Brazing of electronic components

Industry

CPC
B23K1/0016

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K1/00Soldering

Current Industry

B23K1/0016Brazing of electronic components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Temperature controllable bonder equipment for substrate bonding
- Patent number 12,368,129
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing structure, brazing method, and x-ray tube
- Patent number 12,362,124
- Issue date Jul 15, 2025
- WUHAN UNITED IMAGING HEALTHCARE CO., LTD.
- Qingqing Sheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,349,287
- Issue date Jul 1, 2025
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connectors for an electrical stimulation system and methods of maki...
- Patent number 12,343,547
- Issue date Jul 1, 2025
- Boston Scientific Neuromodulation Corporation
- Thomas Paul Lopez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing laser package
- Patent number 12,347,999
- Issue date Jul 1, 2025
- Nichia Corporation
- Masatoshi Nakagaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing material, bonded body, ceramic circuit board, and method fo...
- Patent number 12,343,820
- Issue date Jul 1, 2025
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus
- Patent number 12,334,468
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using processing oven
- Patent number 12,330,228
- Issue date Jun 17, 2025
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices including vent openings and associated methods
- Patent number 12,334,405
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Michael Stadler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas control system and method for a reflow soldering furnace
- Patent number 12,325,089
- Issue date Jun 10, 2025
- Illinois Tool Works Inc.
- Shenghu Yan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling an ejector, and related system
- Patent number 12,318,871
- Issue date Jun 3, 2025
- Mycronic AB
- Gustaf Martensson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High voltage direct insert string lights
- Patent number 12,313,247
- Issue date May 27, 2025
- DONGGUAN YONGFENG LIGHT CO., LTD
- Zhumei Deng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly soldering apparatus and circuit board assemb...
- Patent number 12,303,990
- Issue date May 20, 2025
- HONOR DEVICE CO., LTD.
- Jianqiang Guo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low melting-point bonding member, method for producing same, semico...
- Patent number 12,285,823
- Issue date Apr 29, 2025
- SHINRYO CORPORATION
- Hirotoshi Nishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint
- Patent number 12,275,094
- Issue date Apr 15, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for forming a connection
- Patent number 12,272,669
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Arthur Unrau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vehicular window assembly process with temperature control of the s...
- Patent number 12,269,127
- Issue date Apr 8, 2025
- Magna Exteriors, Inc.
- David M. King
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Space-based circuit-replacing robotic system
- Patent number 12,263,959
- Issue date Apr 1, 2025
- The United States of America as represented by the Secretary of the Navy
- Daniel H. Muhleman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reprint apparatus for circuit board and reprint method using the same
- Patent number 12,262,477
- Issue date Mar 25, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating device and component mounting machine
- Patent number 12,262,480
- Issue date Mar 25, 2025
- FUJI CORPORATION
- Jinya Imura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 12,255,062
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joined body, holding device, and electrostatic chuck
- Patent number 12,251,923
- Issue date Mar 18, 2025
- NITERRA CO., LTD.
- Osamu Yoshimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump forming member, method for manufacturing solder bump fo...
- Patent number 12,246,398
- Issue date Mar 11, 2025
- Resonac Corporation
- Kunihiko Akai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sinter-ready silver films
- Patent number 12,246,376
- Issue date Mar 11, 2025
- Alpha Assembly Solutions Inc.
- Oscar Khaselev
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Circuit board manufacturing method and circuit board manufacturing...
- Patent number 12,250,778
- Issue date Mar 11, 2025
- FUJI CORPORATION
- Kenji Tsukada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,237,297
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Junga Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material, method for producing a solder material of this typ...
- Patent number 12,226,856
- Issue date Feb 18, 2025
- Rogers Germany GmbH
- Stefan Britting
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Synchronous motion selective soldering apparatus and method
- Patent number 12,214,447
- Issue date Feb 4, 2025
- Nordson Corporation
- Gregory E. Goodell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transport system for transporting soldering material through a sold...
- Patent number 12,202,077
- Issue date Jan 21, 2025
- ERSA GmbH
- Uwe Hofmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR SOLDERING ELECTRONIC DEVICES
- Publication number 20250239563
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kyungdeuk MIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTIVE MEMBER FOR...
- Publication number 20250222533
- Publication date Jul 10, 2025
- Murata Manufacturing Co., Ltd.
- Yasunori HIOKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDERING WIRES OF ELECTRODES TO TIN DOMES AND PADS IN A MULTIELECT...
- Publication number 20250222532
- Publication date Jul 10, 2025
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT PROCESSING APPARATUS
- Publication number 20250218830
- Publication date Jul 3, 2025
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FO...
- Publication number 20250205799
- Publication date Jun 26, 2025
- Resonac Corporation
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SOLDERING ELECTRONIC DEVICES AND METHOD OF MANUFACTURING...
- Publication number 20250205797
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- KYUNGDEUK MIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR BONDING BODIES...
- Publication number 20250201764
- Publication date Jun 19, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Takashi HATTORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY PATTERNED POLYCRYSTALLINE DIAMOND COMPACT FOR SENSING...
- Publication number 20250198861
- Publication date Jun 19, 2025
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Alireza Zolfaghari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250185158
- Publication date Jun 5, 2025
- DOWA METALTECH CO., LTD.
- Seiya YUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTOMATED CONTROL OF AN ELECTRICAL CONNECTION JOINING PROCESS
- Publication number 20250170664
- Publication date May 29, 2025
- BIOSENSE WEBSTER (ISRAEL) LTD.
- ASSAF GOVARI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250167166
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junga LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW FLIP CHIP BONDING TOOL APPARATUS AND OPERATING METHOD THEREOF
- Publication number 20250157979
- Publication date May 15, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Sang Jin KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250144730
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jung Sik PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH VOLTAGE DIRECT INSERT STRING LIGHTS
- Publication number 20250146653
- Publication date May 8, 2025
- DONGGUAN YONGFENG LIGHT CO., LTD
- Zhumei Deng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYNCHRONOUS MOTION SELECTIVE SOLDERING APPARATUS AND METHOD
- Publication number 20250121446
- Publication date Apr 17, 2025
- Nordson Corporation
- Gregory E. Goodell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...
- Publication number 20250113439
- Publication date Apr 3, 2025
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Robotic Cover Sealer
- Publication number 20250112060
- Publication date Apr 3, 2025
- MicroCircuit Laboratories, LLC
- Rich Richardson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARTRIDGE FOR AN AEROSOL-GENERATING SYSTEM
- Publication number 20250089786
- Publication date Mar 20, 2025
- Altria Client Services LLC
- Patrick Charles SILVESTRINI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHARMACEUTICAL SYRUP FORMULATION OR SUSPENSION
- Publication number 20250090669
- Publication date Mar 20, 2025
- Genexa Inc.
- Max Spielberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20250087625
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Young WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REVERSE SOLDERING CONNECTION STRUCTURE OF MICRONEEDLE AND WIRING AN...
- Publication number 20250083243
- Publication date Mar 13, 2025
- WUHAN NEURACOM TECHNOLOGY DEVELOPMENT CO., LTD.
- Li HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAM...
- Publication number 20250073826
- Publication date Mar 6, 2025
- Kabushiki Kaisha Toshiba
- Shota YAMAMOTO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
IMPROVED METHOD AND ARRANGEMENT FOR A MARTENSITE-FREE BRAZING PROCESS
- Publication number 20250073799
- Publication date Mar 6, 2025
- Safetrack Infrasystems SISAB AB
- Bo SVENSSON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-ATTACHED FPC MANUFACTURING METHOD
- Publication number 20250071910
- Publication date Feb 27, 2025
- YAZAKI CORPORATION
- Hidehiko SHIMIZU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Mask Arrangement for a Component Carrier
- Publication number 20250056735
- Publication date Feb 13, 2025
- AT&S (Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...
- Publication number 20250050439
- Publication date Feb 13, 2025
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF CORRECTING WAVE SOLDERING MACHINE
- Publication number 20250041958
- Publication date Feb 6, 2025
- Jabil Inc.
- Charles Santhakumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE METAL BRAZING SUBSTRATE MATERIAL AND METHOD FOR PRODUCING TH...
- Publication number 20250010390
- Publication date Jan 9, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIH-WEI MAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Brazing of electronic components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Temperature controllable bonder equipment for substrate bonding

Brazing structure, brazing method, and x-ray tube

Method for soldering an electronic component to a circuit board by...

Connectors for an electrical stimulation system and methods of maki...

Method for manufacturing laser package

Brazing material, bonded body, ceramic circuit board, and method fo...

Solder reflow apparatus

Method of using processing oven

Electronic devices including vent openings and associated methods

Gas control system and method for a reflow soldering furnace

Method for controlling an ejector, and related system

High voltage direct insert string lights

Circuit board assembly soldering apparatus and circuit board assemb...

Solder material

Low melting-point bonding member, method for producing same, semico...

Solder joint

Arrangement for forming a connection

Vehicular window assembly process with temperature control of the s...

Space-based circuit-replacing robotic system

Reprint apparatus for circuit board and reprint method using the same

Coating device and component mounting machine

Integrate rinse module in hybrid bonding platform

Joined body, holding device, and electrostatic chuck

Solder bump forming member, method for manufacturing solder bump fo...

Sinter-ready silver films

Circuit board manufacturing method and circuit board manufacturing...

Solder reflow apparatus and method of manufacturing an electronic d...

Solder material, method for producing a solder material of this typ...

Synchronous motion selective soldering apparatus and method

Transport system for transporting soldering material through a sold...

Patents Applicationslast 30 patents

APPARATUS FOR SOLDERING ELECTRONIC DEVICES

BONDED STRUCTURE, METHOD FOR PRODUCING SAME, CONDUCTIVE MEMBER FOR...

SOLDERING WIRES OF ELECTRODES TO TIN DOMES AND PADS IN A MULTIELECT...

COMPONENT PROCESSING APPARATUS

SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FO...

METHOD OF SOLDERING ELECTRONIC DEVICES AND METHOD OF MANUFACTURING...

METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR BONDING BODIES...

ELECTRICALLY PATTERNED POLYCRYSTALLINE DIAMOND COMPACT FOR SENSING...

COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

AUTOMATED CONTROL OF AN ELECTRICAL CONNECTION JOINING PROCESS

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

REFLOW FLIP CHIP BONDING TOOL APPARATUS AND OPERATING METHOD THEREOF

SUBSTRATE PROCESSING APPARATUS

HIGH VOLTAGE DIRECT INSERT STRING LIGHTS

SYNCHRONOUS MOTION SELECTIVE SOLDERING APPARATUS AND METHOD

CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...

Robotic Cover Sealer

CARTRIDGE FOR AN AEROSOL-GENERATING SYSTEM

PHARMACEUTICAL SYRUP FORMULATION OR SUSPENSION

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

REVERSE SOLDERING CONNECTION STRUCTURE OF MICRONEEDLE AND WIRING AN...

METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAM...

IMPROVED METHOD AND ARRANGEMENT FOR A MARTENSITE-FREE BRAZING PROCESS

COMPONENT-ATTACHED FPC MANUFACTURING METHOD

Solder Mask Arrangement for a Component Carrier

SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...

SELF CORRECTING WAVE SOLDERING MACHINE

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

Advanced Device Assembly Structures And Methods

ACTIVE METAL BRAZING SUBSTRATE MATERIAL AND METHOD FOR PRODUCING TH...