by applying an anisotropic conductive adhesive layer over an array of pads

Industry

CPC
H05K3/323

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/323by applying an anisotropic conductive adhesive layer over an array of pads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,058,817
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Hayoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor unit, method of manufacturing the same, and electroni...
- Patent number 12,010,887
- Issue date Jun 11, 2024
- Sony Group Corporation
- Hironobu Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,985,763
- Issue date May 14, 2024
- E Ink Holdings Inc.
- Kuan-Yi Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 11,947,227
- Issue date Apr 2, 2024
- Samsung Display Co., Ltd.
- Ha Young Choi
- G02 - OPTICS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,923,335
- Issue date Mar 5, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Profiled thermode
- Patent number 11,910,533
- Issue date Feb 20, 2024
- Pragmatic Printing Ltd
- Neil Davies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board, joined body, pressure sensor and mas...
- Patent number 11,895,776
- Issue date Feb 6, 2024
- Hitachi Metals, Ltd.
- Takahiro Umeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit formation method
- Patent number 11,849,545
- Issue date Dec 19, 2023
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assemblies
- Patent number 11,805,602
- Issue date Oct 31, 2023
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing anisotropic conductive film and anisotropic con...
- Patent number 11,787,976
- Issue date Oct 17, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,784,154
- Issue date Oct 10, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,742,357
- Issue date Aug 29, 2023
- Samsung Display Co., Ltd.
- Hyun Seop Song
- G02 - OPTICS
Information Patent Grant
Filler disposition film
- Patent number 11,732,105
- Issue date Aug 22, 2023
- Dexerials Corporation
- Yasushi Akutsu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,710,716
- Issue date Jul 25, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery pack
- Patent number 11,695,183
- Issue date Jul 4, 2023
- Samsung SDI Co., Ltd.
- Sanghun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,614,663
- Issue date Mar 28, 2023
- Samsung Display Co., Ltd.
- Jingwan Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible display apparatus
- Patent number 11,604,389
- Issue date Mar 14, 2023
- E Ink Holdings Inc.
- Lih-Hsiung Chan
- G02 - OPTICS
Information Patent Grant
Anisotropic conductive film
- Patent number 11,591,499
- Issue date Feb 28, 2023
- Dexerials Corporation
- Daisuke Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,528,805
- Issue date Dec 13, 2022
- Samsung Display Co., Ltd.
- Chang Woo Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device
- Patent number 11,528,807
- Issue date Dec 13, 2022
- Samsung Display Co., Ltd.
- Jungseon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and chip-on-film structure thereof
- Patent number 11,515,243
- Issue date Nov 29, 2022
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Jing Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a roll of flexible carrier for electronic...
- Patent number 11,412,620
- Issue date Aug 9, 2022
- Linxens Holding
- Christophe Mathieu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with embedded component carrier
- Patent number 11,410,965
- Issue date Aug 9, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,404,391
- Issue date Aug 2, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods for manufacturing a plurality of electronic circuits
- Patent number 11,406,023
- Issue date Aug 2, 2022
- Pragmatic Printing Ltd
- Richard Price
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,348,891
- Issue date May 31, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of surface-mounting components
- Patent number 11,342,489
- Issue date May 24, 2022
- DST Innovations Limited
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 11,309,270
- Issue date Apr 19, 2022
- Dexerials Corporation
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240341036
- Publication date Oct 10, 2024
- Darwin Precisions Corporation
- Yi Feng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE STRUCTURE, LENS MODULE AND ELECTRONIC DEVICE
- Publication number 20240292545
- Publication date Aug 29, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- FEI-FAN YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE PACKAGING STRUCTURE AND ELECTRONIC DEVICE HAVING THE...
- Publication number 20240224419
- Publication date Jul 4, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- KUEI-FENG PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240196533
- Publication date Jun 13, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Youn Gyu Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT STRUCTURE FOR HOT-PRESS BONDING
- Publication number 20230422405
- Publication date Dec 28, 2023
- SuperC-Touch Corporation
- Hsiang-Yu LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT ASSEMBLIES, METHODS OF MANUFACTURING THE SAME, A...
- Publication number 20230422404
- Publication date Dec 28, 2023
- PRAGMATIC SEMICONDUCTOR LIMITED
- Richard PRICE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR BONDING METHOD
- Publication number 20230209724
- Publication date Jun 29, 2023
- Seong Ryong AN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20230159797
- Publication date May 25, 2023
- DEXERIALS CORPORATION
- Daisuke SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING AN ANISOTROPIC CONDUCTIVE FILM
- Publication number 20230157109
- Publication date May 18, 2023
- SAMSUNG DISPLAY CO., LTD.
- CHUNG SEOK LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220397787
- Publication date Dec 15, 2022
- SAMSUNG DISPLAY CO., LTD.
- Ha Young CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220386476
- Publication date Dec 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- HAYOUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME
- Publication number 20220262760
- Publication date Aug 18, 2022
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR UNIT, METHOD OF MANUFACTURING THE SAME, AND ELECTRONI...
- Publication number 20220181430
- Publication date Jun 9, 2022
- SONY GROUP CORPORATION
- Hironobu Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20220084975
- Publication date Mar 17, 2022
- DEXERIALS CORPORATION
- Reiji TSUKAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP ASSEMBLIES
- Publication number 20220078914
- Publication date Mar 10, 2022
- Intel Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED WIRING BOARD, JOINED BODY, PRESSURE SENSOR AND MAS...
- Publication number 20220039262
- Publication date Feb 3, 2022
- Hitachi Metals, Ltd.
- Takahiro Umeyama
- G05 - CONTROLLING REGULATING
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE
- Publication number 20220020724
- Publication date Jan 20, 2022
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE ADHESIVE AND A BONDING METHOD OF CIRCUIT BOARD
- Publication number 20210348037
- Publication date Nov 11, 2021
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Siheng GAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROFILED THERMODE
- Publication number 20210307225
- Publication date Sep 30, 2021
- PRAGMATIC PRINTING LTD.
- Neil DAVIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
- Publication number 20210305201
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20210289632
- Publication date Sep 16, 2021
- SAMSUNG DISPLAY CO., LTD.
- JUNGSEON PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20210280548
- Publication date Sep 9, 2021
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210274653
- Publication date Sep 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chang Woo BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210263367
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- JINGWAN JANG
- G02 - OPTICS
Information Patent Application
Methods for Manufacturing a Roll Medium for Electronic Components,...
- Publication number 20210251084
- Publication date Aug 12, 2021
- Linxens Holding
- Christophe MATHIEU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK
- Publication number 20210203030
- Publication date Jul 1, 2021
- Samsung SDI Co., Ltd.
- Sanghun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PACK
- Publication number 20210203031
- Publication date Jul 1, 2021
- Samsung SDI Co., Ltd.
- Sanghun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST APPROACH FOR DEPOSITING SOLDER AND ADHESIVES IN A PATTERN...
- Publication number 20210197325
- Publication date Jul 1, 2021
- Raytheon Company
- Sergio V. Martinez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20210161016
- Publication date May 27, 2021
- SAMSUNG DISPLAY CO., LTD.
- John PARK
- G06 - COMPUTING CALCULATING COUNTING

