by exposing the layer to particle radiation

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CPC
H01L21/76825

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76825by exposing the layer to particle radiation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 12,170,199
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,136,566
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale resolution, spatially-controlled conductivity modulation...
- Patent number 12,112,982
- Issue date Oct 8, 2024
- Northwestern University
- Hooman Mohseni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,087,622
- Issue date Sep 10, 2024
- Renesas Electronics Corporation
- Kazuyuki Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,080,751
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsueh-Han Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal loss prevention using implantation
- Patent number 12,068,195
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET fabrication methods
- Patent number 12,068,392
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 12,057,345
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive features having varying resistance
- Patent number 12,057,392
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jia-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,051,619
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,051,620
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 12,046,508
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure in three-dimensional memory device and method f...
- Patent number 12,002,757
- Issue date Jun 4, 2024
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization system, planarization process, and method of manufact...
- Patent number 11,972,976
- Issue date Apr 30, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential hardmasks for modulation of electrobucket sensitivity
- Patent number 11,955,377
- Issue date Apr 9, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devices
- Patent number 11,955,430
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch barrier for microelectronic packaging conductive structures
- Patent number 11,948,898
- Issue date Apr 2, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a FinFET by implanting a dielectric with a...
- Patent number 11,901,455
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,901,437
- Issue date Feb 13, 2024
- Marlin Semiconductor Limited
- Te-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with covering liners
- Patent number 11,894,264
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable patterning through layer expansion process and resulting s...
- Patent number 11,854,868
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with material modification and low resistan...
- Patent number 11,854,871
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with polymer-based insulating material and met...
- Patent number 11,804,432
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor with sidewall having reduced roughness
- Patent number 11,798,979
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connecting structure having a doped layer...
- Patent number 11,791,204
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 11,791,154
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure manufacturing method and manufacturing device, and light...
- Patent number 11,756,827
- Issue date Sep 12, 2023
- Sumitomo Chemical Company, Limited
- Fumimasa Horikiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal loss prevention using implantation
- Patent number 11,710,659
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of micro-via formation for advanced packaging
- Patent number 11,705,365
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION...
- Publication number 20240429092
- Publication date Dec 26, 2024
- Northwestern University
- Hooman Mohseni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240413074
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20240395606
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING S...
- Publication number 20240387246
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20240379420
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER
- Publication number 20240371688
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET FABRICATION METHODS
- Publication number 20240371970
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun Hsiung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371919
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Han LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURES HAVING VARYING RESISTANCE
- Publication number 20240355730
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jia-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH CONTROLLED GATE CONTACT PROFILE
- Publication number 20240332063
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD F...
- Publication number 20240274535
- Publication date Aug 15, 2024
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203885
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A FINFET BY IMPLANTING A DIELECTRIC WITH A...
- Publication number 20240145596
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...
- Publication number 20240087952
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cyclic Spin-On Coating Process for Forming Dielectric Material
- Publication number 20230411150
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230395388
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- LI-HAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230395387
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- LI-HAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20230369103
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING S...
- Publication number 20230369098
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230369386
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Han LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20230361023
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Loss Prevention Using Implantation
- Publication number 20230317519
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD F...
- Publication number 20230253319
- Publication date Aug 10, 2023
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SPACERS WITH HARD MASKS FORMED USING A SUBTRACTIVE PROCESS
- Publication number 20230230919
- Publication date Jul 20, 2023
- Intel Corporation
- Nafees A. Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR CREATING BLIND ANNULAR VIAS FOR METALLIZED VIAS
- Publication number 20230207385
- Publication date Jun 29, 2023
- Corning Incorporated
- Patrick Scott Leslie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF INCREASING RESISTIVITY OF SILICON CARBIDE WAFER AND HIGH-...
- Publication number 20230207386
- Publication date Jun 29, 2023
- Industrial Technology Research Institute
- Mao-Nan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE BREAKDOWN FAILURE IN A MIM CAPACITOR
- Publication number 20230187478
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20230187270
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20230187276
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS

by exposing the layer to particle radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cyclic spin-on coating process for forming dielectric material

Semiconductor device and method of manufacture

Nanoscale resolution, spatially-controlled conductivity modulation...

Method of manufacturing semiconductor device

Semiconductor device structure and methods of forming the same

Metal loss prevention using implantation

FinFET fabrication methods

Etch profile control of gate contact opening

Conductive features having varying resistance

Semiconductor device and method of manufacture

Semiconductor structure and method for manufacturing the same

Method of dielectric material fill and treatment

Staircase structure in three-dimensional memory device and method f...

Planarization system, planarization process, and method of manufact...

Semiconductor device including a porous dielectric layer, and metho...

Differential hardmasks for modulation of electrobucket sensitivity

Method of manufacturing semiconductor device and semiconductor devices

Etch barrier for microelectronic packaging conductive structures

Method of manufacturing a FinFET by implanting a dielectric with a...

Semiconductor device and method for fabricating the same

Method for fabricating semiconductor device with covering liners

Scalable patterning through layer expansion process and resulting s...

Semiconductor structure with material modification and low resistan...

Semiconductor device with polymer-based insulating material and met...

Integrated capacitor with sidewall having reduced roughness

Semiconductor device with connecting structure having a doped layer...

Cyclic spin-on coating process for forming dielectric material

Structure manufacturing method and manufacturing device, and light...

Metal loss prevention using implantation

Methods of micro-via formation for advanced packaging

Patents Applicationslast 30 patents

NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION...

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING S...

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER

FINFET FABRICATION METHODS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

CONDUCTIVE FEATURES HAVING VARYING RESISTANCE

DEVICE WITH CONTROLLED GATE CONTACT PROFILE

STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD F...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A FINFET BY IMPLANTING A DIELECTRIC WITH A...

SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...

Cyclic Spin-On Coating Process for Forming Dielectric Material

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING S...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

Metal Loss Prevention Using Implantation

STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD F...

METAL SPACERS WITH HARD MASKS FORMED USING A SUBTRACTIVE PROCESS

TECHNIQUES FOR CREATING BLIND ANNULAR VIAS FOR METALLIZED VIAS

METHOD OF INCREASING RESISTIVITY OF SILICON CARBIDE WAFER AND HIGH-...

METHOD TO REDUCE BREAKDOWN FAILURE IN A MIM CAPACITOR

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT