, 2025
- SHINRYO CORPORATION
- Hirotoshi Nishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint
- Patent number 12,275,094
- Issue date Apr 15, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for forming a connection
- Patent number 12,272,669
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Arthur Unrau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vehicular window assembly process with temperature control of the s...
- Patent number 12,269,127
- Issue date Apr 8, 2025
- Magna Exteriors, Inc.
- David M. King
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Space-based circuit-replacing robotic system
- Patent number 12,263,959
- Issue date Apr 1, 2025
- The United States of America as represented by the Secretary of the Navy
- Daniel H. Muhleman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reprint apparatus for circuit board and reprint method using the same
- Patent number 12,262,477
- Issue date Mar 25, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating device and component mounting machine
- Patent number 12,262,480
- Issue date Mar 25, 2025
- FUJI CORPORATION
- Jinya Imura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 12,255,062
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joined body, holding device, and electrostatic chuck
- Patent number 12,251,923
- Issue date Mar 18, 2025
- NITERRA CO., LTD.
- Osamu Yoshimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump forming member, method for manufacturing solder bump fo...
- Patent number 12,246,398
- Issue date Mar 11, 2025
- Resonac Corporation
- Kunihiko Akai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sinter-ready silver films
- Patent number 12,246,376
- Issue date Mar 11, 2025
- Alpha Assembly Solutions Inc.
- Oscar Khaselev
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Circuit board manufacturing method and circuit board manufacturing...
- Patent number 12,250,778
- Issue date Mar 11, 2025
- FUJI CORPORATION
- Kenji Tsukada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,237,297
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Junga Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material, method for producing a solder material of this typ...
- Patent number 12,226,856
- Issue date Feb 18, 2025
- Rogers Germany GmbH
- Stefan Britting
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Synchronous motion selective soldering apparatus and method
- Patent number 12,214,447
- Issue date Feb 4, 2025
- Nordson Corporation
- Gregory E. Goodell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transport system for transporting soldering material through a sold...
- Patent number 12,202,077
- Issue date Jan 21, 2025
- ERSA GmbH
- Uwe Hofmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cartridge for an aerosol-generating system
- Patent number 12,185,758
- Issue date Jan 7, 2025
- ALTRIA CLIENT SERVICES LLC
- Patrick Charles Silvestrini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solar cell panel manufacturing method and paste for solar cell elec...
- Patent number 12,191,405
- Issue date Jan 7, 2025
- JINGAO SOLAR CO., LTD.
- Kyungdong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing device and manufacturing method
- Patent number 12,176,317
- Issue date Dec 24, 2024
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing and repositioning electronic components connect...
- Patent number 12,171,066
- Issue date Dec 17, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Squeegee blade holder with secondary blade mounting apparatus
- Patent number 12,162,096
- Issue date Dec 10, 2024
- Transition Automation, Inc.
- Mark J. Curtin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mask arrangement for a component carrier
- Patent number 12,167,543
- Issue date Dec 10, 2024
- AT&S(Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-type solder ball placement system
- Patent number 12,151,315
- Issue date Nov 26, 2024
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste
- Patent number 12,138,715
- Issue date Nov 12, 2024
- Heraeus Deutschland GmbH & Co. KG
- Lei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250185158
- Publication date Jun 5, 2025
- DOWA METALTECH CO., LTD.
- Seiya YUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTOMATED CONTROL OF AN ELECTRICAL CONNECTION JOINING PROCESS
- Publication number 20250170664
- Publication date May 29, 2025
- BIOSENSE WEBSTER (ISRAEL) LTD.
- ASSAF GOVARI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250167166
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junga LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW FLIP CHIP BONDING TOOL APPARATUS AND OPERATING METHOD THEREOF
- Publication number 20250157979
- Publication date May 15, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Sang Jin KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250144730
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jung Sik PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH VOLTAGE DIRECT INSERT STRING LIGHTS
- Publication number 20250146653
- Publication date May 8, 2025
- DONGGUAN YONGFENG LIGHT CO., LTD
- Zhumei Deng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYNCHRONOUS MOTION SELECTIVE SOLDERING APPARATUS AND METHOD
- Publication number 20250121446
- Publication date Apr 17, 2025
- Nordson Corporation
- Gregory E. Goodell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...
- Publication number 20250113439
- Publication date Apr 3, 2025
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Robotic Cover Sealer
- Publication number 20250112060
- Publication date Apr 3, 2025
- MicroCircuit Laboratories, LLC
- Rich Richardson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARTRIDGE FOR AN AEROSOL-GENERATING SYSTEM
- Publication number 20250089786
- Publication date Mar 20, 2025
- Altria Client Services LLC
- Patrick Charles SILVESTRINI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHARMACEUTICAL SYRUP FORMULATION OR SUSPENSION
- Publication number 20250090669
- Publication date Mar 20, 2025
- Genexa Inc.
- Max Spielberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20250087625
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Young WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REVERSE SOLDERING CONNECTION STRUCTURE OF MICRONEEDLE AND WIRING AN...
- Publication number 20250083243
- Publication date Mar 13, 2025
- WUHAN NEURACOM TECHNOLOGY DEVELOPMENT CO., LTD.
- Li HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAM...
- Publication number 20250073826
- Publication date Mar 6, 2025
- Kabushiki Kaisha Toshiba
- Shota YAMAMOTO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
IMPROVED METHOD AND ARRANGEMENT FOR A MARTENSITE-FREE BRAZING PROCESS
- Publication number 20250073799
- Publication date Mar 6, 2025
- Safetrack Infrasystems SISAB AB
- Bo SVENSSON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-ATTACHED FPC MANUFACTURING METHOD
- Publication number 20250071910
- Publication date Feb 27, 2025
- YAZAKI CORPORATION
- Hidehiko SHIMIZU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Mask Arrangement for a Component Carrier
- Publication number 20250056735
- Publication date Feb 13, 2025
- AT&S (Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...
- Publication number 20250050439
- Publication date Feb 13, 2025
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF CORRECTING WAVE SOLDERING MACHINE
- Publication number 20250041958
- Publication date Feb 6, 2025
- Jabil Inc.
- Charles Santhakumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE METAL BRAZING SUBSTRATE MATERIAL AND METHOD FOR PRODUCING TH...
- Publication number 20250010390
- Publication date Jan 9, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIH-WEI MAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC CONDUIT ASSEMBLIES AND METHODS OF MAKING THEREOF
- Publication number 20250015320
- Publication date Jan 9, 2025
- BLOOM ENERGY CORPORATION
- Michael Petrucha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANNULAR STRUCTURE FOR AN ELECTRONIC FLAME OFF WAND
- Publication number 20250015040
- Publication date Jan 9, 2025
- Western Digital Technologies, Inc.
- Jingyun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIPHENHYDRAMINE SYRUP FORMULATION OR SUSPENSION
- Publication number 20250000984
- Publication date Jan 2, 2025
- Genexa Inc.
- Max Spielberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVA...
- Publication number 20240429108
- Publication date Dec 26, 2024
- MITSUBISHI MATERIALS CORPORATION
- Shujie Fei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEXTROMETHORPHAN AND GUAIFENESIN SYRUP FORMULATION
- Publication number 20240415971
- Publication date Dec 19, 2024
- Genexa Inc.
- Max Spielberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER SOLDERING METHOD USING LASER
- Publication number 20240408687
- Publication date Dec 12, 2024
- S.S.P. INC.
- Heui Jong JU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS
- Publication number 20240414851
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Brazing of electronic components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gas control system and method for a reflow soldering furnace

Method for controlling an ejector, and related system

High voltage direct insert string lights

Circuit board assembly soldering apparatus and circuit board assemb...

Solder material

Low melting-point bonding member, method for producing same, semico...

Solder joint

Arrangement for forming a connection

Vehicular window assembly process with temperature control of the s...

Space-based circuit-replacing robotic system

Reprint apparatus for circuit board and reprint method using the same

Coating device and component mounting machine

Integrate rinse module in hybrid bonding platform

Joined body, holding device, and electrostatic chuck

Solder bump forming member, method for manufacturing solder bump fo...

Sinter-ready silver films

Circuit board manufacturing method and circuit board manufacturing...

Solder reflow apparatus and method of manufacturing an electronic d...

Solder material, method for producing a solder material of this typ...

Synchronous motion selective soldering apparatus and method

Transport system for transporting soldering material through a sold...

Cartridge for an aerosol-generating system

Solar cell panel manufacturing method and paste for solar cell elec...

Semiconductor device manufacturing device and manufacturing method

Method for removing and repositioning electronic components connect...

Squeegee blade holder with secondary blade mounting apparatus

Solder mask arrangement for a component carrier

Solder reflow apparatus and method of manufacturing an electronic d...

Dual-type solder ball placement system

Solder paste

Patents Applicationslast 30 patents

COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

AUTOMATED CONTROL OF AN ELECTRICAL CONNECTION JOINING PROCESS

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

REFLOW FLIP CHIP BONDING TOOL APPARATUS AND OPERATING METHOD THEREOF

SUBSTRATE PROCESSING APPARATUS

HIGH VOLTAGE DIRECT INSERT STRING LIGHTS

SYNCHRONOUS MOTION SELECTIVE SOLDERING APPARATUS AND METHOD

CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...

Robotic Cover Sealer

CARTRIDGE FOR AN AEROSOL-GENERATING SYSTEM

PHARMACEUTICAL SYRUP FORMULATION OR SUSPENSION

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

REVERSE SOLDERING CONNECTION STRUCTURE OF MICRONEEDLE AND WIRING AN...

METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAM...

IMPROVED METHOD AND ARRANGEMENT FOR A MARTENSITE-FREE BRAZING PROCESS

COMPONENT-ATTACHED FPC MANUFACTURING METHOD

Solder Mask Arrangement for a Component Carrier

SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SELF CORRECTING WAVE SOLDERING MACHINE

Advanced Device Assembly Structures And Methods

ACTIVE METAL BRAZING SUBSTRATE MATERIAL AND METHOD FOR PRODUCING TH...

DIELECTRIC CONDUIT ASSEMBLIES AND METHODS OF MAKING THEREOF

ANNULAR STRUCTURE FOR AN ELECTRONIC FLAME OFF WAND

DIPHENHYDRAMINE SYRUP FORMULATION OR SUSPENSION

JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVA...

DEXTROMETHORPHAN AND GUAIFENESIN SYRUP FORMULATION

SOLDER SOLDERING METHOD USING LASER

LOW PRESSURE SINTERING POWDER

PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS