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H01L21/32133

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32133by chemical means only

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Select gate spacer formation to facilitate embedding of split gate...
- Patent number 12,356,673
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structures for semiconductor devices
- Patent number 12,328,930
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device structure
- Patent number 12,328,897
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,315,726
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,310,002
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,300,484
- Issue date May 13, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Yuichi Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source leakage current suppression by source surrounding gate struc...
- Patent number 12,278,272
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Aurelien Gauthier Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing conductors for semiconductor device
- Patent number 12,278,230
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer photo etching mask including organic and inorganic mate...
- Patent number 12,272,553
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etch apparatus
- Patent number 12,249,520
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating contact structure
- Patent number 12,237,218
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,237,398
- Issue date Feb 25, 2025
- United Microelectronics Corp.
- Chia-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,207,470
- Issue date Jan 21, 2025
- Kioxia Corporation
- Shinya Arai
- G11 - INFORMATION STORAGE
Information Patent Grant
Etch method for opening a source line in flash memory
- Patent number 12,193,227
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating metal gate devices and resulting structures
- Patent number 12,159,916
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 12,142,520
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal method to integrate non-volatile memory (NVM) into logic or bi...
- Patent number 12,144,173
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Bo Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing electronic structures
- Patent number 12,136,632
- Issue date Nov 5, 2024
- Pragmatic Printing Ltd
- Richard Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned interconnect structure
- Patent number 12,136,567
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,132,050
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of modulating stress of dielectric layers
- Patent number 12,125,911
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Block-on-block memory array architecture using bi-directional stair...
- Patent number 12,114,499
- Issue date Oct 8, 2024
- Lodestar Licensing Group LLC
- Aaron S. Yip
- G11 - INFORMATION STORAGE
Information Patent Grant
Staircase structures for electrically connecting multiple horizonta...
- Patent number 12,096,630
- Issue date Sep 17, 2024
- SUNRISE MEMORY CORPORATION
- Raul Adrian Cernea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,087,637
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with air gap
- Patent number 12,087,620
- Issue date Sep 10, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Access line formation for a memory array
- Patent number 12,082,424
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Andrea Redaelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate cut with integrated etch stop layer
- Patent number 12,074,165
- Issue date Aug 27, 2024
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR
- Publication number 20250240981
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyun-Ying LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION STRUCTURE FOR COUPLING BOILING ENHANCED LAYER TO SUBS...
- Publication number 20250226216
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chihting Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH TOPVIA
- Publication number 20250226319
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Gideon Oyibo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE LEAKAGE CURRENT SUPPRESSION BY SOURCE SURROUNDING GATE STRUC...
- Publication number 20250212484
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Aurelien Gauthier Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER PHOTO ETCHING MASK INCLUDING ORGANIC AND INORGANIC MATE...
- Publication number 20250201556
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250169140
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Chia-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING CONTACT STRUCTURE
- Publication number 20250167045
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT WITH INTEGRATED ETCH STOP LAYER
- Publication number 20250142949
- Publication date May 1, 2025
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250120083
- Publication date Apr 10, 2025
- KIOXIA Corporation
- Shinya ARAI
- G11 - INFORMATION STORAGE
Information Patent Application
ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY
- Publication number 20250098160
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION
- Publication number 20250096041
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITORS WITH IMPROVED RELIABILITY
- Publication number 20250089277
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS LINE FORMATION FOR A MEMORY ARRAY
- Publication number 20250031383
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Andrea Redaelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250006801
- Publication date Jan 2, 2025
- SK HYNIX INC.
- Young Gwang YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCK-ON-BLOCK MEMORY ARRAY ARCHITECTURE USING BI-DIRECTIONAL STAIR...
- Publication number 20240431110
- Publication date Dec 26, 2024
- Lodestar Licensing Group LLC
- Aaron S. Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER REFLOW BY SURFACE MODIFICATION
- Publication number 20240420966
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THEREOF
- Publication number 20240413014
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240413080
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Naoyuki OHSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH APPARATUS
- Publication number 20240395572
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Ting LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240395550
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Tien SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING METAL GATE DEVICES AND RESULTING STRUCTURES
- Publication number 20240387678
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MODULATING STRESS OF DIELECTRIC LAYERS
- Publication number 20240387729
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Self-Aligned Interconnect Structure
- Publication number 20240379434
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240371869
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240363424
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240355642
- Publication date Oct 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Chuan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONTAINING A DECOY STRUCTURE
- Publication number 20240347481
- Publication date Oct 17, 2024
- STMicroelectronics (Rousset) SAS
- Julien Delalleau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240347612
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SZU-YU WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240306369
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240290718
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS

by chemical means only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Select gate spacer formation to facilitate embedding of split gate...

Gate structures for semiconductor devices

Structure and formation method of semiconductor device structure

Semiconductor device and method

Semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Source leakage current suppression by source surrounding gate struc...

Method of manufacturing conductors for semiconductor device

Multi-layer photo etching mask including organic and inorganic mate...

Low warpage high density trench capacitor

Wet etch apparatus

Method of fabricating contact structure

Semiconductor device and method for fabricating the same

Semiconductor device and method for manufacturing same

Etch method for opening a source line in flash memory

Bottom lateral expansion of contact plugs through implantation

Method for fabricating metal gate devices and resulting structures

Chemical direct pattern plating method

Middle-of-line interconnect structure having air gap and method of...

Seal method to integrate non-volatile memory (NVM) into logic or bi...

Methods of manufacturing electronic structures

Fully self-aligned interconnect structure

Semiconductor structure cutting process and structures formed thereby

Method of modulating stress of dielectric layers

Block-on-block memory array architecture using bi-directional stair...

Staircase structures for electrically connecting multiple horizonta...

Semiconductor device and method of manufacture

Semiconductor device structure with air gap

Access line formation for a memory array

Gate cut with integrated etch stop layer

Patents Applicationslast 30 patents

LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR

METALLIZATION STRUCTURE FOR COUPLING BOILING ENHANCED LAYER TO SUBS...

INTERCONNECT WITH TOPVIA

SOURCE LEAKAGE CURRENT SUPPRESSION BY SOURCE SURROUNDING GATE STRUC...

MULTI-LAYER PHOTO ETCHING MASK INCLUDING ORGANIC AND INORGANIC MATE...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF FABRICATING CONTACT STRUCTURE

GATE CUT WITH INTEGRATED ETCH STOP LAYER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY

BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION

METAL-INSULATOR-METAL (MIM) CAPACITORS WITH IMPROVED RELIABILITY

ACCESS LINE FORMATION FOR A MEMORY ARRAY

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

BLOCK-ON-BLOCK MEMORY ARRAY ARCHITECTURE USING BI-DIRECTIONAL STAIR...

COPPER REFLOW BY SURFACE MODIFICATION

SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

WET ETCH APPARATUS

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING METAL GATE DEVICES AND RESULTING STRUCTURES

METHOD OF MODULATING STRESS OF DIELECTRIC LAYERS

Fully Self-Aligned Interconnect Structure

Semiconductor Structure Cutting Process and Structures Formed Thereby

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT CONTAINING A DECOY STRUCTURE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME