by immersion

Industry

CPC
H05K7/203

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/203by immersion

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Active heat dissipating apparatus for a terminal, terminal, and act...
- Patent number 12,169,426
- Issue date Dec 17, 2024
- ZTE Corporation
- Yan Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Evaporative cooling logic control method and apparatus of inductive...
- Patent number 12,171,085
- Issue date Dec 17, 2024
- ETS SOLUTIONS (BEIJING) LTD.
- Yaming Qin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat diffuser in wrist worn wireless power and data system
- Patent number 12,170,549
- Issue date Dec 17, 2024
- NuCurrent, Inc.
- Pratik Halyal
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of subsidizing cost of providing information
- Patent number 12,171,084
- Issue date Dec 17, 2024
- MARA Holdings, Inc.
- Carl D. Meinhart
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cold plates incorporating S-cells
- Patent number 12,165,954
- Issue date Dec 10, 2024
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for electromagnetic shielding of thermal fin packs
- Patent number 12,167,572
- Issue date Dec 10, 2024
- Microsoft Technology Licensing, LLC
- Jason A. Harrigan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for an uneven thickness heat spreader
- Patent number 12,167,573
- Issue date Dec 10, 2024
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Powertrain system of an aircraft including cyrogenic cooling loop f...
- Patent number 12,162,619
- Issue date Dec 10, 2024
- RTX Corporation
- Neil J. Terwilliger
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Active heat sink
- Patent number 12,167,574
- Issue date Dec 10, 2024
- Frore Systems Inc.
- Ananth Saran Yalamarthy
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Pluggable module and cage for improving airflow in network switch s...
- Patent number 12,167,577
- Issue date Dec 10, 2024
- Arista Networks, Inc.
- Youngbae Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,167,571
- Issue date Dec 10, 2024
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laser-welded cooling plate
- Patent number 12,167,575
- Issue date Dec 10, 2024
- STAFL SYSTEMS, LLC
- Benjamin Michael Levy
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heatpipe to help reduce radio frequency interference
- Patent number 12,160,216
- Issue date Dec 3, 2024
- Intel Corporation
- Kae-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-way flow controller paths for single-phase and two-phase cool...
- Patent number 12,160,981
- Issue date Dec 3, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device
- Patent number 12,158,308
- Issue date Dec 3, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid immersion cooling apparatus
- Patent number 12,160,978
- Issue date Dec 3, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Xue-Feng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-phase immersion-type heat dissipation structure having porous s...
- Patent number 12,156,376
- Issue date Nov 26, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Ching-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion cooling system
- Patent number 12,156,377
- Issue date Nov 26, 2024
- Delta Electronics, Inc.
- Li-Kuang Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor chamber for cooling an electronic component, electronic arran...
- Patent number 12,156,378
- Issue date Nov 26, 2024
- ABB Schweiz AG
- Bruno Agostini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Devices, systems, and methods for a hybrid cooling system
- Patent number 12,156,383
- Issue date Nov 26, 2024
- Microsoft Technology Licensing, LLC
- Brandon Earl Gary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal Interface Material (TIM) filling structure for high warpage...
- Patent number 12,156,324
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- Yongguo Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microchannel heat sink and method of manufacturing the same
- Patent number 12,151,279
- Issue date Nov 26, 2024
- FOSHAN HUAZHI ADVANCED MATERIALS CO., LTD.
- Zheng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature management system for autonomous vehicles
- Patent number 12,156,369
- Issue date Nov 26, 2024
- TUSIMPLE, INC.
- Kaixin Zheng
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor storage device
- Patent number 12,156,379
- Issue date Nov 26, 2024
- Kioxia Corporation
- Seiichi Tajima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rack system for housing an electronic device
- Patent number 12,156,370
- Issue date Nov 26, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Immersion cooling system and cooling method thereof
- Patent number 12,150,275
- Issue date Nov 19, 2024
- Delta Electronics, Inc.
- Li-Hsiu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible vapor chamber with shape memory material
- Patent number 12,146,476
- Issue date Nov 19, 2024
- Intel Corporation
- Jeff Ku
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Grant
Heat dissipating apparatus for electronic elements
- Patent number 12,150,278
- Issue date Nov 19, 2024
- KMW Inc.
- Kyo Sung Ji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INJECTABLE THERMALLY CONDUCTIVE CURABLE COMPOSITION
- Publication number 20240417534
- Publication date Dec 19, 2024
- Sika Technology AG
- David HOFSTETTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE THERMAL ENERGY STORAGE AND DISSIPATION
- Publication number 20240422943
- Publication date Dec 19, 2024
- U.S. Army DEVCOM, Army Research Laboratory
- Darin J. Sharar
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Diagnostic Apparatus
- Publication number 20240418802
- Publication date Dec 19, 2024
- The Boeing Company
- Ian M. Dayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM WITH AIRTIGHT LINK LATCH COVER STRUCTURE
- Publication number 20240422942
- Publication date Dec 19, 2024
- Delta Electronics, Inc.
- Chia-Hsing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED THERMAL INTERFACE FOR CAGE MOUNTED ELECTRONIC DEVICES
- Publication number 20240422945
- Publication date Dec 19, 2024
- AirBorn, Inc.
- Andrew Tarnow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVER FOR HEAT GENERATING ELECTRONIC COMPONENT
- Publication number 20240422944
- Publication date Dec 19, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yuuki SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDED GRAPHITE FINS FOR HEATSINKS
- Publication number 20240422946
- Publication date Dec 19, 2024
- Microsoft Technology Licensing, LLC
- Luke Thomas GREGORY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240414248
- Publication date Dec 12, 2024
- Honor Device Co., Ltd.
- Bin Yan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT-SINK FIXING STRUCTURE
- Publication number 20240414884
- Publication date Dec 12, 2024
- JVCKENWOOD CORPORATION
- Daisuke Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM FOR POWER ELECTRONICS
- Publication number 20240414881
- Publication date Dec 12, 2024
- Carrier Corporation
- Arindom Joardar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGER
- Publication number 20240414882
- Publication date Dec 12, 2024
- Rolls-Royce plc
- Daniele M GORLA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING...
- Publication number 20240409798
- Publication date Dec 12, 2024
- WACKER CHEMIE AG
- Shunsuke YAMADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TUNABLE HEXAGONAL BORON CARBON NITRIDE HEAT SPREADER AND METHOD OF...
- Publication number 20240414883
- Publication date Dec 12, 2024
- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- ZHENGTANG LUO
- C01 - INORGANIC CHEMISTRY
Information Patent Application
THERMALLY CONDUCTIVE MOUNT
- Publication number 20240414894
- Publication date Dec 12, 2024
- SIEMENS AKTIENGESELLSCHAFT
- VOLKER MÜLLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION MEMBER
- Publication number 20240413051
- Publication date Dec 12, 2024
- Denka Company Limited
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINKS AND THERMAL ARCHITECTURE OF AN IMAGE CAPTURE DEVICE
- Publication number 20240414422
- Publication date Dec 12, 2024
- GoPro, Inc.
- Nicholas Vitale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LOOP HEAT PIPE, HOUSING ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240407134
- Publication date Dec 5, 2024
- Beijing Xiaomi Mobile Software Co., Ltd.
- Mingyan LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
- Publication number 20240407137
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho YOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUILDING LIQUID FLOW-THROUGH PLATES
- Publication number 20240399480
- Publication date Dec 5, 2024
- Raytheon Company
- Trae M. Blain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIRFLOW DISTRIBUTION TO COOL MEMORY MODULE SHADOWED BY THE PROCESSOR
- Publication number 20240407127
- Publication date Dec 5, 2024
- Intel Corporation
- Douglas HEYMANN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED GRAPHENE-BASED THERMALLY CONDUCTIVE FILM AND PAD AND METH...
- Publication number 20240407135
- Publication date Dec 5, 2024
- SHT SMART HIGH TECH AB
- Johan LIU
- B32 - LAYERED PRODUCTS
Information Patent Application
An Electronic Component Assembly, an Antenna Array System, and Elec...
- Publication number 20240407136
- Publication date Dec 5, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCREW FIXING STRUCTURE FOR HEAT DISSIPATION UNIT AND HEAT DISSIPATI...
- Publication number 20240401632
- Publication date Dec 5, 2024
- Asia Vital Components Co., Ltd.
- Wen-Ji Lan
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...
- Publication number 20240404916
- Publication date Dec 5, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION MATERIAL AND ELECTRONIC DEVICE
- Publication number 20240400789
- Publication date Dec 5, 2024
- Hitachi Astemo, Ltd.
- Yasuhiro TSUYUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXING ELEMENT AND HEAT DISSIPATION UNIT USING SAME
- Publication number 20240401633
- Publication date Dec 5, 2024
- Asia Vital Components Co., Ltd.
- Wen-Ji Lan
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
BUILDING LIQUID FLOW-THROUGH PLATES
- Publication number 20240391008
- Publication date Nov 28, 2024
- Raytheon Company
- Trae M. Blain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MAGNETIC PUMPING IN THERMAL MANAGEMENT DEVICES
- Publication number 20240397663
- Publication date Nov 28, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES WITH A LOOPED THERMAL MODULE HAVING A UNIDIRECTI...
- Publication number 20240397665
- Publication date Nov 28, 2024
- Apple Inc.
- Jifang TIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING DEVICE AND SERVER
- Publication number 20240397673
- Publication date Nov 28, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- YU-CHIA TING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by immersion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Active heat dissipating apparatus for a terminal, terminal, and act...

Thermal management device for circuit breakers

Evaporative cooling logic control method and apparatus of inductive...

Heat diffuser in wrist worn wireless power and data system

Method of subsidizing cost of providing information

Cold plates incorporating S-cells

Rack system for housing at least one immersion case

Systems and methods for electromagnetic shielding of thermal fin packs

Method and apparatus for an uneven thickness heat spreader

Powertrain system of an aircraft including cyrogenic cooling loop f...

Active heat sink

Pluggable module and cage for improving airflow in network switch s...

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Laser-welded cooling plate

Heatpipe to help reduce radio frequency interference

Three-way flow controller paths for single-phase and two-phase cool...

Heat dissipation device

Liquid immersion cooling apparatus

Two-phase immersion-type heat dissipation structure having porous s...

Immersion cooling system

Vapor chamber for cooling an electronic component, electronic arran...

Devices, systems, and methods for a hybrid cooling system

Thermal Interface Material (TIM) filling structure for high warpage...

Microchannel heat sink and method of manufacturing the same

Temperature management system for autonomous vehicles

Semiconductor storage device

Rack system for housing an electronic device

Immersion cooling system and cooling method thereof

Flexible vapor chamber with shape memory material

Heat dissipating apparatus for electronic elements

Patents Applicationslast 30 patents

INJECTABLE THERMALLY CONDUCTIVE CURABLE COMPOSITION

SOLID-STATE THERMAL ENERGY STORAGE AND DISSIPATION

Diagnostic Apparatus

IMMERSION COOLING SYSTEM WITH AIRTIGHT LINK LATCH COVER STRUCTURE

EMBEDDED THERMAL INTERFACE FOR CAGE MOUNTED ELECTRONIC DEVICES

COVER FOR HEAT GENERATING ELECTRONIC COMPONENT

FOLDED GRAPHITE FINS FOR HEATSINKS

ELECTRONIC DEVICE

HEAT-SINK FIXING STRUCTURE

COOLING SYSTEM FOR POWER ELECTRONICS

HEAT EXCHANGER

THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING...

TUNABLE HEXAGONAL BORON CARBON NITRIDE HEAT SPREADER AND METHOD OF...

THERMALLY CONDUCTIVE MOUNT

HEAT DISSIPATION MEMBER

HEATSINKS AND THERMAL ARCHITECTURE OF AN IMAGE CAPTURE DEVICE

LOOP HEAT PIPE, HOUSING ASSEMBLY AND ELECTRONIC DEVICE

HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME

BUILDING LIQUID FLOW-THROUGH PLATES

AIRFLOW DISTRIBUTION TO COOL MEMORY MODULE SHADOWED BY THE PROCESSOR

LAMINATED GRAPHENE-BASED THERMALLY CONDUCTIVE FILM AND PAD AND METH...

An Electronic Component Assembly, an Antenna Array System, and Elec...

SCREW FIXING STRUCTURE FOR HEAT DISSIPATION UNIT AND HEAT DISSIPATI...

PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...

HEAT DISSIPATION MATERIAL AND ELECTRONIC DEVICE

FIXING ELEMENT AND HEAT DISSIPATION UNIT USING SAME

BUILDING LIQUID FLOW-THROUGH PLATES

SYSTEMS AND METHODS FOR MAGNETIC PUMPING IN THERMAL MANAGEMENT DEVICES

ELECTRONIC DEVICES WITH A LOOPED THERMAL MODULE HAVING A UNIDIRECTI...

LIQUID COOLING DEVICE AND SERVER