by cutting with wires or closed-loop blades

Industry

CPC
B28D5/045

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/045by cutting with wires or closed-loop blades

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for cutting silicon rod and apparatus for dimaond multi-wire...
- Patent number 12,122,067
- Issue date Oct 22, 2024
- Zhonghuan Advanced Semiconductor Technology Co., Ltd.
- Jiazhen Zheng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ingot wafering systems and methods for slicing a silicon ingot
- Patent number 12,115,699
- Issue date Oct 15, 2024
- GlobalWafers Co., Ltd.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw having dust collecting apparatus
- Patent number 12,109,729
- Issue date Oct 8, 2024
- EGUN CO., LTD.
- Sung Jun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ingot temperature controller and wire sawing device having same
- Patent number 12,090,685
- Issue date Sep 17, 2024
- SK SILTRON CO., LTD.
- Young Il Jin
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for producing semiconductor wafers using a wire saw, wire sa...
- Patent number 12,083,705
- Issue date Sep 10, 2024
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolayer graphene on non-polar face SiC substrate and control meth...
- Patent number 12,051,585
- Issue date Jul 30, 2024
- Tianjin University
- Lei Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of silicon carbide wafer, silicon carbide wafe...
- Patent number 11,969,917
- Issue date Apr 30, 2024
- SENIC INC.
- Jung-Gyu Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for slicing workpiece and wire saw
- Patent number 11,958,160
- Issue date Apr 16, 2024
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spool with saw wire having elastic and plastic rotations
- Patent number 11,938,654
- Issue date Mar 26, 2024
- BEKAERT BINJIANG STEEL CORD CO., LTD.
- Wenxian Huang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw, wire guide roll and method for simultaneously cutting a m...
- Patent number 11,878,359
- Issue date Jan 23, 2024
- Siltronic AG
- Georg Pietsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wire saw apparatus and wire saw apparatus
- Patent number 11,806,827
- Issue date Nov 7, 2023
- Shin-Etsu Handotai Co., Ltd.
- Yoshihiro Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing hexagonal semiconductor plate crystal
- Patent number 11,772,301
- Issue date Oct 3, 2023
- Mitsubishi Chemical Corporation
- Hirofumi Uchida
- C30 - CRYSTAL GROWTH
Information Patent Grant
Slurry sprayers, adjustable supports for same, and methods for slic...
- Patent number 11,752,665
- Issue date Sep 12, 2023
- GlobalWafers Co., Ltd.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for preparing SiC ingot, method for preparing SiC wafer and...
- Patent number 11,708,644
- Issue date Jul 25, 2023
- SENIC INC.
- Jong Hwi Park
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Wire saw apparatus and method for manufacturing wafer
- Patent number 11,584,037
- Issue date Feb 21, 2023
- Shin-Etsu Handotai Co., Ltd.
- Kazutoshi Mizushima
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing ingot block, method for manufacturing semi...
- Patent number 11,587,792
- Issue date Feb 21, 2023
- Sumco Corporation
- Yasuhiro Saito
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wire saw device, and processing method and processing device for wo...
- Patent number 11,504,857
- Issue date Nov 22, 2022
- TAKATORI CORPORATION
- Makoto Masuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing workpiece
- Patent number 11,389,991
- Issue date Jul 19, 2022
- Shin-Etsu Handotai Co., Ltd.
- Shiro Toyoda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Longitudinal silicon ingot slicing apparatus
- Patent number 11,276,577
- Issue date Mar 15, 2022
- Samuel Messinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon ingot slicing apparatus using microbubbles and wire electri...
- Patent number 11,065,783
- Issue date Jul 20, 2021
- Korea Institute of Energy Research
- Bo-Yun Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing silicon carbide substrate, method for manu...
- Patent number 11,034,058
- Issue date Jun 15, 2021
- Sumitomo Electric Industries, Ltd.
- Naoki Matsumoto
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Diamond wire cutting method for crystal boules
- Patent number 10,994,443
- Issue date May 4, 2021
- Comadur S.A.
- Naser Berisha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal wire, saw wire, cutting apparatus, and method of manufacturin...
- Patent number 10,967,447
- Issue date Apr 6, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Kanazawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ingot clamping device and wire sawing apparatus for slicing ingot h...
- Patent number 10,882,214
- Issue date Jan 5, 2021
- SKSILTRON CO., LTD.
- Woo Tae Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Saw wire and cutting apparatus
- Patent number 10,723,042
- Issue date Jul 28, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Kanazawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Shaped silicon ingot using layer transfer
- Patent number 10,683,588
- Issue date Jun 16, 2020
- Silicon Genesis Corporation
- Francois J. Henley
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Methods and system for controlling a surface profile of a wafer
- Patent number 10,654,193
- Issue date May 19, 2020
- GlobalWafers Co., Ltd.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece holder and method for slicing workpiece
- Patent number 10,596,724
- Issue date Mar 24, 2020
- Shin-Etsu Handotai Co., Ltd.
- Shiroyasu Watanabe
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Longitudinal silicon ingot slicing machine and jig fixture
- Patent number 10,593,537
- Issue date Mar 17, 2020
- Samuel Messinger
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Abrasive article and method of forming
- Patent number 10,583,506
- Issue date Mar 10, 2020
- Saint-Gobain Abrasives, Inc.
- Yinggang Tian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT
- Publication number 20240416556
- Publication date Dec 19, 2024
- GLOBALWAFERS CO., LTD.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutti...
- Publication number 20240416557
- Publication date Dec 19, 2024
- QINGDAO GAOCE TECHNOLOGY CO., LTD
- Shengen HOU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CNC WIRE CUTTING MACHINE
- Publication number 20240308107
- Publication date Sep 19, 2024
- VISWESH SRINIVASAN
- VISWESH SRINIVASAN
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METAL WIRE AND SAW WIRE
- Publication number 20240286314
- Publication date Aug 29, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro KANAZAWA
- G01 - MEASURING TESTING
Information Patent Application
BRICK LOADING/UNLOADING APPARATUS AND METHOD
- Publication number 20240269893
- Publication date Aug 15, 2024
- Hanwha Corporation
- Jong Won LEE
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
LARGE-SIZE SINGLE CRYSTAL CUTTING DEVICE AND METHOD OF THE SAME
- Publication number 20240269894
- Publication date Aug 15, 2024
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Zhihui LIANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Processing Method and System for Reducing Warp of Nitrogen-Doped Wafer
- Publication number 20240262008
- Publication date Aug 8, 2024
- Xi'an ESWIN Material Technology Co., Ltd.
- Na YI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20240246260
- Publication date Jul 25, 2024
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240234125
- Publication date Jul 11, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
Method for Solving Bright Line Scratched During Lifting of Large-si...
- Publication number 20240217139
- Publication date Jul 4, 2024
- GUANGDONG JINWAN GOKIN SOLAR TECHNOLOGY CO., LTD
- Mingquan FU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND DEVICE FOR PROVIDING WIRE BREAKAGE WARNING
- Publication number 20240175771
- Publication date May 30, 2024
- GLOBALWAFERS CO., LTD.
- Chien-Wen YU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240136173
- Publication date Apr 25, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
MONOCRYSTALLINE SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING...
- Publication number 20240105782
- Publication date Mar 28, 2024
- TANKEBLUE SEMICONDUCTOR CO., LTD.
- Yanfang LOU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
ALLOY WIRE ROD AND PREPARATION METHOD AND APPLICATION THEREOF
- Publication number 20230407441
- Publication date Dec 21, 2023
- Xiamen Honglu Tungsten Molybdenum Industry Co., Ltd.
- Minfeng TANG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLIC...
- Publication number 20230390962
- Publication date Dec 7, 2023
- GLOBALWAFERS CO., LTD.
- Sumeet S. Bhagavat
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Monocrystalline SIC Substrates Having an Asymmetrical Geometry and...
- Publication number 20230317780
- Publication date Oct 5, 2023
- SICRYSTAL GMBH
- Kuniyoshi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF S...
- Publication number 20230311363
- Publication date Oct 5, 2023
- SILTRONIC AG
- Georg Pietsch
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230286067
- Publication date Sep 14, 2023
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT
- Publication number 20230271348
- Publication date Aug 31, 2023
- GLOBALWAFERS CO., LTD.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SOLAR SILICON WAFER CUTTING METHOD, DEVICE, AND STORAGE MEDIUM
- Publication number 20230264389
- Publication date Aug 24, 2023
- Chengtian QI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230234261
- Publication date Jul 27, 2023
- Siltronic AG
- Axel Beyer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230234149
- Publication date Jul 27, 2023
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230226629
- Publication date Jul 20, 2023
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A W...
- Publication number 20230050459
- Publication date Feb 16, 2023
- Siltronic AG
- Georg PIETSCH
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
INGOT TEMPERATURE CONTROLLER AND WIRE SAWING DEVICE HAVING SAME
- Publication number 20220410432
- Publication date Dec 29, 2022
- SK SILTRON CO., LTD.
- Young Il JIN
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING...
- Publication number 20220234250
- Publication date Jul 28, 2022
- Siltronic AG
- Georg PIETSCH
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
MANUFACTURING METHOD OF SILICON CARBIDE WAFER, SILICON CARBIDE WAFE...
- Publication number 20220219354
- Publication date Jul 14, 2022
- SENIC Inc.
- Jung-Gyu KIM
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR CUTTING SILICON ROD AND APPARATUS FOR DIMAOND MULTI-WIRE...
- Publication number 20220134600
- Publication date May 5, 2022
- XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD
- Jiazhen ZHENG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
MONOLAYER GRAPHENE ON NON-POLAR FACE SiC SUBSTRATE AND CONTROL METH...
- Publication number 20220122832
- Publication date Apr 21, 2022
- TIANJIN UNIVERSITY
- Lei MA
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR CUTTING SUBSTRATE WAFER FROM INDIUM PHOSPHIDE CRYSTAL BAR
- Publication number 20220072660
- Publication date Mar 10, 2022
- THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Yanlei SHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by cutting with wires or closed-loop blades

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for cutting silicon rod and apparatus for dimaond multi-wire...

Ingot wafering systems and methods for slicing a silicon ingot

Wire saw having dust collecting apparatus

Ingot temperature controller and wire sawing device having same

Method for producing semiconductor wafers using a wire saw, wire sa...

Monolayer graphene on non-polar face SiC substrate and control meth...

Manufacturing method of silicon carbide wafer, silicon carbide wafe...

Method for slicing workpiece and wire saw

Spool with saw wire having elastic and plastic rotations

Wire saw, wire guide roll and method for simultaneously cutting a m...

Method for manufacturing wire saw apparatus and wire saw apparatus

Method for manufacturing hexagonal semiconductor plate crystal

Slurry sprayers, adjustable supports for same, and methods for slic...

Method for preparing SiC ingot, method for preparing SiC wafer and...

Wire saw apparatus and method for manufacturing wafer

Method for manufacturing ingot block, method for manufacturing semi...

Wire saw device, and processing method and processing device for wo...

Method for slicing workpiece

Longitudinal silicon ingot slicing apparatus

Silicon ingot slicing apparatus using microbubbles and wire electri...

Method for manufacturing silicon carbide substrate, method for manu...

Diamond wire cutting method for crystal boules

Metal wire, saw wire, cutting apparatus, and method of manufacturin...

Ingot clamping device and wire sawing apparatus for slicing ingot h...

Saw wire and cutting apparatus

Shaped silicon ingot using layer transfer

Methods and system for controlling a surface profile of a wafer

Workpiece holder and method for slicing workpiece

Longitudinal silicon ingot slicing machine and jig fixture

Abrasive article and method of forming

Patents Applicationslast 30 patents

INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT

Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutti...

CNC WIRE CUTTING MACHINE

METAL WIRE AND SAW WIRE

BRICK LOADING/UNLOADING APPARATUS AND METHOD

LARGE-SIZE SINGLE CRYSTAL CUTTING DEVICE AND METHOD OF THE SAME

Processing Method and System for Reducing Warp of Nitrogen-Doped Wafer

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

Method for Solving Bright Line Scratched During Lifting of Large-si...

METHOD AND DEVICE FOR PROVIDING WIRE BREAKAGE WARNING

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

MONOCRYSTALLINE SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING...

ALLOY WIRE ROD AND PREPARATION METHOD AND APPLICATION THEREOF

SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLIC...

Monocrystalline SIC Substrates Having an Asymmetrical Geometry and...

METHOD AND APPARATUS FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF S...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT

SOLAR SILICON WAFER CUTTING METHOD, DEVICE, AND STORAGE MEDIUM

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A W...

INGOT TEMPERATURE CONTROLLER AND WIRE SAWING DEVICE HAVING SAME

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING...

MANUFACTURING METHOD OF SILICON CARBIDE WAFER, SILICON CARBIDE WAFE...

METHOD FOR CUTTING SILICON ROD AND APPARATUS FOR DIMAOND MULTI-WIRE...

MONOLAYER GRAPHENE ON NON-POLAR FACE SiC SUBSTRATE AND CONTROL METH...

METHOD FOR CUTTING SUBSTRATE WAFER FROM INDIUM PHOSPHIDE CRYSTAL BAR