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HEAT SINK ASSEMBLY
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Publication number 20250240910
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Publication date Jul 24, 2025
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ABB Schweiz AG
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Antti Karhunen
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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IMPROVED MICROCHANNEL EVAPORATOR
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Publication number 20250240921
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Publication date Jul 24, 2025
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WIELAND PROVIDES S.R.L.
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Franco PROVENZIANI
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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COMPUTING DEVICE AND COMPUTING NODE
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Publication number 20250240925
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Publication date Jul 24, 2025
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XFUSION DIGITAL TECHNOLOGIES CO., LTD
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Chenglong Wang
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HANDHELD ELECTRONIC DEVICE
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Publication number 20250240360
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Publication date Jul 24, 2025
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Apple Inc.
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Banafsheh Barabadi
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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ELECTRONIC CONTROL DEVICE
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Publication number 20250240934
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Publication date Jul 24, 2025
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Hitachi Astemo, Ltd.
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Minami TERANISHI
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HEAT DISSIPATION SYSTEM AND POWER DEVICE
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Publication number 20250227899
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Publication date Jul 10, 2025
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Huawei Digital Power Technologies Co., Ltd.
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Jiyang LI
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HEAT DISSIPATION SYSTEM AND POWER DEVICE
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Publication number 20250227882
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Publication date Jul 10, 2025
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Huawei Digital Power Technologies Co., Ltd.
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Jiyang LI
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HEAT SINK STRUCTURE AND METHODS THEREOF
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Publication number 20250227884
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Publication date Jul 10, 2025
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chien Hao HSU
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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