Brazing of electronic components

Industry

CPC
B23K1/0016

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K1/00Soldering

Current Industry

B23K1/0016Brazing of electronic components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for removing and repositioning electronic components connect...
- Patent number 12,171,066
- Issue date Dec 17, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Squeegee blade holder with secondary blade mounting apparatus
- Patent number 12,162,096
- Issue date Dec 10, 2024
- Transition Automation, Inc.
- Mark J. Curtin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mask arrangement for a component carrier
- Patent number 12,167,543
- Issue date Dec 10, 2024
- AT&S(Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-type solder ball placement system
- Patent number 12,151,315
- Issue date Nov 26, 2024
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste
- Patent number 12,138,715
- Issue date Nov 12, 2024
- Heraeus Deutschland GmbH & Co. KG
- Lei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor processing equipment with high temperature resistant...
- Patent number 12,128,494
- Issue date Oct 29, 2024
- Watlow Electric Manufacturing Company
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multifunctional sintering or diffusion soldering device and pressin...
- Patent number 12,121,987
- Issue date Oct 22, 2024
- Pink GmbH Thermosysteme
- Christoph Oetzel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier for preventing SMD components from drifting
- Patent number 12,127,350
- Issue date Oct 22, 2024
- ZKW GROUP GMBH
- Christoph Haiden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric conduit assemblies and methods of making thereof
- Patent number 12,119,521
- Issue date Oct 15, 2024
- BLOOM ENERGY CORPORATION
- Michael Petrucha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering apparatus
- Patent number 12,115,591
- Issue date Oct 15, 2024
- ERSA GmbH
- Lothar Endreß
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat radiation member
- Patent number 12,112,993
- Issue date Oct 8, 2024
- A.L.M.T. Corp.
- Ryota Matsugi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount technology method and magnetic carrier system
- Patent number 12,114,435
- Issue date Oct 8, 2024
- SanDisk Technologies, Inc.
- Virgil Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering apparatus
- Patent number 12,097,575
- Issue date Sep 24, 2024
- ERSA GmbH
- Lothar Endreß
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a vehicle glass assembly
- Patent number 12,091,729
- Issue date Sep 17, 2024
- ACR II GLASS AMERICA INC.
- Olivier Farreyrol
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing photovoltaic (PV) module
- Patent number 12,087,875
- Issue date Sep 10, 2024
- Jiangsu Coop&Inno Green Energy Technology Co., Ltd.
- Yujun Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered bonding material, semiconductor package, and power module
- Patent number 12,080,671
- Issue date Sep 3, 2024
- Senju Metal Industry Co., Ltd.
- Naoto Kameda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connection by brazing enabling improved fatigue resistan...
- Patent number 12,070,812
- Issue date Aug 27, 2024
- MBDA France
- Eric Cadalen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow oven with a zeolite box, and a method for recovering gas wit...
- Patent number 12,064,828
- Issue date Aug 20, 2024
- Illinois Tool Works Inc.
- Chuanbo Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding systems, and methods of providing a reducing gas on a bondi...
- Patent number 12,062,636
- Issue date Aug 13, 2024
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device including laser heating of gripper for repairing...
- Patent number 12,048,972
- Issue date Jul 30, 2024
- PAC Tech-Packaging Technologies GmbH
- Thorsten Krause
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly process using multiple solders and a...
- Patent number 12,035,483
- Issue date Jul 9, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for stacking printed circuit board
- Patent number 12,035,474
- Issue date Jul 9, 2024
- Chiun Mai Communication Systems, Inc.
- Chi-Yi Liao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEXTROMETHORPHAN AND GUAIFENESIN SYRUP FORMULATION
- Publication number 20240415971
- Publication date Dec 19, 2024
- Genexa Inc.
- Max Spielberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER SOLDERING METHOD USING LASER
- Publication number 20240408687
- Publication date Dec 12, 2024
- S.S.P. INC.
- Heui Jong JU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS
- Publication number 20240414851
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWITCHING BOARD AND SOLDERING METHOD THEREOF
- Publication number 20240407126
- Publication date Dec 5, 2024
- AEWIN TECHNOLOGIES CO., LTD.
- Cheng-En LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...
- Publication number 20240407096
- Publication date Dec 5, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Ihab KHOURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER-FREE JOINT AND WELDING METHOD THEREOF
- Publication number 20240391009
- Publication date Nov 28, 2024
- SHANGHAI JIAO TONG UNIVERSITY
- Zhen HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LITHIUM BATTERY, CELL AND CELL REPLACING METHOD THEREOF
- Publication number 20240387954
- Publication date Nov 21, 2024
- AMITA TECHNOLOGIES INC.
- Yuan-Li CHIANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...
- Publication number 20240381539
- Publication date Nov 14, 2024
- MAHLE International GmbH
- Matthias Tuerpe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME
- Publication number 20240375251
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chu WU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL OF A PREHEATING PROCESS IN A SOLDERING MACHINE
- Publication number 20240359246
- Publication date Oct 31, 2024
- Illinois Tool Works Inc.
- Antonie Cornelis Colijn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDI...
- Publication number 20240363580
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240365475
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A BIOLOGICAL FLUID SENSOR
- Publication number 20240341735
- Publication date Oct 17, 2024
- CoreSyte, Inc.
- Adam Pizer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE STENCIL MASK AND A STENCIL PRINTING METHOD
- Publication number 20240343055
- Publication date Oct 17, 2024
- STATS ChipPAC Pte Ltd.
- HyunSeok PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIFUNCTIONAL SINTERING OR DIFFUSION SOLDERING DEVICE AND PRESSIN...
- Publication number 20240335896
- Publication date Oct 10, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...
- Publication number 20240341040
- Publication date Oct 10, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240293884
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMB...
- Publication number 20240269759
- Publication date Aug 15, 2024
- Honor Device Co., Ltd.
- Jianqiang GUO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE
- Publication number 20240268036
- Publication date Aug 8, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shingo OKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ASSEMBLING SUBSTRATE SUPPORTING APPARATUS
- Publication number 20240261882
- Publication date Aug 8, 2024
- WONIK IPS CO., LTD.
- Kyu Tae CHO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AGAVE SYRUP FORMULATION OR SUSPENSION FOR ACTIVE PHARMACEUTICAL AGENTS
- Publication number 20240258060
- Publication date Aug 1, 2024
- Genenxa Inc.
- Max Spielberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING STRUCTURE, BATTERY UNIT, AND MANUFACTURING METHOD OF COOLIN...
- Publication number 20240250336
- Publication date Jul 25, 2024
- NIPPON STEEL CORPORATION
- Shinji KODAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240238913
- Publication date Jul 18, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR CIRCUIT BOARD ASSEMBLY
- Publication number 20240237227
- Publication date Jul 11, 2024
- NGK Insulators, Ltd.
- Yukinobu YURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIR OF SOLDER BUMPS
- Publication number 20240222302
- Publication date Jul 4, 2024
- ORBOTECH LTD.
- Zvi KOTLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Brazing of electronic components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for removing and repositioning electronic components connect...

Squeegee blade holder with secondary blade mounting apparatus

Solder mask arrangement for a component carrier

Solder reflow apparatus and method of manufacturing an electronic d...

Dual-type solder ball placement system

Solder paste

Semiconductor processing equipment with high temperature resistant...

Multifunctional sintering or diffusion soldering device and pressin...

Barrier for preventing SMD components from drifting

Bonded body, ceramic copper circuit substrate, and semiconductor de...

Dielectric conduit assemblies and methods of making thereof

Soldering apparatus

Low pressure sintering powder

Heat radiation member

Surface mount technology method and magnetic carrier system

Ceramic-copper composite, ceramic circuit board, power module, and...

System and method for creating orthogonal solder interconnects

Soldering apparatus

Method of producing a vehicle glass assembly

Diffusion soldering with contaminant protection

Method for manufacturing photovoltaic (PV) module

Layered bonding material, semiconductor package, and power module

Method for connection by brazing enabling improved fatigue resistan...

Reflow oven with a zeolite box, and a method for recovering gas wit...

Bonding systems, and methods of providing a reducing gas on a bondi...

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Method and device including laser heating of gripper for repairing...

Printed circuit board assembly process using multiple solders and a...

Method and system for stacking printed circuit board

Method for soldering an electronic component to a circuit board by...

Patents Applicationslast 30 patents

DEXTROMETHORPHAN AND GUAIFENESIN SYRUP FORMULATION

LOW PRESSURE SINTERING POWDER

SOLDER SOLDERING METHOD USING LASER

PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS

SWITCHING BOARD AND SOLDERING METHOD THEREOF

ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...

SOLDER-FREE JOINT AND WELDING METHOD THEREOF

LITHIUM BATTERY, CELL AND CELL REPLACING METHOD THEREOF

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...

DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME

Method for Soldering an Electronic Component to a Circuit Board by...

CONTROL OF A PREHEATING PROCESS IN A SOLDERING MACHINE

BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDI...

Lead-Free Solder Ball

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

METHOD FOR MANUFACTURING A BIOLOGICAL FLUID SENSOR

SELECTIVE STENCIL MASK AND A STENCIL PRINTING METHOD

MULTIFUNCTIONAL SINTERING OR DIFFUSION SOLDERING DEVICE AND PRESSIN...

PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

Printed Circuit Board And Method For Soldering A Chip Housing In A...

CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMB...

METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE

METHOD OF ASSEMBLING SUBSTRATE SUPPORTING APPARATUS

AGAVE SYRUP FORMULATION OR SUSPENSION FOR ACTIVE PHARMACEUTICAL AGENTS

COOLING STRUCTURE, BATTERY UNIT, AND MANUFACTURING METHOD OF COOLIN...

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

PRODUCTION METHOD FOR CIRCUIT BOARD ASSEMBLY

REPAIR OF SOLDER BUMPS