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H01L21/32133

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32133by chemical means only

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating metal gate devices and resulting structures
- Patent number 12,159,916
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 12,142,520
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal method to integrate non-volatile memory (NVM) into logic or bi...
- Patent number 12,144,173
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Bo Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing electronic structures
- Patent number 12,136,632
- Issue date Nov 5, 2024
- Pragmatic Printing Ltd
- Richard Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned interconnect structure
- Patent number 12,136,567
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,132,050
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of modulating stress of dielectric layers
- Patent number 12,125,911
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Block-on-block memory array architecture using bi-directional stair...
- Patent number 12,114,499
- Issue date Oct 8, 2024
- Lodestar Licensing Group LLC
- Aaron S. Yip
- G11 - INFORMATION STORAGE
Information Patent Grant
Staircase structures for electrically connecting multiple horizonta...
- Patent number 12,096,630
- Issue date Sep 17, 2024
- SUNRISE MEMORY CORPORATION
- Raul Adrian Cernea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,087,637
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with air gap
- Patent number 12,087,620
- Issue date Sep 10, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Access line formation for a memory array
- Patent number 12,082,424
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Andrea Redaelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate cut with integrated etch stop layer
- Patent number 12,074,165
- Issue date Aug 27, 2024
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor with field plating
- Patent number 12,074,216
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Ming-Yeh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,058,858
- Issue date Aug 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit containing a decoy structure
- Patent number 12,051,656
- Issue date Jul 30, 2024
- STMicroelectronics (Rousset) SAS
- Julien Delalleau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure for memory device
- Patent number 12,046,649
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Szu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,029,028
- Issue date Jul 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,027,368
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Tien Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate using monolayers
- Patent number 12,015,077
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ju-Li Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 12,009,301
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 12,010,836
- Issue date Jun 11, 2024
- David Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and film forming system
- Patent number 11,984,319
- Issue date May 14, 2024
- Tokyo Electron Limited
- Kensaku Narushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic structure having two field effect transistors
- Patent number 11,978,744
- Issue date May 7, 2024
- Pragmatic Printing Ltd
- Richard Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching solution and method for selectively removing silicon nitrid...
- Patent number 11,955,341
- Issue date Apr 9, 2024
- VERSUM MATERIALS US, LLC
- Jhih Kuei Ge
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive element for semiconductor devices
- Patent number 11,955,380
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,948,798
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory with improved fill-in window
- Patent number 11,943,921
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,937,428
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER REFLOW BY SURFACE MODIFICATION
- Publication number 20240420966
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THEREOF
- Publication number 20240413014
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240413080
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Naoyuki OHSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH APPARATUS
- Publication number 20240395572
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Ting LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240395550
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Tien SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING METAL GATE DEVICES AND RESULTING STRUCTURES
- Publication number 20240387678
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MODULATING STRESS OF DIELECTRIC LAYERS
- Publication number 20240387729
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Self-Aligned Interconnect Structure
- Publication number 20240379434
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240371869
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240363424
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240355642
- Publication date Oct 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Chuan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONTAINING A DECOY STRUCTURE
- Publication number 20240347481
- Publication date Oct 17, 2024
- STMicroelectronics (Rousset) SAS
- Julien Delalleau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240347612
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SZU-YU WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240306369
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240290718
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMATION METHOD AND FILM FORMATION DEVICE
- Publication number 20240254617
- Publication date Aug 1, 2024
- TOKYO ELECTRON LIMITED
- Sena FUJITA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240249942
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT WITH INTEGRATED ETCH STOP LAYER
- Publication number 20240222373
- Publication date Jul 4, 2024
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Conductive Material Deposition
- Publication number 20240178003
- Publication date May 30, 2024
- TOKYO ELECTRON LIMITED
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240170548
- Publication date May 23, 2024
- RENESAS ELECTRONICS CORPORATION
- Hiroya SHIMOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING METAL GATE
- Publication number 20240154005
- Publication date May 9, 2024
- Shanghai Huali Integrated Circuit Corporation
- Zhou YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD
- Publication number 20240138152
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240113112
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A PARTIALLY SILICIDED ELEMENT
- Publication number 20240087886
- Publication date Mar 14, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240088206
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YI JEN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240047209
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Tien SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20240014070
- Publication date Jan 11, 2024
- Changxin Memory Technologies, Inc.
- Chuang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating Metal Gate Devices and Resulting Structures
- Publication number 20230395689
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices With Reduced Leakage Current And Methods Of F...
- Publication number 20230395669
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS

by chemical means only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating metal gate devices and resulting structures

Chemical direct pattern plating method

Middle-of-line interconnect structure having air gap and method of...

Seal method to integrate non-volatile memory (NVM) into logic or bi...

Methods of manufacturing electronic structures

Fully self-aligned interconnect structure

Semiconductor structure cutting process and structures formed thereby

Method of modulating stress of dielectric layers

Block-on-block memory array architecture using bi-directional stair...

Staircase structures for electrically connecting multiple horizonta...

Semiconductor device and method of manufacture

Semiconductor device structure with air gap

Access line formation for a memory array

Gate cut with integrated etch stop layer

Fin field effect transistor with field plating

Three-dimensional memory devices and methods for forming the same

Integrated circuit containing a decoy structure

Method for forming semiconductor structure for memory device

Method of manufacturing semiconductor device

Method for fabricating semiconductor device

Metal gate using monolayers

Interconnect structure

Memory arrays and methods used in forming a memory array comprising...

Substrate processing method and film forming system

Electronic structure having two field effect transistors

Etching solution and method for selectively removing silicon nitrid...

Conductive element for semiconductor devices

Semiconductor device and method

Embedded memory with improved fill-in window

Memory arrays and methods used in forming a memory array comprising...

Patents Applicationslast 30 patents

COPPER REFLOW BY SURFACE MODIFICATION

SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

WET ETCH APPARATUS

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING METAL GATE DEVICES AND RESULTING STRUCTURES

METHOD OF MODULATING STRESS OF DIELECTRIC LAYERS

Fully Self-Aligned Interconnect Structure

Semiconductor Structure Cutting Process and Structures Formed Thereby

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT CONTAINING A DECOY STRUCTURE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

FILM FORMATION METHOD AND FILM FORMATION DEVICE

SEMICONDUCTOR DEVICE AND METHOD

GATE CUT WITH INTEGRATED ETCH STOP LAYER

Method of Conductive Material Deposition

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING METAL GATE

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD

Semiconductor Structure Cutting Process and Structures Formed Thereby

FORMING A PARTIALLY SILICIDED ELEMENT

SEMICONDUCTOR STRUCTURE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

CONTACT STRUCTURE AND METHOD FOR FABRICATING SAME

Method for Fabricating Metal Gate Devices and Resulting Structures

Semiconductor Devices With Reduced Leakage Current And Methods Of F...