by deforming or shaping

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CPC
Y10T29/49151

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

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Y10T29/49151by deforming or shaping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric machine with combined insulator and terminal assembly
- Patent number 10,715,015
- Issue date Jul 14, 2020
- BorgWarner Inc.
- Christopher Bledsoe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interface structure
- Patent number 10,714,851
- Issue date Jul 14, 2020
- Sensata Technologies
- Hideyuki Takahashi
- G01 - MEASURING TESTING
Information Patent Grant
Method of making an electronics package for an electric machine
- Patent number 10,186,938
- Issue date Jan 22, 2019
- BorgWarner Inc.
- Christopher Bledsoe
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Ultrasound endoscope and methods of manufacture thereof
- Patent number 10,149,660
- Issue date Dec 11, 2018
- DALHOUSIE UNIVERSITY
- Andre B. Bezanson
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Methods for making leads with radially-aligned segmented electrodes...
- Patent number 9,913,974
- Issue date Mar 13, 2018
- Boston Scientific Neuromodulation Corporation
- Anne Margaret Pianca
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Monitoring device
- Patent number 9,833,193
- Issue date Dec 5, 2017
- BIOTELEMETRY TECHNOLOGY APS
- Lasse Bay
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electrical connector with low-stress, reduced-electrical-length con...
- Patent number 9,787,039
- Issue date Oct 10, 2017
- Hubbell Incorporated
- Shadi Alex AbuGhazaleh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless multi-layer circuit substrate with minimized pad capacitance
- Patent number 9,773,725
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,761,558
- Issue date Sep 12, 2017
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for integrated circuit fabrication with protective coating...
- Patent number 9,679,781
- Issue date Jun 13, 2017
- Micron Technology, Inc.
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding electrical connector and method of making the same
- Patent number 9,520,682
- Issue date Dec 13, 2016
- Hon Hai Precision Industry Co., Ltd.
- Yen-Chih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for mounting a cable connector onto a panel
- Patent number 9,502,845
- Issue date Nov 22, 2016
- FCI Americas Technology LLC
- Charles M. Gross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with low-stress, reduced-electrical-length con...
- Patent number 9,478,888
- Issue date Oct 25, 2016
- Hubbell Incorporated
- Shadi Alex AbuGhazaleh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a detector
- Patent number 9,466,902
- Issue date Oct 11, 2016
- FANUC CORPORATION
- Taisei Fujimoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Probe card
- Patent number 9,410,987
- Issue date Aug 9, 2016
- Rohm Co., Ltd.
- Goro Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for generating tracing information for gas cyli...
- Patent number 9,384,452
- Issue date Jul 5, 2016
- FABER INDUSTRIE S.p.A.
- Gian Luigi Cola
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,252,122
- Issue date Feb 2, 2016
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,105,483
- Issue date Aug 11, 2015
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless multi-layer circuit substrate with minimized pad capacitance
- Patent number 9,060,428
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Kevin Bills
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling an electrical connector assembly
- Patent number 8,925,189
- Issue date Jan 6, 2015
- Delphi Technologies, Inc.
- Christopher Adrian Margrave
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 8,836,136
- Issue date Sep 16, 2014
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for generating tracing information for gas cylinders
- Patent number 8,763,894
- Issue date Jul 1, 2014
- Faber Insustrie S.p.A.
- Gian Luigi Cola
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Grant
Method of producing a land grid array (LGA) interposer utilizing me...
- Patent number 8,752,284
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a medical lead
- Patent number 8,739,403
- Issue date Jun 3, 2014
- Medtronic, Inc.
- Michael Hegland
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Circuit module and manufacturing method for the same
- Patent number 8,724,334
- Issue date May 13, 2014
- Murata Manufacturing Co., Ltd.
- Hiroshi Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a compliant membrane probe
- Patent number 8,640,324
- Issue date Feb 4, 2014
- International Business Machines Corporation
- David M. Audette
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20220165703
- Publication date May 26, 2022
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-package Assembly With Wire Bond Vias
- Publication number 20210035948
- Publication date Feb 4, 2021
- Invensas Corporation
- Ellis Chau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
ELECTRIC MACHINE WITH COMBINED INSULATOR AND TERMINAL ASSEMBLY
- Publication number 20190123624
- Publication date Apr 25, 2019
- BORGWARNER, INC.
- Christopher Bledsoe
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ULTRASOUND ENDOSCOPE AND METHODS OF MANUFACTURE THEREOF
- Publication number 20190110773
- Publication date Apr 18, 2019
- Dalhousie University
- Andre B. Bezanson
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MONITORING DEVICE
- Publication number 20180249957
- Publication date Sep 6, 2018
- Biotelemetry Technology APS
- Lasse BAY
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING ELECTRICAL CONNECTOR AND METHOD OF MAKING THE SAME
- Publication number 20140357121
- Publication date Dec 4, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- YEN-CHIH CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR GENERATING TRACING INFORMATION FOR GAS CYLI...
- Publication number 20140138433
- Publication date May 22, 2014
- FABER INSUSTRIE S.p.A.
- Gian Luigi Cola
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY AND METHOD OF ASSEMBLY
- Publication number 20140053402
- Publication date Feb 27, 2014
- Delphi Technologies, Inc.
- Christopher Adrian Margrave
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130328219
- Publication date Dec 12, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR INTEGRATED CIRCUIT FABRICATION WITH PROTECTIVE COATING...
- Publication number 20130295770
- Publication date Nov 7, 2013
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130200533
- Publication date Aug 8, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130095610
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130093087
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130093088
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN SITU FLEXIBLE CIRCUIT EMBOSSING TO FORM AN ELECTRICAL INTERCONNECT
- Publication number 20130061469
- Publication date Mar 14, 2013
- Xerox Corporation
- Bryan R. Dolan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD AND SYSTEM FOR GENERATING TRACING INFORMATION FOR GAS CYLINDERS
- Publication number 20130043301
- Publication date Feb 21, 2013
- Faber Industrie
- Gian Luigi Cola
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Application
METHOD FOR MANUFACTURING ANTI-ELECTROMAGNETIC INTERFERENCE SHIELDS
- Publication number 20130025116
- Publication date Jan 31, 2013
- CHIN-WEN YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CONNECTOR
- Publication number 20130019471
- Publication date Jan 24, 2013
- Yazaki Cororation
- Takashi Omae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLUGGING A HOLE AND A PLUGGED HOLE
- Publication number 20130012078
- Publication date Jan 10, 2013
- AEROCRINE AB
- Andreas Fischer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20130008696
- Publication date Jan 10, 2013
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
- Publication number 20130003335
- Publication date Jan 3, 2013
- International Business Machines Corporation
- Kevin Bills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR CONTROLLING WAFER CURVATURE
- Publication number 20120329265
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Mohammed Fazil Fayaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD HEADED ELECTRIC PLUG ARM
- Publication number 20120289088
- Publication date Nov 15, 2012
- Apple Inc.
- Malcolm Early
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20120281370
- Publication date Nov 8, 2012
- Murata Manufacturing Co., Ltd.
- Hiroshi NISHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MOUNTING A CABLE CONNECTOR ONTO A PANEL
- Publication number 20120227262
- Publication date Sep 13, 2012
- Charles M. Gross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR WITH A CANTED COIL SPRING
- Publication number 20120174398
- Publication date Jul 12, 2012
- BAL SEAL ENGINEERING, INC.
- Steve Rust
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Automated Twist Pin Assembling Method for Interconnecting Stacked C...
- Publication number 20120117800
- Publication date May 17, 2012
- MEDALLION TECHNOLOGY, LLC
- Steven E. Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ASSEMBLING CAMERA MODULE
- Publication number 20120084976
- Publication date Apr 12, 2012
- Primax Electronics Ltd.
- Chien-Nan Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

by deforming or shaping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Electric machine with combined insulator and terminal assembly

Interface structure

Method of making an electronics package for an electric machine

Ultrasound endoscope and methods of manufacture thereof

Methods for making leads with radially-aligned segmented electrodes...

Monitoring device

Electrical connector with low-stress, reduced-electrical-length con...

Coreless multi-layer circuit substrate with minimized pad capacitance

Package-on-package assembly with wire bond vias

Methods for integrated circuit fabrication with protective coating...

Shielding electrical connector and method of making the same

Method and apparatus for mounting a cable connector onto a panel

Electrical connector with low-stress, reduced-electrical-length con...

Method of producing a detector

Probe card

Methods and systems for generating tracing information for gas cyli...

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Coreless multi-layer circuit substrate with minimized pad capacitance

Method for assembling an electrical connector assembly

Package-on-package assembly with wire bond vias

Method and system for generating tracing information for gas cylinders

Method of producing a land grid array (LGA) interposer utilizing me...

Method of manufacturing a medical lead

Circuit module and manufacturing method for the same

Method of fabricating a compliant membrane probe

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Package-on-package Assembly With Wire Bond Vias

ELECTRIC MACHINE WITH COMBINED INSULATOR AND TERMINAL ASSEMBLY

ULTRASOUND ENDOSCOPE AND METHODS OF MANUFACTURE THEREOF

MONITORING DEVICE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SHIELDING ELECTRICAL CONNECTOR AND METHOD OF MAKING THE SAME

METHODS AND SYSTEMS FOR GENERATING TRACING INFORMATION FOR GAS CYLI...

ELECTRICAL CONNECTOR ASSEMBLY AND METHOD OF ASSEMBLY

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

METHODS FOR INTEGRATED CIRCUIT FABRICATION WITH PROTECTIVE COATING...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

IN SITU FLEXIBLE CIRCUIT EMBOSSING TO FORM AN ELECTRICAL INTERCONNECT

METHOD AND SYSTEM FOR GENERATING TRACING INFORMATION FOR GAS CYLINDERS

METHOD FOR MANUFACTURING ANTI-ELECTROMAGNETIC INTERFERENCE SHIELDS

METHOD FOR MANUFACTURING CONNECTOR

METHOD FOR PLUGGING A HOLE AND A PLUGGED HOLE

CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE

METHODS AND STRUCTURES FOR CONTROLLING WAFER CURVATURE

COLD HEADED ELECTRIC PLUG ARM

CIRCUIT MODULE AND MANUFACTURING METHOD FOR THE SAME

METHOD AND APPARATUS FOR MOUNTING A CABLE CONNECTOR ONTO A PANEL

ELECTRICAL CONNECTOR WITH A CANTED COIL SPRING

Automated Twist Pin Assembling Method for Interconnecting Stacked C...

METHOD FOR ASSEMBLING CAMERA MODULE