by casting or moulding of conductive material

Industry

CPC
H05K3/101

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/101by casting or moulding of conductive material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuits using thick metals and machined bu...
- Patent number 11,950,373
- Issue date Apr 2, 2024
- Lockheed Martin Corporation
- Marc T. Angelucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded magnetic inlay and integrated coil...
- Patent number 11,792,932
- Issue date Oct 17, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded interconnect device
- Patent number 11,728,065
- Issue date Aug 15, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,715,579
- Issue date Aug 1, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier for electrical/electronic parts for attachment in...
- Patent number 11,401,740
- Issue date Aug 2, 2022
- Kiekert AG
- Sascha Maciolowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) integrated circuit (IC) integration of an em...
- Patent number 11,310,911
- Issue date Apr 19, 2022
- QUALCOMM Incorporated
- Stanley Seungchul Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin substrate and electronic device
- Patent number 11,291,110
- Issue date Mar 29, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Apparatus for making wiring board
- Patent number 11,140,783
- Issue date Oct 5, 2021
- Toyota Jidosha Kabushiki Kaisha
- Takeshi Zaigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Touch sensor and manufacturing method thereof
- Patent number 11,086,465
- Issue date Aug 10, 2021
- SAMSUNG DISPLAY CO., LTD.
- Won Il Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array-type electrode, digital printing mold and method for manufact...
- Patent number 10,913,301
- Issue date Feb 9, 2021
- Industrial Technology Research Institute
- Wei-Yuan Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Interior member for vehicle
- Patent number 10,850,682
- Issue date Dec 1, 2020
- Toyota Jidosha Kabushiki Kaisha
- Madoka Doi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device and rear-view device
- Patent number 10,723,293
- Issue date Jul 28, 2020
- SMR Patents S.a.r.l.
- Andreas Herrmann
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Touch sensor and manufacturing method thereof
- Patent number 10,558,303
- Issue date Feb 11, 2020
- Samsung Display Co., Ltd.
- Won Il Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System for pressing pre-tin shaping
- Patent number 10,512,172
- Issue date Dec 17, 2019
- Tyco Electronics (Dongguan) Co., Ltd.
- Hongzhou Shen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing film
- Patent number 10,338,467
- Issue date Jul 2, 2019
- Canon Kabushiki Kaisha
- Toshiki Ito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Filling method of conductive paste and manufacturing method of mult...
- Patent number 10,321,578
- Issue date Jun 11, 2019
- Nippon Mektron, Ltd.
- Shoji Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuits using thick metals and machined bu...
- Patent number 10,285,277
- Issue date May 7, 2019
- Lockheed Martin Corporation
- Marc T. Angelucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic component with at least one electrical contact element and...
- Patent number 10,237,972
- Issue date Mar 19, 2019
- Krallmann Kunststoffverarbeitung GmbH
- Eduard Engelmann
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Composite and nanowire conduit
- Patent number 10,177,471
- Issue date Jan 8, 2019
- The Boeing Company
- Jonathan Emrys
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Fabrication of intra-structure conductive traces and interconnects...
- Patent number 10,039,195
- Issue date Jul 31, 2018
- Facebook, Inc.
- Baback Elmieh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing an electric product
- Patent number 9,949,375
- Issue date Apr 17, 2018
- WONDER FUTURE CORPORATION
- Akira Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Transparent conductor, method of manufacturing the same, and electr...
- Patent number 9,615,454
- Issue date Apr 4, 2017
- Samsung Electronics Co., Ltd.
- Se Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 9,532,462
- Issue date Dec 27, 2016
- LG Innotek Co., Ltd
- Yeong Uk Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing metal wiring buried flexible substrate by...
- Patent number 9,510,457
- Issue date Nov 29, 2016
- Korea Institute of Machinery and Minerals
- Jae Wook Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible flat circuit
- Patent number 9,504,142
- Issue date Nov 22, 2016
- Yazaki Corporation
- Hisashi Hanazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire grid structure having grid patterns and a sacrificial layer
- Patent number 9,456,501
- Issue date Sep 27, 2016
- LG Innotek Co., Ltd
- Young Jae Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ecological method for constructing circuit boards
- Patent number 9,456,507
- Issue date Sep 27, 2016
- The Boeing Company
- Donald F. Wilkins
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD
- Publication number 20240268027
- Publication date Aug 8, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240179850
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Chunghyo JUNG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...
- Publication number 20230007781
- Publication date Jan 5, 2023
- FUJIKURA LTD.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220394843
- Publication date Dec 8, 2022
- FUJIFILM CORPORATION
- Genya TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220394842
- Publication date Dec 8, 2022
- FUJIFILM CORPORATION
- Genya TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES WITH DEFORMABLE CONDUCTORS
- Publication number 20220270961
- Publication date Aug 25, 2022
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20220059436
- Publication date Feb 24, 2022
- SAMTEC, INC.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Interconnect Device
- Publication number 20220037050
- Publication date Feb 3, 2022
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20220033317
- Publication date Feb 3, 2022
- DOWA METALTECH CO, LTD.
- Koji Kobayashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) INTEGRATION OF AN EM...
- Publication number 20220022315
- Publication date Jan 20, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Device
- Publication number 20210265075
- Publication date Aug 26, 2021
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Magnetic Inlay and Integrated Coil...
- Publication number 20210195749
- Publication date Jun 24, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20210014962
- Publication date Jan 14, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20200174600
- Publication date Jun 4, 2020
- SAMSUNG DISPLAY CO., LTD.
- Won Il CHOI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING CIRCUITS USING THICK METALS AND MACHINED BU...
- Publication number 20190261516
- Publication date Aug 22, 2019
- Lockheed Martin Corporation
- Marc T. Angelucci
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER FOR ELECTRICAL/ELECTRONIC PARTS FOR ATTACHMENT IN...
- Publication number 20190194984
- Publication date Jun 27, 2019
- KIEKERT AG
- Sascha Maciolowski
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
WIRING BODY, WIRING BOARD, TOUCH SENSOR, AND MANUFACTURING METHOD O...
- Publication number 20190163298
- Publication date May 30, 2019
- FUJIKURA LTD.
- Takeshi SHIOJIRI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ARRAY-TYPE ELECTRODE, DIGITAL PRINTING MOLD AND METHOD FOR MANUFACT...
- Publication number 20190135010
- Publication date May 9, 2019
- Industrial Technology Research Institute
- WEI-YUAN CHEN
- B32 - LAYERED PRODUCTS
Information Patent Application
System and Method For Pressing Pre-Tin Shaping
- Publication number 20170118845
- Publication date Apr 27, 2017
- Tyco Electronics (Dongguan) Co., Ltd.
- Hongzhou Shen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT PACKAGE WITH BOND WIRES TO PROVIDE INTERNAL SHIELDING BETWE...
- Publication number 20170118877
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally Conductive Circuit Board Substrate and Method of Manufacture
- Publication number 20170084810
- Publication date Mar 23, 2017
- Raul A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOUCH SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20170060299
- Publication date Mar 2, 2017
- SAMSUNG DISPLAY CO., LTD.
- Won Il CHOI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High-Density Soft-Matter Electronics
- Publication number 20160234931
- Publication date Aug 11, 2016
- CARNEGIE MELLON UNIVERSITY, a Pennsylvania Non-Pro fit Corporation
- Carmel Majidi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE AND NANOWIRE CONDUIT
- Publication number 20160141773
- Publication date May 19, 2016
- The Boeing Company
- Jonathan Emrys
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...
- Publication number 20160135302
- Publication date May 12, 2016
- IBIDEN CO., LTD.
- Naoyuki NAGAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL PRODUCT MANUFACTURING METHOD
- Publication number 20160105972
- Publication date Apr 14, 2016
- WONDER FUTURE CORPORATION
- Akira SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILLING METHOD OF CONDUCTIVE PASTE AND MANUFACTURING METHOD OF MULT...
- Publication number 20160095227
- Publication date Mar 31, 2016
- NIPPON MEKTRON, LTD.
- Shoji TAKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a three-dimensional circuit configuration and...
- Publication number 20150289381
- Publication date Oct 8, 2015
- ROBERT BOSCH GmbH
- Peter DIESEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDED PRODUCT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150103503
- Publication date Apr 16, 2015
- NISSHA PRINTING CO., LTD.
- Seiichi Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART MANUFACTURING METHOD AND ELECTRONIC PART MANUFACTUR...
- Publication number 20150101850
- Publication date Apr 16, 2015
- DIC CORPORATION
- Masayoshi KOTAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by casting or moulding of conductive material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board and method for manufacturing wiring board

Method of manufacturing circuits using thick metals and machined bu...

Component carrier with embedded magnetic inlay and integrated coil...

Molded interconnect device

Electronic device

Method of fabricating a glass substrate with a plurality of vias

Component carrier for electrical/electronic parts for attachment in...

Three-dimensional (3D) integrated circuit (IC) integration of an em...

Resin substrate and electronic device

Filling materials and methods of filling through holes of a substrate

Apparatus for making wiring board

Touch sensor and manufacturing method thereof

Array-type electrode, digital printing mold and method for manufact...

Interior member for vehicle

Electronic device and rear-view device

Touch sensor and manufacturing method thereof

System for pressing pre-tin shaping

Method of producing film

Filling method of conductive paste and manufacturing method of mult...

Method of manufacturing circuits using thick metals and machined bu...

Plastic component with at least one electrical contact element and...

Composite and nanowire conduit

Fabrication of intra-structure conductive traces and interconnects...

Method for manufacturing an electric product

Transparent conductor, method of manufacturing the same, and electr...

Printed circuit board and manufacturing method thereof

Methods of manufacturing metal wiring buried flexible substrate by...

Flexible flat circuit

Nanowire grid structure having grid patterns and a sacrificial layer

Ecological method for constructing circuit boards

Patents Applicationslast 30 patents

CIRCUIT BOARD

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

STRUCTURES WITH DEFORMABLE CONDUCTORS

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

Molded Interconnect Device

ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) INTEGRATION OF AN EM...

Electronic Device

Component Carrier With Embedded Magnetic Inlay and Integrated Coil...

RESIN SUBSTRATE AND ELECTRONIC DEVICE

TOUCH SENSOR AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING CIRCUITS USING THICK METALS AND MACHINED BU...

COMPONENT CARRIER FOR ELECTRICAL/ELECTRONIC PARTS FOR ATTACHMENT IN...

WIRING BODY, WIRING BOARD, TOUCH SENSOR, AND MANUFACTURING METHOD O...

ARRAY-TYPE ELECTRODE, DIGITAL PRINTING MOLD AND METHOD FOR MANUFACT...

System and Method For Pressing Pre-Tin Shaping

CIRCUIT PACKAGE WITH BOND WIRES TO PROVIDE INTERNAL SHIELDING BETWE...

Thermally Conductive Circuit Board Substrate and Method of Manufacture

TOUCH SENSOR AND MANUFACTURING METHOD THEREOF

High-Density Soft-Matter Electronics

COMPOSITE AND NANOWIRE CONDUIT

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...

ELECTRICAL PRODUCT MANUFACTURING METHOD

FILLING METHOD OF CONDUCTIVE PASTE AND MANUFACTURING METHOD OF MULT...

Method for producing a three-dimensional circuit configuration and...

INJECTION MOLDED PRODUCT AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC PART MANUFACTURING METHOD AND ELECTRONIC PART MANUFACTUR...