by forming silicides of refractory metals

Industry

CPC
H01L21/76889

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76889by forming silicides of refractory metals

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 12,125,791
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Jeeyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,087,826
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,087,575
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,074,062
- Issue date Aug 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Taoyan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile semiconductor memory device and manufacturing method t...
- Patent number 12,063,779
- Issue date Aug 13, 2024
- Kioxia Corporation
- Yoshihiro Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plug with impurity variation
- Patent number 12,033,893
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and fabrication method thereof
- Patent number 12,027,463
- Issue date Jul 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating conductive layer stack and method for fabric...
- Patent number 12,014,955
- Issue date Jun 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Che-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicide films through selective deposition
- Patent number 11,978,635
- Issue date May 7, 2024
- Applied Materials, Inc.
- Swaminathan Srinivasan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and structure for semiconductor interconnect
- Patent number 11,961,731
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ru-Shang Hsiao
- B08 - CLEANING
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,935,835
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Hyo-Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with intervening layer
- Patent number 11,894,268
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor device
- Patent number 11,881,493
- Issue date Jan 23, 2024
- United Microelectronics Corp.
- Ming-Shing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive layer stack and semiconductor device with a gate contact
- Patent number 11,876,051
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Che-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 11,856,764
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure of a semiconductor device
- Patent number 11,854,875
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact structure and method of forming the same in a semicon...
- Patent number 11,854,874
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gates of transistors having reduced resistivity
- Patent number 11,810,819
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact metal
- Patent number 11,791,208
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor having an emitter region with a silicide spaced apart fr...
- Patent number 11,791,405
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plug with impurity variation
- Patent number 11,769,694
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, fabricating method thereof, and semicond...
- Patent number 11,749,603
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 11,721,630
- Issue date Aug 8, 2023
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxygen-free replacement liner for improved transistor performance
- Patent number 11,688,635
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, fabricating method thereof, and semicond...
- Patent number 11,682,625
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,646,231
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with self-aligned landi...
- Patent number 11,621,265
- Issue date Apr 4, 2023
- NANYA TECHNOLOGY CORPORATION
- Te-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite landing pad
- Patent number 11,587,876
- Issue date Feb 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with intervening layer and method for fabricat...
- Patent number 11,574,841
- Issue date Feb 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD T...
- Publication number 20240365540
- Publication date Oct 31, 2024
- KIOXIA Corporation
- Yoshihiro AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE
- Publication number 20240363339
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR INTERCONNECT
- Publication number 20240258096
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ru-Shang Hsiao
- B08 - CLEANING
Information Patent Application
CONTACT RESISTANCE REDUCTION BY INTEGRATION OF MOLYBDENUM WITH TITA...
- Publication number 20240234209
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Avgerinos V. Gelatos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20240096697
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20240081052
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Plug with Impurity Variation
- Publication number 20240021471
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Gates of Transistors Having Reduced Resistivity
- Publication number 20240021473
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ching TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION PROCESS FOR CMOS DEVICES
- Publication number 20240014075
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING TRANSISTORS WITH IMPLANTING DOPANTS AT FIRST AND SECOND...
- Publication number 20230411501
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CONTACT METAL
- Publication number 20230386918
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...
- Publication number 20230326860
- Publication date Oct 12, 2023
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING MIDDLE-OF-LINE (MOL) CAPACITANCE...
- Publication number 20230299134
- Publication date Sep 21, 2023
- TESSERA LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20230253254
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CONDUCTIVE LAYER STACK AND METHOD FOR FABRIC...
- Publication number 20230223300
- Publication date Jul 13, 2023
- NANYA TECHNOLOGY CORPORATION
- CHE-HSIEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20230223302
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LAYER STACK AND SEMICONDUCTOR DEVICE WITH A GATE CONTACT
- Publication number 20230223342
- Publication date Jul 13, 2023
- NANYA TECHNOLOGY CORPORATION
- CHE-HSIEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20230170397
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH SILICIDE PORTION BETWEEN CONDUC...
- Publication number 20230146713
- Publication date May 11, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR DEVICE
- Publication number 20230082279
- Publication date Mar 16, 2023
- UNITED MICROELECTRONICS CORP.
- Ming-Shing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230056809
- Publication date Feb 23, 2023
- RENESAS ELECTRONICS CORPORATION
- Takeshi KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-DEPOSITION OF TITANIUM AND SILICON FOR IMPROVED SILICON GERMANIU...
- Publication number 20220416032
- Publication date Dec 29, 2022
- Intel Corporation
- Debaleena Nandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220367263
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20220367646
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-WEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND SEMICOND...
- Publication number 20220344274
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20220320129
- Publication date Oct 6, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20220277993
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS

by forming silicides of refractory metals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming stacked trench contacts and structures formed the...

Semiconductor devices and electronic systems including the same

Method for forming a semiconductor structure

Conductive feature formation and structure

Method for manufacturing semiconductor structure

Non-volatile semiconductor memory device and manufacturing method t...

Contact plug with impurity variation

Memory device and fabrication method thereof

Method for fabricating conductive layer stack and method for fabric...

Silicide films through selective deposition

Method and structure for semiconductor interconnect

Methods of manufacturing semiconductor devices

Method for fabricating semiconductor device with intervening layer

Semiconductor image sensor device

Conductive layer stack and semiconductor device with a gate contact

Memory arrays comprising strings of memory cells and methods used i...

Contact structure of a semiconductor device

Metal contact structure and method of forming the same in a semicon...

Metal gates of transistors having reduced resistivity

Method of forming contact metal

Transistor having an emitter region with a silicide spaced apart fr...

Contact plug with impurity variation

Interconnection structure, fabricating method thereof, and semicond...

Method of forming stacked trench contacts and structures formed the...

Oxygen-free replacement liner for improved transistor performance

Interconnection structure, fabricating method thereof, and semicond...

Semiconductor device and method

Method for fabricating semiconductor device with self-aligned landi...

Method for preparing semiconductor device with composite landing pad

Semiconductor device with intervening layer and method for fabricat...

Patents Applicationslast 30 patents

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD T...

CONDUCTIVE FEATURE FORMATION AND STRUCTURE

METHOD AND STRUCTURE FOR SEMICONDUCTOR INTERCONNECT

CONTACT RESISTANCE REDUCTION BY INTEGRATION OF MOLYBDENUM WITH TITA...

CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE

Metal Contact Structure and Method of Forming the Same in a Semicon...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Contact Plug with Impurity Variation

Metal Gates of Transistors Having Reduced Resistivity

CONTACT FORMATION PROCESS FOR CMOS DEVICES

FABRICATING TRANSISTORS WITH IMPLANTING DOPANTS AT FIRST AND SECOND...

METHOD OF FORMING CONTACT METAL

METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...

SEMICONDUCTOR STRUCTURES INCLUDING MIDDLE-OF-LINE (MOL) CAPACITANCE...

Semiconductor Device and Method

METHOD FOR FABRICATING CONDUCTIVE LAYER STACK AND METHOD FOR FABRIC...

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

CONDUCTIVE LAYER STACK AND SEMICONDUCTOR DEVICE WITH A GATE CONTACT

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH SILICIDE PORTION BETWEEN CONDUC...

SEMICONDUCTOR IMAGE SENSOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CO-DEPOSITION OF TITANIUM AND SILICON FOR IMPROVED SILICON GERMANIU...

Semiconductor Device and Method

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND SEMICOND...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE