by deforming at least one of the conductive layers

Industry

CPC
H05K3/4084

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4084by deforming at least one of the conductive layers

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board and method of producing the same
- Patent number 12,185,463
- Issue date Dec 31, 2024
- Nitto Denko Corporation
- Kanayo Sawashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 12,038,666
- Issue date Jul 16, 2024
- E Ink Corporation
- Matthew Joseph Kayal
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of implementing stub-less PCB vias
- Patent number 11,064,616
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Layne A. Berge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 11,022,854
- Issue date Jun 1, 2021
- E Ink Corporation
- Matthew Joseph Kayal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing an electrical through connection between opposi...
- Patent number 10,687,426
- Issue date Jun 16, 2020
- Saralon GmbH
- Moazzam Ali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electro-optic display with measurement aperture
- Patent number 10,466,564
- Issue date Nov 5, 2019
- E Ink Corporation
- Matthew Joseph Kayal
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board and corresponding method for producing a prin...
- Patent number 10,433,432
- Issue date Oct 1, 2019
- Rohde & Schwarz GmbH & Co. KG
- Uwe Hassel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for implementing stub-less printed circuit board vias
- Patent number 10,349,532
- Issue date Jul 9, 2019
- International Business Machines Corporation
- Layne A. Berge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing traces of PCB
- Patent number 10,306,768
- Issue date May 28, 2019
- TRIALLIAN CORPORATION
- Albert Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate including conductive circuit patterns
- Patent number 10,212,815
- Issue date Feb 19, 2019
- Tecnomar Oy
- Tom Marttila
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing substrate and substrate
- Patent number 10,009,998
- Issue date Jun 26, 2018
- Fujitsu Limited
- Norikazu Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for controlled effective series resistance comp...
- Patent number 9,992,871
- Issue date Jun 5, 2018
- Intel Corporation
- William J. Lambert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, manufacturing method therefor, and sub...
- Patent number 9,961,768
- Issue date May 1, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing through wiring substrate and method of producin...
- Patent number 9,927,349
- Issue date Mar 27, 2018
- Canon Kabushiki Kaisha
- Shinan Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Printed wiring board and method for producing printed wiring board
- Patent number 9,894,765
- Issue date Feb 13, 2018
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kousuke Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 9,883,579
- Issue date Jan 30, 2018
- Unimicron Technology Corp.
- Hsiang-Hung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 9,855,783
- Issue date Jan 2, 2018
- Novalia Ltd.
- Kate Stone
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Chip-integrated through-plating of multi-layer substrates
- Patent number 9,756,730
- Issue date Sep 5, 2017
- Osram Opto Semiconductors GmbH
- Andreas Steffen Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film composite having electrical functionality for applying to a su...
- Patent number 9,723,726
- Issue date Aug 1, 2017
- Schreiner Group GmbH & Co. KG
- Wolfram Fischer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a device comprising at least two distinct compo...
- Patent number 9,699,913
- Issue date Jul 4, 2017
- Gemalto SA
- Frederick Seban
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate and metal layer manufacturing method
- Patent number 9,693,456
- Issue date Jun 27, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 9,554,467
- Issue date Jan 24, 2017
- Samsung Electronics Co., Ltd.
- Won-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biocompatible bonding method and electronics package suitable for i...
- Patent number 9,532,451
- Issue date Dec 27, 2016
- Second Sight Medical Products, Inc.
- Robert Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for manufacturing antenna sheet
- Patent number 9,436,905
- Issue date Sep 6, 2016
- Toppan Printing Co., Ltd.
- Hiroyoshi Gotou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,433,097
- Issue date Aug 30, 2016
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe card
- Patent number 9,410,987
- Issue date Aug 9, 2016
- Rohm Co., Ltd.
- Goro Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board integrated interconnect
- Patent number 9,386,693
- Issue date Jul 5, 2016
- Lockheed Martin Corporation
- Tim Gruhl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 9,332,638
- Issue date May 3, 2016
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in electronic component and method for manufac...
- Patent number 9,307,643
- Issue date Apr 5, 2016
- Ibiden Co., Ltd.
- Hisayuki Nakagome
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20230189440
- Publication date Jun 15, 2023
- Nitto Denko Corporation
- Kanayo SAWASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...
- Publication number 20230008736
- Publication date Jan 12, 2023
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A TOP PLANE CONNECTION IN AN ELECTRO-OPTIC DEVICE
- Publication number 20210247657
- Publication date Aug 12, 2021
- E INK CORPORATION
- Matthew Joseph KAYAL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PRODUCING AN ELECTRICAL THROUGH CONNECTION BETWEEN OPPOSI...
- Publication number 20200100366
- Publication date Mar 26, 2020
- Saralon GmbH
- Moazzam Ali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Forming a Top Plane Connection in an Electro-Optic Device
- Publication number 20200064705
- Publication date Feb 27, 2020
- E INK CORPORATION
- Matthew Joseph KAYAL
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
IMPLEMENTING STUB-LESS PCB VIAS
- Publication number 20190254177
- Publication date Aug 15, 2019
- International Business Machines Corporation
- Layne A. Berge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTING STUB-LESS PCB VIAS AND CUSTOM INTERCONNECT THROUGH LAS...
- Publication number 20190029123
- Publication date Jan 24, 2019
- International Business Machines Corporation
- Layne A. Berge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE AND SUBSTRATE
- Publication number 20180160547
- Publication date Jun 7, 2018
- Fujitsu Limited
- Norikazu Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS TO CREATE ELECTRICAL JUNCTIONS FOR INFORMATIO...
- Publication number 20180102619
- Publication date Apr 12, 2018
- Georgia Institute of Technology
- SUNDARESAN JAYARAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Breaks in PCB Vias
- Publication number 20170231099
- Publication date Aug 10, 2017
- DELL PRODUCTS, L.P.
- Kevin W. Mundt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING THROUGH WIRING SUBSTRATE AND METHOD OF PRODUCIN...
- Publication number 20170167970
- Publication date Jun 15, 2017
- Canon Kabushiki Kaisha
- Shinan Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLED EFFECTIVE SERIES RESISTANCE COMP...
- Publication number 20170135211
- Publication date May 11, 2017
- Intel Corporation
- William J. Lambert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20170118837
- Publication date Apr 27, 2017
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kousuke MIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and corresponding method for producing a prin...
- Publication number 20170027066
- Publication date Jan 26, 2017
- ROHDE & SCHWARZ GMBH & CO. KG
- Uwe Hassel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Biocompatible Bonding Method and Electronics Package Suitable for I...
- Publication number 20160255720
- Publication date Sep 1, 2016
- Second Sight Medical Products, Inc.
- Robert Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160007468
- Publication date Jan 7, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND METAL LAYER MANUFACTURING METHOD
- Publication number 20150351239
- Publication date Dec 3, 2015
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-BASED MOUNTING BOARD AND METHOD OF MANUFACTURING METAL-BASED...
- Publication number 20150351225
- Publication date Dec 3, 2015
- SUMITOMO BAKELITE CO., LTD.
- Yoshihide Nii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A VIA STRUCTURE USING A DOUBLE-SIDE LASER PROCESS
- Publication number 20150257281
- Publication date Sep 10, 2015
- Marvell World Trade Ltd.
- Huahung Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED TRACE SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20150208517
- Publication date Jul 23, 2015
- Amkor Technology, Inc.
- Ah Ron Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Constructing an External Circuit structure
- Publication number 20150096173
- Publication date Apr 9, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Zhongyao Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRICAL RADIOFREQUENCY CONNECTION BETWEE...
- Publication number 20140374154
- Publication date Dec 25, 2014
- Christian Frohler
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
PACKAGE SUBSTRATE WITH HIGH DENSITY INTERCONNECT DESIGN TO CAPTURE...
- Publication number 20140321091
- Publication date Oct 30, 2014
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20140202747
- Publication date Jul 24, 2014
- ELITES ELECTRONICS CORP.
- Jung-Yu Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20140151106
- Publication date Jun 5, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY
- Publication number 20140144690
- Publication date May 29, 2014
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Gabriel Pares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES FOR THE PRODUCTION OF ELECTRO-OPTIC DISPLAYS
- Publication number 20140027044
- Publication date Jan 30, 2014
- Matthew Joseph Kayal
- B32 - LAYERED PRODUCTS
Information Patent Application
REUSE PASTE MANUFACTURING METHOD AND REUSE PASTE
- Publication number 20130299752
- Publication date Nov 14, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-INTEGRATED THROUGH-PLATING OF MULTI-LAYER SUBSTRATES
- Publication number 20130223032
- Publication date Aug 29, 2013
- Osram Opto Semiconductors GmbH
- Andreas Steffen Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REUSE PASTE MANUFACTURING METHOD AND REUSE PASTE
- Publication number 20130146817
- Publication date Jun 13, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS

by deforming at least one of the conductive layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring circuit board and method of producing the same

Manufacturing method for double-sided wiring circuit board and doub...

Method of forming a top plane connection in an electro-optic device

Method of implementing stub-less PCB vias

Method of forming a top plane connection in an electro-optic device

Method of producing an electrical through connection between opposi...

Electro-optic display with measurement aperture

Printed circuit board and corresponding method for producing a prin...

Method for implementing stub-less printed circuit board vias

Method for manufacturing traces of PCB

Laminate including conductive circuit patterns

Method of manufacturing substrate and substrate

Systems and methods for controlled effective series resistance comp...

Multilayer wiring substrate, manufacturing method therefor, and sub...

Method of producing through wiring substrate and method of producin...

Printed wiring board and method for producing printed wiring board

Package structure and manufacturing method thereof

Electronic device

Chip-integrated through-plating of multi-layer substrates

Film composite having electrical functionality for applying to a su...

Method of producing a device comprising at least two distinct compo...

Substrate and metal layer manufacturing method

Printed circuit board and semiconductor package

Biocompatible bonding method and electronics package suitable for i...

Method for manufacturing antenna sheet

Circuit substrate and method for manufacturing the same

Probe card

Board integrated interconnect

Wiring board and method for manufacturing wiring board

Substrate with built-in electronic component and method for manufac...

Patents Applicationslast 30 patents

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...

METHOD OF FORMING A TOP PLANE CONNECTION IN AN ELECTRO-OPTIC DEVICE

METHOD OF PRODUCING AN ELECTRICAL THROUGH CONNECTION BETWEEN OPPOSI...

Method of Forming a Top Plane Connection in an Electro-Optic Device

IMPLEMENTING STUB-LESS PCB VIAS

IMPLEMENTING STUB-LESS PCB VIAS AND CUSTOM INTERCONNECT THROUGH LAS...

METHOD OF MANUFACTURING SUBSTRATE AND SUBSTRATE

METHOD AND APPARATUS TO CREATE ELECTRICAL JUNCTIONS FOR INFORMATIO...

Electrical Breaks in PCB Vias

METHOD OF PRODUCING THROUGH WIRING SUBSTRATE AND METHOD OF PRODUCIN...

SYSTEMS AND METHODS FOR CONTROLLED EFFECTIVE SERIES RESISTANCE COMP...

PRINTED WIRING BOARD AND METHOD FOR PRODUCING PRINTED WIRING BOARD

Printed circuit board and corresponding method for producing a prin...

Biocompatible Bonding Method and Electronics Package Suitable for I...

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE AND METAL LAYER MANUFACTURING METHOD

METAL-BASED MOUNTING BOARD AND METHOD OF MANUFACTURING METAL-BASED...

METHOD FOR FORMING A VIA STRUCTURE USING A DOUBLE-SIDE LASER PROCESS

EMBEDDED TRACE SUBSTRATE AND METHOD OF FORMING THE SAME

Method for Constructing an External Circuit structure

METHOD FOR PRODUCING AN ELECTRICAL RADIOFREQUENCY CONNECTION BETWEE...

PACKAGE SUBSTRATE WITH HIGH DENSITY INTERCONNECT DESIGN TO CAPTURE...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY

PROCESSES FOR THE PRODUCTION OF ELECTRO-OPTIC DISPLAYS

REUSE PASTE MANUFACTURING METHOD AND REUSE PASTE

CHIP-INTEGRATED THROUGH-PLATING OF MULTI-LAYER SUBSTRATES

REUSE PASTE MANUFACTURING METHOD AND REUSE PASTE