by immersion

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CPC
H05K7/203

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/203by immersion

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power supply device and printed circuit board device comprising same
- Patent number 12,328,853
- Issue date Jun 10, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Tai Ma
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Folded-fin vapor chamber cold plate
- Patent number 12,324,127
- Issue date Jun 3, 2025
- Hewlett Packard Enterprise Development LP
- Steven Dean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of subsidizing cost of providing information
- Patent number 12,321,209
- Issue date Jun 3, 2025
- MARA Holdings, Inc.
- Carl Meinhart
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Battery module and vehicle including the same
- Patent number 12,322,780
- Issue date Jun 3, 2025
- Samsung SDI Co., Ltd.
- Junseop Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum computing system having flex circuit boards for improved si...
- Patent number 12,321,822
- Issue date Jun 3, 2025
- Google LLC
- John Martinis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gravity independent liquid cooling for electronics
- Patent number 12,324,128
- Issue date Jun 3, 2025
- Worcester Polytechnic Institute
- Jamal S. Yagoobi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manifold systems, devices, and methods for thermal management of ha...
- Patent number 12,324,131
- Issue date Jun 3, 2025
- Seguente, Inc.
- Raffaele Luca Amalfi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermal management for composite tooling
- Patent number 12,321,669
- Issue date Jun 3, 2025
- The Boeing Company
- Michael D. Nevinsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Desktop electronic device
- Patent number 12,321,205
- Issue date Jun 3, 2025
- Apple Inc.
- Brett W. Degner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module comprising a pulsating heat pipe
- Patent number 12,322,675
- Issue date Jun 3, 2025
- Siemens Aktiengesellschaft
- Florian Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable thermal solution
- Patent number 12,316,932
- Issue date May 27, 2025
- GoPro, Inc.
- Nicholas Vitale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image capturing apparatus comprising cooling device and image senso...
- Patent number 12,316,933
- Issue date May 27, 2025
- Canon Kabushiki Kaisha
- Go Togashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stack-PCB architecture with embedded vapor chamber
- Patent number 12,317,408
- Issue date May 27, 2025
- Meta Platforms Technologies, LLC
- Michael Nikkhoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat dissipating structure
- Patent number 12,317,452
- Issue date May 27, 2025
- Lenovo (Beijing) Limited
- Xintong Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slotted absorber
- Patent number 12,317,465
- Issue date May 27, 2025
- Cisco Technology, Inc.
- Jianquan Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depilator
- Patent number 12,310,479
- Issue date May 27, 2025
- SHENZHEN ULIKE SMART ELECTRONICS CO., LTD.
- Yuping Pan
- A45 - HAND OR TRAVELLING ARTICLES
Information Patent Grant
Multi-header pipe distributing annular printed circuit heat exchanger
- Patent number 12,313,355
- Issue date May 27, 2025
- Xi'an Jiaotong University
- Ting Ma
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Access point device
- Patent number 12,317,410
- Issue date May 27, 2025
- Google LLC
- Yau-Shing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cooled power converter
- Patent number 12,316,238
- Issue date May 27, 2025
- Marel Power Solutions, Inc.
- Ian Byers
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Boiler plates for computing systems
- Patent number 12,317,451
- Issue date May 27, 2025
- ZT GROUP INT'L, INC.
- Ting Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-conductive resin composition and heat dissipation sheet
- Patent number 12,305,113
- Issue date May 20, 2025
- DENKA COMPANY LIMITED
- Kosuke Wada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 12,309,912
- Issue date May 20, 2025
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Configurable multi-chip module heatsink for selective dissipation o...
- Patent number 12,309,962
- Issue date May 20, 2025
- International Business Machines Corporation
- William James Anderl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Receptacle with connectable spring finger for multipoint contact co...
- Patent number 12,309,969
- Issue date May 20, 2025
- Hewlett Packard Enterprise Development LP
- Harvey J. Lunsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-stacked motherboards for fluid immersion cooling
- Patent number 12,309,971
- Issue date May 20, 2025
- Super Micro Computer, Inc.
- Yueh Ming Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bellows for immersion cooling
- Patent number 12,309,972
- Issue date May 20, 2025
- MTS IP Holdings Ltd
- Nihal Joshua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical and electrical connection clamp
- Patent number 12,308,542
- Issue date May 20, 2025
- Advanced Energy Industries, Inc.
- Jon Danielson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COOLER
- Publication number 20250194043
- Publication date Jun 12, 2025
- TILTA INC.
- Shujin FU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Integrated, Pumped, Closed-Loop Two-Phase Heatsink
- Publication number 20250194049
- Publication date Jun 12, 2025
- Google LLC
- Tanya Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electric Bicycle, and Control Unit for Use in Such a Bicycle
