by cutting with blades or wires mounted in a reciprocating frame

Industry

CPC
B28D5/042

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/042by cutting with blades or wires mounted in a reciprocating frame

Industries

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Patents Grantslast 30 patents

Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wire saw having dust collecting apparatus
- Patent number 12,109,729
- Issue date Oct 8, 2024
- EGUN CO., LTD.
- Sung Jun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing workpiece and wire saw
- Patent number 11,958,160
- Issue date Apr 16, 2024
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,901,170
- Issue date Feb 13, 2024
- JX Metals Corporation
- Shunsuke Oka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,894,225
- Issue date Feb 6, 2024
- JX Metals Corporation
- Shunsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of recycling silicon swarf into electronic grade polysilico...
- Patent number 11,791,435
- Issue date Oct 17, 2023
- Maxeon Solar Pte. Ltd.
- Moon Chun
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Methods of recycling silicon swarf into electronic grade polysilico...
- Patent number 11,784,276
- Issue date Oct 10, 2023
- SunPower Corporation
- Moon Chun
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Abrasive grains, evaluation method therefor, and wafer manufacturin...
- Patent number 11,373,858
- Issue date Jun 28, 2022
- Sumco Corporation
- Makoto Funayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire saw apparatus
- Patent number 10,589,446
- Issue date Mar 17, 2020
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for slicing semiconductor single crystal ingot
- Patent number 9,876,078
- Issue date Jan 23, 2018
- Sumco Techxiv Corporation
- Hiroshi Noguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Abrasive article and method of forming
- Patent number 9,533,397
- Issue date Jan 3, 2017
- Saint-Gobain Abrasives, Inc.
- Paul W. Rehrig
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sawing wire with abrasive particles partly embedded in a metal wire...
- Patent number 8,720,429
- Issue date May 13, 2014
- N.V. Bekaert S.A.
- Martin Lange
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Sawing strip and method for simultaneously cutting off a multiplici...
- Patent number 7,971,584
- Issue date Jul 5, 2011
- Siltronic AG
- Peter Wiesner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for simultaneously slicing at least two cylindrical workpiec...
- Patent number 7,766,724
- Issue date Aug 3, 2010
- Siltronic AG
- Anton Huber
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Device for simultaneously separating a multiplicity of wafers from...
- Patent number 6,543,434
- Issue date Apr 8, 2003
- Wacker Chemie GmbH
- Bernhard Holzmuller
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for cutting ingots
- Patent number 6,539,932
- Issue date Apr 1, 2003
- Riken
- Hitoshi Ohmori
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for cutting workpieces
- Patent number 6,418,921
- Issue date Jul 16, 2002
- Crystal Systems, Inc.
- Frederick Schmid
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus to produce a radial cut profile
- Patent number 5,842,462
- Issue date Dec 1, 1998
- Crystal Systems, Inc.
- Frederick Schmid
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Reciprocating slurry saw
- Patent number 5,711,287
- Issue date Jan 27, 1998
- Radleigh J. Speer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
High precision micromachining of very fine features
- Patent number 5,154,022
- Issue date Oct 13, 1992
- International Business Machines Corporation
- Pedro A. Chalco
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for slicing a workpiece
- Patent number 5,150,641
- Issue date Sep 29, 1992
- Peter G. Werner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Blade cutting method for hard brittle material
- Patent number 4,930,486
- Issue date Jun 5, 1990
- Applied Magnetic Lab. Co., Ltd.
- Akio Kuromatsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Blade cutting apparatus for hard brittle material
- Patent number 4,920,946
- Issue date May 1, 1990
- Applied Magnetic Lab. Co., Ltd.
- Akio Kuromatsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Device for clamping the blades in a gang saw for sawing crystal rods
- Patent number 4,777,926
- Issue date Oct 18, 1988
- Heliotronic Forschungs- und Entwicklungsgesellschaft fur Solarzellen-Grundsto...
- Wolfgang Ermer
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Wafering device and method of using same
- Patent number 4,776,316
- Issue date Oct 11, 1988
- Brian I. Ashkenazi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Process and apparatus for multiple lap cutting of solid materials
- Patent number 4,733,649
- Issue date Mar 29, 1988
- Heliotronic Forschungs- und Entwicklungsgesellschaft fur Solarzellen-Grundsto...
- Dieter Regler
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Multi-wafer slicing with a fixed abrasive
- Patent number 4,727,852
- Issue date Mar 1, 1988
- Crystal Systems Inc.
- Frederick Schmid
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Multi-wafer slicing with a fixed abrasive
- Patent number 4,646,710
- Issue date Mar 3, 1987
- Crystal Systems, Inc.
- Frederick Schmid
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for the multiple lap-cutting of crystal blocks with continuo...
- Patent number 4,539,972
- Issue date Sep 10, 1985
- Heliotronic Forschungs-und Entwicklungsgesellshaft fur Solarzellen-Grunds toffe
- Wolfgang Ermer
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Grant
Method and apparatus for cutting hard and brittle material using sy...
- Patent number 4,484,412
- Issue date Nov 27, 1984
- Ken-ichi Ishikawa
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF RECYCLING SILICON SWARF INTO ELECTRONIC GRADE POLYSILICO...
- Publication number 20230136895
- Publication date May 4, 2023
- SunPower Corporation
- Moon Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE, SEMICONDUCTOR EPITAXIAL WAFER, AND METH...
- Publication number 20220310381
- Publication date Sep 29, 2022
- JX NIPPON MINING & METALS CORPORATION
- Shunsuke OKA
- C30 - CRYSTAL GROWTH
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE, SEMICONDUCTOR EPITAXIAL WAFER, AND METH...
- Publication number 20220310382
- Publication date Sep 29, 2022
- JX NIPPON MINING & METALS CORPORATION
- Shunsuke OKA
- C30 - CRYSTAL GROWTH
Information Patent Application
CRYSTAL INGOT CUTTING DEVICE AND CRYSTAL INGOT CUTTING METHOD
- Publication number 20220024073
- Publication date Jan 27, 2022
- GLOBALWAFERS CO., LTD.
- Ching-Shan Lin
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE AND WIRE SAW
- Publication number 20220016802
- Publication date Jan 20, 2022
- Shin-Etsu Handotai Co., Ltd.
- Kenji Kobayashi
- B24 - GRINDING POLISHING
Information Patent Application
SiC WAFER AND MANUFACTURING METHOD FOR SiC WAFER
- Publication number 20210301421
- Publication date Sep 30, 2021
- Denso Corporation
- Masatake NAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF RECYCLING SILICON SWARF INTO ELECTRONIC GRADE POLYSILICO...
- Publication number 20210104643
- Publication date Apr 8, 2021
- SunPower Corporation
- Moon Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABRASIVE GRAINS, EVALUATION METHOD THEREFOR, AND WAFER MANUFACTURIN...
- Publication number 20200058484
- Publication date Feb 20, 2020
- SUMCO CORPORATION
- Makoto FUNAYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SLICING METHOD AND A SLICING APPARATUS FOR AN INGOT
- Publication number 20190070751
- Publication date Mar 7, 2019
- ZING SEMICONDUCTOR CORPORATION
- YAN WANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WIRE SUPPLYING AND RECEIVING DEVICE FOR A WIRE SAW, INGOT SLICING W...
- Publication number 20180311864
- Publication date Nov 1, 2018
- AUO Crystal Corporation
- Shih-Chueh LEI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WIRE SAW APPARATUS
- Publication number 20180079108
- Publication date Mar 22, 2018
- Shin-Etsu Handotai Co., Ltd.
- Koji KITAGAWA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
INGOT SLICING WIRE SAW, ROLLER MODULE THEREOF, AND METHOD FOR SLICI...
- Publication number 20170239842
- Publication date Aug 24, 2017
- AUO Crystal Corporation
- Shih-Chueh LEI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Abrasive Article and Method Of Forming
- Publication number 20140017984
- Publication date Jan 16, 2014
- Paul W. Rehrig
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER CUTTING METHOD AND DEVICE
- Publication number 20130192435
- Publication date Aug 1, 2013
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SAWING WIRE WITH ABRASIVE PARTICLES PARTLY EMBEDDED IN A METAL WIRE...
- Publication number 20120017741
- Publication date Jan 26, 2012
- N.V. BEKAERT S.A.
- Martin Lange
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR SEPARATING A MULTIPLICITY OF CERAMIC COMPONEN...
- Publication number 20100038456
- Publication date Feb 18, 2010
- Christoph Hamann
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SIMULTANEOUSLY SLICING AT LEAST TWO CYLINDRICAL WORKPIEC...
- Publication number 20080099006
- Publication date May 1, 2008
- Siltronic AG
- Anton Huber
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Sawing Strip And Method For Simultaneously Cutting Off A Multiplici...
- Publication number 20080011134
- Publication date Jan 17, 2008
- Siltronic AG
- Peter Wiesner
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for cutting ingots for use with a wire cutting apparatus
- Publication number 20030047177
- Publication date Mar 13, 2003
- Michael Christ
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Wire saw
- Publication number 20020174757
- Publication date Nov 28, 2002
- Gryphon Corporation
- Stu Mackie
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND APPARATUS FOR CUTTING WORKPIECES
- Publication number 20020096165
- Publication date Jul 25, 2002
- Frederick Schmid
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Apparatus and method for cutting ingots
- Publication number 20010017130
- Publication date Aug 30, 2001
- Hitoshi Ohmori
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Device for simultaneously separating a multiplicity of wafers from...
- Publication number 20010004891
- Publication date Jun 28, 2001
- Wacker Chemie GmbH
- Bernhard Holzmuller
- B28 - WORKING CEMENT, CLAY, OR STONE