by applying an anisotropic conductive adhesive layer over an array of pads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection structure and manufacturing method therefor

Electronic device and method of manufacturing the same

Semiconductor unit, method of manufacturing the same, and electroni...

Electronic device

Display device

Anisotropic conductive film and connected structure

Profiled thermode

Flexible printed wiring board, joined body, pressure sensor and mas...

Circuit formation method

Chip assemblies

Bonding apparatus and method of fabricating display device using th...

Method of producing anisotropic conductive film and anisotropic con...

Anisotropic conductive film and method of producing the same

Display device

Filler disposition film

Anisotropic conductive film and method of producing the same

Battery pack

Display device and manufacturing method thereof

Flexible display apparatus

Anisotropic conductive film

Display device and method of manufacturing the same

Bonding device

Display device and chip-on-film structure thereof

Process for manufacturing a roll of flexible carrier for electronic...

Electronic device with embedded component carrier

Anisotropic conductive film and method of producing the same

Methods for manufacturing a plurality of electronic circuits

Anisotropic conductive film and method of producing the same

Method of surface-mounting components

Anisotropic conductive film and production method of the same

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

ANISOTROPIC CONDUCTIVE STRUCTURE, LENS MODULE AND ELECTRONIC DEVICE

CAMERA MODULE PACKAGING STRUCTURE AND ELECTRONIC DEVICE HAVING THE...

PRINTED CIRCUIT BOARD

CIRCUIT STRUCTURE FOR HOT-PRESS BONDING

ELECTRONIC CIRCUIT ASSEMBLIES, METHODS OF MANUFACTURING THE SAME, A...

CONDUCTOR BONDING METHOD

ANISOTROPIC CONDUCTIVE FILM

DISPLAY DEVICE INCLUDING AN ANISOTROPIC CONDUCTIVE FILM

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

DISPLAY DEVICE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR UNIT, METHOD OF MANUFACTURING THE SAME, AND ELECTRONI...

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

CHIP ASSEMBLIES

FLEXIBLE PRINTED WIRING BOARD, JOINED BODY, PRESSURE SENSOR AND MAS...

ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE

CONDUCTIVE ADHESIVE AND A BONDING METHOD OF CIRCUIT BOARD

PROFILED THERMODE

BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...

BONDING DEVICE

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Methods for Manufacturing a Roll Medium for Electronic Components,...

BATTERY PACK

BATTERY PACK

LOW COST APPROACH FOR DEPOSITING SOLDER AND ADHESIVES IN A PATTERN...

FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME