by electroless plating

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CPC
H05K3/181

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/181by electroless plating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Four dimensional printed circuit boards
- Patent number 12,108,539
- Issue date Oct 1, 2024
- The Government of the United States of America, as represented by the Secreta...
- Jonathan D. Yuen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof to produce electrical circuits
- Patent number 12,063,748
- Issue date Aug 13, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for a printed wiring board
- Patent number 12,058,812
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Takuto Hidani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and production method for same
- Patent number 12,004,305
- Issue date Jun 4, 2024
- Resonac Corporation
- Masaya Toba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,979,990
- Issue date May 7, 2024
- Resonac Corporation
- Masaya Toba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronics module with raceway and submodules
- Patent number 11,924,983
- Issue date Mar 5, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Ryan J. Eickbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device housings with patterned electrolytic plating layers
- Patent number 11,910,538
- Issue date Feb 20, 2024
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 11,856,694
- Issue date Dec 26, 2023
- National Taiwan University of Science and Technology
- Chen-Hao Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing ceramic electronic component
- Patent number 11,821,090
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Yoshinori Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 11,792,930
- Issue date Oct 17, 2023
- Kyocera Corporation
- Yuki Takeshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting substrate to which image sensor is mounted, sensor package...
- Patent number 11,778,293
- Issue date Oct 3, 2023
- Canon Kabushiki Kaisha
- Dai Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,723,153
- Issue date Aug 8, 2023
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board
- Patent number 11,582,872
- Issue date Feb 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ke-Jian Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, device and system for providing etched metallization struct...
- Patent number 11,528,811
- Issue date Dec 13, 2022
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated laminate and printed circuit board
- Patent number 11,499,233
- Issue date Nov 15, 2022
- YMT CO., LTD.
- Sung Wook Chun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pattern plate for plating and method for manufacturing wiring board
- Patent number 11,479,860
- Issue date Oct 25, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takayoshi Nirengi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sheet material, metal mesh and manufacturing methods thereof
- Patent number 11,466,368
- Issue date Oct 11, 2022
- TDK Corporation
- Makoto Orikasa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for selectively metallizing surface of ceramic substrate, ce...
- Patent number 11,382,216
- Issue date Jul 5, 2022
- BYD Company Limited
- Qing Gong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit nanofiber web manufacturing method
- Patent number 11,324,123
- Issue date May 3, 2022
- Amogreentech Co., Ltd.
- In Yong Seo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and method for manufacturing printed circuit...
- Patent number 11,304,309
- Issue date Apr 12, 2022
- Sumitomo Electric Industries, Ltd.
- Shoichiro Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,297,720
- Issue date Apr 5, 2022
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,268,203
- Issue date Mar 8, 2022
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Formation of terminal metallurgy on laminates and boards
- Patent number 11,168,400
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,162,182
- Issue date Nov 2, 2021
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method, device and system for providing etched metallization struct...
- Patent number 11,116,084
- Issue date Sep 7, 2021
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,019,731
- Issue date May 25, 2021
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 11,013,124
- Issue date May 18, 2021
- Sumitomo Electric Industries, Ltd.
- Ryuta Ohsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using non-catalytic laminate with catalytic adhesive...
- Patent number 10,959,329
- Issue date Mar 23, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER COMPONENT SUBMOUNT AND MANUFACTURING METHOD THEREOF
- Publication number 20250142730
- Publication date May 1, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Jia-Zheng Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COIL DEVICE AND PRINTED WIRING BOARD
- Publication number 20250107001
- Publication date Mar 27, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250089171
- Publication date Mar 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20250063651
- Publication date Feb 20, 2025
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO MAKE THIN FILM ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040055
- Publication date Jan 30, 2025
- James S. Honan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS MODULE WITH RACEWAY AND SUBMODULES
- Publication number 20240414855
- Publication date Dec 12, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Ryan J. Eickbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Catalyzed Metal Foil and Uses Thereof
- Publication number 20240407106
- Publication date Dec 5, 2024
- Averatek Corporation
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PRODUCING PLATING DEPOSIT
- Publication number 20240351943
- Publication date Oct 24, 2024
- C. Uyemura & Co., Ltd.
- Takuya Komeda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240349430
- Publication date Oct 17, 2024
- IBIDEN CO., LTD.
- Kentaro WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306299
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240306308
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING METAL LAYERS ON GLASS-CONTAINING SUBSTRATE, AND...
- Publication number 20240292523
- Publication date Aug 29, 2024
- Corning Incorporated
- JOON-SOO KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240251508
- Publication date Jul 25, 2024
- Sumitomo Electric Industries, Ltd.
- Masamichi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240196528
- Publication date Jun 13, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sangik CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS
- Publication number 20240188225
- Publication date Jun 6, 2024
- Intel Corporation
- Vinith BEJUGAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PALLADIUM PLATING CATALYST LAYER BY LASER INDUCED FORWARD TRANSFER
- Publication number 20240179847
- Publication date May 30, 2024
- STMicroelectronics S.r.l.
- Paolo CREMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240164013
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gold Plating Bath and Gold Plated Final Finish
- Publication number 20240158941
- Publication date May 16, 2024
- MacDermid Enthone Inc.
- Roger Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORM...
- Publication number 20240114630
- Publication date Apr 4, 2024
- Meta Platforms Technologies, LLC
- Cameron Elliot Glasscock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...
- Publication number 20240057263
- Publication date Feb 15, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD
- Publication number 20240015889
- Publication date Jan 11, 2024
- Resonac Corporation
- Kei TOGASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20230413451
- Publication date Dec 21, 2023
- Sumitomo Electric Industries, Ltd.
- Shingo NAGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20230337370
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGE SUBSTRATE MANUFACTURING METHOD
- Publication number 20230326765
- Publication date Oct 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BOARD WITH ROUGHENED SURFACE AND METHOD FO...
- Publication number 20230302578
- Publication date Sep 28, 2023
- Toyota Jidosha Kabushiki Kaisha
- Hiroshi YANAGIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS MODULE WITH RACEWAY AND SUBMODULES
- Publication number 20230300996
- Publication date Sep 21, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Ryan J. Eickbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing a Component Carrier and a Component Carrier
- Publication number 20230171897
- Publication date Jun 1, 2023
- AT&S (China) Co. Ltd.
- Ismadi Bin ISMAIL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRODUCING METHOD OF WIRED CIRCUIT BOARD
- Publication number 20230073563
- Publication date Mar 9, 2023
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS WITH EMBOSSED METALIZED CIRCUIT TRACES
- Publication number 20230047568
- Publication date Feb 16, 2023
- Imagine TF, LLC
- Brian Edward Richardson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by electroless plating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of preparing a high density interconnect printed circuit boa...

Printed circuit board and method of fabricating the same

Four dimensional printed circuit boards

Catalyzed metal foil and uses thereof to produce electrical circuits

Substrate for a printed wiring board

Wiring board and production method for same

Wiring board and method for manufacturing the same

Electronics module with raceway and submodules

Electronic device housings with patterned electrolytic plating layers

Circuit substrate and method for manufacturing the same

Method of manufacturing ceramic electronic component

Wiring substrate, electronic device, and electronic module

Mounting substrate to which image sensor is mounted, sensor package...

Printed circuit board and method of fabricating the same

Circuit board

Method, device and system for providing etched metallization struct...

Plated laminate and printed circuit board

Pattern plate for plating and method for manufacturing wiring board

Sheet material, metal mesh and manufacturing methods thereof

Method for selectively metallizing surface of ceramic substrate, ce...

Printed circuit nanofiber web manufacturing method

Printed circuit board and method for manufacturing printed circuit...

Printed circuit board and method of fabricating the same

Tin or tin alloy plating solution

Formation of terminal metallurgy on laminates and boards

Tin or tin alloy plating solution

Method, device and system for providing etched metallization struct...

Printed circuit board and method of fabricating the same

Printed circuit board and method of manufacturing printed circuit b...

Circuit board using non-catalytic laminate with catalytic adhesive...

Patents Applicationslast 30 patents

POWER COMPONENT SUBMOUNT AND MANUFACTURING METHOD THEREOF

COIL DEVICE AND PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

METHOD TO MAKE THIN FILM ELECTRICALLY-CONDUCTIVE PATTERN

ELECTRONICS MODULE WITH RACEWAY AND SUBMODULES

Catalyzed Metal Foil and Uses Thereof

METHOD OF PRODUCING PLATING DEPOSIT

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

WIRING SUBSTRATE

SEMICONDUCTOR PACKAGE

METHOD FOR FORMING METAL LAYERS ON GLASS-CONTAINING SUBSTRATE, AND...

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD

GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS

PALLADIUM PLATING CATALYST LAYER BY LASER INDUCED FORWARD TRANSFER

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

Gold Plating Bath and Gold Plated Final Finish

SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORM...

METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...

METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PACKAGE SUBSTRATE MANUFACTURING METHOD

METHOD FOR MANUFACTURING BOARD WITH ROUGHENED SURFACE AND METHOD FO...

ELECTRONICS MODULE WITH RACEWAY AND SUBMODULES

Method of Manufacturing a Component Carrier and a Component Carrier

PRODUCING METHOD OF WIRED CIRCUIT BOARD

PRINTED CIRCUIT BOARDS WITH EMBOSSED METALIZED CIRCUIT TRACES