by cutting with blades or wires mounted in a reciprocating frame

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SiC wafer and manufacturing method for SiC wafer

Wire saw having dust collecting apparatus

Method for slicing workpiece and wire saw

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Methods of recycling silicon swarf into electronic grade polysilico...

Methods of recycling silicon swarf into electronic grade polysilico...

Abrasive grains, evaluation method therefor, and wafer manufacturin...

Wire saw apparatus

Method for slicing semiconductor single crystal ingot

Abrasive article and method of forming

Sawing wire with abrasive particles partly embedded in a metal wire...

Sawing strip and method for simultaneously cutting off a multiplici...

Method for simultaneously slicing at least two cylindrical workpiec...

Device for simultaneously separating a multiplicity of wafers from...

Apparatus and method for cutting ingots

Method and apparatus for cutting workpieces

Method and apparatus to produce a radial cut profile

Reciprocating slurry saw

High precision micromachining of very fine features

Apparatus for slicing a workpiece

Blade cutting method for hard brittle material

Blade cutting apparatus for hard brittle material

Device for clamping the blades in a gang saw for sawing crystal rods

Wafering device and method of using same

Process and apparatus for multiple lap cutting of solid materials

Multi-wafer slicing with a fixed abrasive

Multi-wafer slicing with a fixed abrasive

Method for the multiple lap-cutting of crystal blocks with continuo...

Method and apparatus for cutting hard and brittle material using sy...

Patents Applicationslast 30 patents

METHODS OF RECYCLING SILICON SWARF INTO ELECTRONIC GRADE POLYSILICO...

INDIUM PHOSPHIDE SUBSTRATE, SEMICONDUCTOR EPITAXIAL WAFER, AND METH...

INDIUM PHOSPHIDE SUBSTRATE, SEMICONDUCTOR EPITAXIAL WAFER, AND METH...

CRYSTAL INGOT CUTTING DEVICE AND CRYSTAL INGOT CUTTING METHOD

METHOD FOR SLICING WORKPIECE AND WIRE SAW

SiC WAFER AND MANUFACTURING METHOD FOR SiC WAFER

METHODS OF RECYCLING SILICON SWARF INTO ELECTRONIC GRADE POLYSILICO...

ABRASIVE GRAINS, EVALUATION METHOD THEREFOR, AND WAFER MANUFACTURIN...

SLICING METHOD AND A SLICING APPARATUS FOR AN INGOT

WIRE SUPPLYING AND RECEIVING DEVICE FOR A WIRE SAW, INGOT SLICING W...

WIRE SAW APPARATUS

INGOT SLICING WIRE SAW, ROLLER MODULE THEREOF, AND METHOD FOR SLICI...

Abrasive Article and Method Of Forming

WAFER CUTTING METHOD AND DEVICE

SAWING WIRE WITH ABRASIVE PARTICLES PARTLY EMBEDDED IN A METAL WIRE...

METHOD AND SYSTEM FOR SEPARATING A MULTIPLICITY OF CERAMIC COMPONEN...

METHOD FOR SIMULTANEOUSLY SLICING AT LEAST TWO CYLINDRICAL WORKPIEC...

Sawing Strip And Method For Simultaneously Cutting Off A Multiplici...

Method for cutting ingots for use with a wire cutting apparatus

Wire saw

METHOD AND APPARATUS FOR CUTTING WORKPIECES

Apparatus and method for cutting ingots

Device for simultaneously separating a multiplicity of wafers from...