by embedding housing components in an adhesive or a polymer material

Industry

CPC
G02B6/4253

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4253by embedding housing components in an adhesive or a polymer material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic devices with molded polymer structures
- Patent number 12,108,547
- Issue date Oct 1, 2024
- Apple Inc.
- Dakota A Bass
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Completely encapsulated optical multi chip package
- Patent number 12,099,245
- Issue date Sep 24, 2024
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,947,173
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Photoelectric fiber and communication device
- Patent number 11,934,022
- Issue date Mar 19, 2024
- Nippon Telegraph and Telephone Corporation
- Norio Sato
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit and opto-electronic system comprising t...
- Patent number 11,899,254
- Issue date Feb 13, 2024
- EFFECT PHOTONICS B.V.
- Tsjerk Hans Hoekstra
- G02 - OPTICS
Information Patent Grant
Hermetic optical fiber alignment assembly having integrated optical...
- Patent number 11,892,691
- Issue date Feb 6, 2024
- Senko Advanced Components, Inc.
- Shuhe Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package structure
- Patent number 11,874,513
- Issue date Jan 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,686,908
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,614,592
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,585,992
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and fabrication method of the same
- Patent number 11,555,951
- Issue date Jan 17, 2023
- E Ink Holdings Inc.
- Chih-Cheng Ko
- G02 - OPTICS
Information Patent Grant
Optical transceivers with protective layers
- Patent number 11,487,066
- Issue date Nov 1, 2022
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,417,698
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- G02 - OPTICS
Information Patent Grant
Optical coupling device
- Patent number 11,402,591
- Issue date Aug 2, 2022
- Kabushiki Kaisha Toshiba
- Takamitsu Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 11,307,356
- Issue date Apr 19, 2022
- NTT Electronics Corporation
- Yuichi Suzuki
- G02 - OPTICS
Information Patent Grant
Silicon photonics integration method and structure
- Patent number 11,164,980
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,002,927
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sub-assembly for a module communicating over optical fiber,...
- Patent number 10,928,599
- Issue date Feb 23, 2021
- RADIALL
- Rémy Schwerzig
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 10,859,774
- Issue date Dec 8, 2020
- Sumitomo Electric Industries, Ltd.
- Yasushi Fujimura
- G02 - OPTICS
Information Patent Grant
Ferrule for light guide, assembly with ferrule, and method for prod...
- Patent number 10,802,191
- Issue date Oct 13, 2020
- Schott AG
- Alexander Penkert
- G02 - OPTICS
Information Patent Grant
Optoelectronic module assembly having an optical fiber alignment as...
- Patent number 10,718,914
- Issue date Jul 21, 2020
- CUDOQUANTA FLORIDA, INC.
- Shuhe Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Hermetic optical fiber alignment assembly
- Patent number 10,649,161
- Issue date May 12, 2020
- CUDOQUANTA FLORIDA, INC.
- Shuhe Li
- G02 - OPTICS
Information Patent Grant
Optical fiber fixing structure
- Patent number 10,551,576
- Issue date Feb 4, 2020
- Furukawa Electric Co., Ltd.
- Kazuki Yamaoka
- G02 - OPTICS
Information Patent Grant
Silicon photonics integration method and structure
- Patent number 10,546,962
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical fiber alignment device
- Patent number 10,495,830
- Issue date Dec 3, 2019
- Elenion Technologies, LLC
- Nathan A. Nuttall
- G02 - OPTICS
Information Patent Grant
Method of manufacturing photoelectric conversion connectors, as wel...
- Patent number 10,379,302
- Issue date Aug 13, 2019
- Hirose Electric Co., Ltd.
- Yoshiaki Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing photoelectric conversion connectors, as wel...
- Patent number 10,371,908
- Issue date Aug 6, 2019
- Hirose Electric Co., Ltd.
- Yoshiaki Sano
- G02 - OPTICS
Information Patent Grant
Flexible and stretchable optical interconnect in wearable systems
- Patent number 10,353,146
- Issue date Jul 16, 2019
- Intel Corporation
- Aleksandar Aleksov
- G02 - OPTICS
Information Patent Grant
Ruggedized photonic crystal sensor packaging
- Patent number 10,338,328
- Issue date Jul 2, 2019
- The Boeing Company
- Michael A. Carralero
- G02 - OPTICS
Information Patent Grant
Optical transmitting device including first lens and reflector moun...
- Patent number 10,268,007
- Issue date Apr 23, 2019
- OPTOMIND INC.
- Yung-sung Son
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE
- Publication number 20240219662
- Publication date Jul 4, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240213205
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20240192456
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
SEALING TRANSCEIVER-FIBEROPTICAL INTERFACES
- Publication number 20240027707
- Publication date Jan 25, 2024
- RF Scientific, LLC
- Nathan Bosch
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230369274
- Publication date Nov 16, 2023
- Taiwan Semiconduction Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20230280558
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH MULTIPLE WAVEGUIDES
- Publication number 20230258886
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- G02 - OPTICS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230236372
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
IMMERSION COMPATIBLE OPTICAL INTERCONNECT
- Publication number 20230194809
- Publication date Jun 22, 2023
- Intel Corporation
- Divya Pratap
- G02 - OPTICS
Information Patent Application
Waveguide Launcher in Package Based on High Dielectric Constant Car...
- Publication number 20230178500
- Publication date Jun 8, 2023
- NXP USA, Inc.
- Jinbang Tang
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230168451
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230152542
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
PACKAGE WITH OPTICAL WAVEGUIDE IN A GLASS CORE
- Publication number 20220404568
- Publication date Dec 22, 2022
- Intel Corporation
- Aleksandar ALEKSOV
- G02 - OPTICS
Information Patent Application
SEALED OPTICAL TRANSCEIVER
- Publication number 20220350089
- Publication date Nov 3, 2022
- SAMTEC, INC.
- Matthew Brian PUFFER
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20220328552
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Devices With Molded Polymer Structures
- Publication number 20220312607
- Publication date Sep 29, 2022
- Apple Inc.
- Dakota A. Bass
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT AND OPTO-ELECTRONIC SYSTEM COMPRISING T...
- Publication number 20220308298
- Publication date Sep 29, 2022
- EFFECT PHOTONICS B.V.
- Tsjerk Hans HOEKSTRA
- G02 - OPTICS
Information Patent Application
Photoelectric Fiber and Communication Device
- Publication number 20220269020
- Publication date Aug 25, 2022
- Nippon Telegraph and Telephone Corporation
- Norio Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLDED FIBER CONNECTOR ASSEMBLY FOR PLUGGABLE OPTICAL MCP
- Publication number 20220196939
- Publication date Jun 23, 2022
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Application
COMPLETELY ENCAPSULATED OPTICAL MULTI CHIP PACKAGE
- Publication number 20220196941
- Publication date Jun 23, 2022
- Intel Corporation
- Asako TODA
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSCEIVERS WITH PROTECTIVE LAYERS
- Publication number 20220146767
- Publication date May 12, 2022
- Mellanox Technologies TLV Ltd.
- Elad Mentovich
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL COUPLING DEVICE
- Publication number 20210294049
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Takamitsu Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210263243
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20210223489
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210202562
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Lun Chang
- G02 - OPTICS
Information Patent Application
HERMETIC OPTICAL FIBER ALIGNMENT ASSEMBLY HAVING INTEGRATED OPTICAL...
- Publication number 20210072471
- Publication date Mar 11, 2021
- CUDOQUANTA FLORIDA, INC.
- Shuhe LI
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20210003781
- Publication date Jan 7, 2021
- NTT ELECTRONICS CORPORATION
- Yuichi SUZUKI
- G02 - OPTICS
Information Patent Application
DISPLAY DEVICE AND FABRICATION METHOD OF THE SAME
- Publication number 20200400866
- Publication date Dec 24, 2020
- E Ink Holdings Inc.
- Chih-Cheng KO
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20200271873
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Lun Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE MULTI-FIBER/PORT HERMETIC CAPSULE AND METHOD
- Publication number 20200150363
- Publication date May 14, 2020
- Lightwave Logic Inc.
- Michael Lebby
- G02 - OPTICS

by embedding housing components in an adhesive or a polymer material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic devices with molded polymer structures

Completely encapsulated optical multi chip package

Photonic semiconductor device and method of manufacture

Photoelectric fiber and communication device

Photonic integrated circuit and opto-electronic system comprising t...

Hermetic optical fiber alignment assembly having integrated optical...

Package structure

Photonic semiconductor device and method of manufacture

Semiconductor devices and methods of manufacture

Package structure

Display device and fabrication method of the same

Optical transceivers with protective layers

Semiconductor package and method of forming the same

Optical coupling device

Optical module

Silicon photonics integration method and structure

Package structure

Optical sub-assembly for a module communicating over optical fiber,...

Optical module

Ferrule for light guide, assembly with ferrule, and method for prod...

Optoelectronic module assembly having an optical fiber alignment as...

Hermetic optical fiber alignment assembly

Optical fiber fixing structure

Silicon photonics integration method and structure

Optical fiber alignment device

Method of manufacturing photoelectric conversion connectors, as wel...

Method of manufacturing photoelectric conversion connectors, as wel...

Flexible and stretchable optical interconnect in wearable systems

Ruggedized photonic crystal sensor packaging

Optical transmitting device including first lens and reflector moun...

Patents Applicationslast 30 patents

OPTICAL MODULE

SEMICONDUCTOR DEVICE PACKAGE

Photonic Semiconductor Device and Method of Manufacture

SEALING TRANSCEIVER-FIBEROPTICAL INTERFACES

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

Photonic Semiconductor Device and Method of Manufacture

SEMICONDUCTOR PACKAGE STRUCTURE WITH MULTIPLE WAVEGUIDES

Semiconductor Devices and Methods of Manufacture

IMMERSION COMPATIBLE OPTICAL INTERCONNECT

Waveguide Launcher in Package Based on High Dielectric Constant Car...

PACKAGE STRUCTURE

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

PACKAGE WITH OPTICAL WAVEGUIDE IN A GLASS CORE

SEALED OPTICAL TRANSCEIVER

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Electronic Devices With Molded Polymer Structures

PHOTONIC INTEGRATED CIRCUIT AND OPTO-ELECTRONIC SYSTEM COMPRISING T...

Photoelectric Fiber and Communication Device

MOLDED FIBER CONNECTOR ASSEMBLY FOR PLUGGABLE OPTICAL MCP

COMPLETELY ENCAPSULATED OPTICAL MULTI CHIP PACKAGE

OPTICAL TRANSCEIVERS WITH PROTECTIVE LAYERS

OPTICAL COUPLING DEVICE

PACKAGE STRUCTURE

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

HERMETIC OPTICAL FIBER ALIGNMENT ASSEMBLY HAVING INTEGRATED OPTICAL...

OPTICAL MODULE

DISPLAY DEVICE AND FABRICATION METHOD OF THE SAME

PACKAGE STRUCTURE

CONDUCTIVE MULTI-FIBER/PORT HERMETIC CAPSULE AND METHOD