- Publication number 20250194052
- Publication date Jun 12, 2025
- MA Micro Limited
- Olivier Hébert
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
ELECTRONIC DEVICE COMPRISING STRUCTURE FOR DISSIPATING HEAT TO OUTSIDE
- Publication number 20250194062
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Musul KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMMERSION COOLING FIN ASSEMBLY AND IMMERSION COOLING SYSTEM FOR TWO...
- Publication number 20250194048
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-Hsien WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Computing Device and Phase-Change Liquid Immersion Cooling System-B...
- Publication number 20250194050
- Publication date Jun 12, 2025
- Huawei Cloud Computing Technologies Co., Ltd.
- Xidong Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR AND SCALABLE QUANUTM COMPUTER WITH TRAPEZOIDAL UNIT CELLS
- Publication number 20250194051
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Shawn Anthony Hall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK ASSEMBLIES HAVING ELLIPTICAL FINS AND BAFFLE AND AIRCRAFT...
- Publication number 20250194053
- Publication date Jun 12, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
THERMAL MODULE AND PROJECTOR
- Publication number 20250189876
- Publication date Jun 12, 2025
- CORETRONIC CORPORATION
- Pei-Rong Wu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TANK FOR HEAT DISSIPATION AND A COOLING SYSTEM INCLUDING THE SAME
- Publication number 20250185218
- Publication date Jun 5, 2025
- FIRMUS METAL TECHNOLOGIES SINGAPORE PTE LTD
- Jonathan LEVEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Immersion Cooling Platform with an Adjustable Weir and Multi...
- Publication number 20250185205
- Publication date Jun 5, 2025
- Modine LLC
- Richard Margerison
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR RECOVERING FLUID IN IMMERSION-COOLED DATACE...
- Publication number 20250185210
- Publication date Jun 5, 2025
- Microsoft Technology Licensing, LLC
- Felipe Enrique ORTEGA GUTIERREZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular Cooling Systems
- Publication number 20250185212
- Publication date Jun 5, 2025
- Calaris Technologies
- Rob Weber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING V...
- Publication number 20250185214
- Publication date Jun 5, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinichiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION CONTROL METHOD AND APPARATUS BASED ON COOLING TOWE...
- Publication number 20250185217
- Publication date Jun 5, 2025
- Bitmain Technologies Inc.
- Tianhao LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER ROOM THERMO-HYGROSTAT USING OUTDOOR AIR
- Publication number 20250185219
- Publication date Jun 5, 2025
- CHUNG LOCK OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOCURABLE INKS AND PRIMERS FOR AUTOMOTIVE INTERIOR APPLICATIONS...
- Publication number 20250178956
- Publication date Jun 5, 2025
- Corning Incorporated
- Carlos Francis Alonzo
- B60 - VEHICLES IN GENERAL
Information Patent Application
TWO-PHASE RADIATING FIN AND HEAT SINK
- Publication number 20250185211
- Publication date Jun 5, 2025
- ZTE Corporation
- Kaiwen DUAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT SYSTEM, ENERGY STORAGE DEVICE, AND PHOTOVOLTAIC...
- Publication number 20250185213
- Publication date Jun 5, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Tao HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION MEMBER
- Publication number 20250185215
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Byeonguk MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED RACK POWER-COOLING DELIVERY DEVICE
- Publication number 20250185222
- Publication date Jun 5, 2025
- VERTIV CORPORATION
- Philip R. Aldag
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR COOLING IN A HEADSET DISPLAY
- Publication number 20250185223
- Publication date Jun 5, 2025
- Meta Platforms Technologies, LLC
- Giti Karimi Moghaddam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK STRUCTURE
- Publication number 20250176139
- Publication date May 29, 2025
- KMW Inc.
- Duk Yong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENERGY STORAGE INVERTER
- Publication number 20250175092
- Publication date May 29, 2025
- Jinko Energy Storage Technology Co., Ltd.
- Jian YU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HEAT DISSIPATION DEVICE FOR AN UNDERWATER EQUIPMENT
- Publication number 20250176142
- Publication date May 29, 2025
- HMN Technologies Co., Limited
- Ling Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE
- Publication number 20250176144
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- Meng-Lin WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROFLUIDIC PRINTED CIRCUIT BOARD COOLING
- Publication number 20250176095
- Publication date May 29, 2025
- Microsoft Technology Licensing, LLC
- Shubhangi TEWARI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK
- Publication number 20250176130
- Publication date May 29, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Shuta HIKICHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS
- Publication number 20250176138
- Publication date May 29, 2025
- Microsoft Technology Licensing, LLC
- Husam Atallah ALISSA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION-TYPE HEAT DISSIPATING DEVICE
- Publication number 20250176137
- Publication date May 29, 2025
- COOLER MASTER., LTD.
- CHENG-SHU PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by immersion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for galvanic isolation for inverter for electri...

Power supply device and printed circuit board device comprising same

Folded-fin vapor chamber cold plate

Method of subsidizing cost of providing information

Battery module and vehicle including the same

Quantum computing system having flex circuit boards for improved si...

Gravity independent liquid cooling for electronics

Manifold systems, devices, and methods for thermal management of ha...

Systems and methods for data recorder for inverter for electric veh...

Thermal management for composite tooling

Desktop electronic device

Electronic module comprising a pulsating heat pipe

Adjustable thermal solution

Image capturing apparatus comprising cooling device and image senso...

Stack-PCB architecture with embedded vapor chamber

Systems and methods for an interlocking feature on a power module

Heat dissipating structure

Slotted absorber

Depilator

Multi-header pipe distributing annular printed circuit heat exchanger

Access point device

Air-cooled power converter

Boiler plates for computing systems

Heat-conductive resin composition and heat dissipation sheet

Electronic assemblies having embedded passive heat pipes and associ...

Configurable multi-chip module heatsink for selective dissipation o...

Receptacle with connectable spring finger for multipoint contact co...

Dual-stacked motherboards for fluid immersion cooling

Bellows for immersion cooling

Mechanical and electrical connection clamp

Patents Applicationslast 30 patents

COOLER

Integrated, Pumped, Closed-Loop Two-Phase Heatsink

Electric Bicycle, and Control Unit for Use in Such a Bicycle

ELECTRONIC DEVICE COMPRISING STRUCTURE FOR DISSIPATING HEAT TO OUTSIDE

IMMERSION COOLING FIN ASSEMBLY AND IMMERSION COOLING SYSTEM FOR TWO...

Computing Device and Phase-Change Liquid Immersion Cooling System-B...

MODULAR AND SCALABLE QUANUTM COMPUTER WITH TRAPEZOIDAL UNIT CELLS

HEAT SINK ASSEMBLIES HAVING ELLIPTICAL FINS AND BAFFLE AND AIRCRAFT...

THERMAL MODULE AND PROJECTOR

TANK FOR HEAT DISSIPATION AND A COOLING SYSTEM INCLUDING THE SAME

Liquid Immersion Cooling Platform with an Adjustable Weir and Multi...

SYSTEMS AND METHODS FOR RECOVERING FLUID IN IMMERSION-COOLED DATACE...

Modular Cooling Systems

VAPOR CHAMBER, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING V...

HEAT DISSIPATION CONTROL METHOD AND APPARATUS BASED ON COOLING TOWE...

SERVER ROOM THERMO-HYGROSTAT USING OUTDOOR AIR

PHOTOCURABLE INKS AND PRIMERS FOR AUTOMOTIVE INTERIOR APPLICATIONS...

TWO-PHASE RADIATING FIN AND HEAT SINK

THERMAL MANAGEMENT SYSTEM, ENERGY STORAGE DEVICE, AND PHOTOVOLTAIC...

ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION MEMBER

INTEGRATED RACK POWER-COOLING DELIVERY DEVICE

SYSTEM FOR COOLING IN A HEADSET DISPLAY

HEAT SINK STRUCTURE

ENERGY STORAGE INVERTER

HEAT DISSIPATION DEVICE FOR AN UNDERWATER EQUIPMENT

HEAT DISSIPATION STRUCTURE

MICROFLUIDIC PRINTED CIRCUIT BOARD COOLING

HEAT SINK

SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS

IMMERSION-TYPE HEAT DISSIPATING DEVICE