Constructional details common to different types of electric apparatus

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

H05K7/00Constructional details common to different types of electric apparatus

H05K7/005arrangements of circuit components without supporting structure H05K7/02Arrangements of circuit components or wiring on supporting structure H05K7/023Stackable modules H05K7/026Multiple connections subassemblies H05K7/04on conductive chassis H05K7/06on insulating boards H05K7/08on perforated boards H05K7/10Plug-in assemblages of components H05K7/1007with means for increasing contact pressure at the end of engagement of coupling parts H05K7/1015having exterior leads H05K7/1023co-operating by abutting H05K7/103co-operating by sliding H05K7/1038with spring contact pieces H05K7/1046J-shaped leads H05K7/1053having interior leads H05K7/1061co-operating by abutting H05K7/1069with spring contact pieces H05K7/1076co-operating by sliding H05K7/1084pin grid array package carriers H05K7/1092with built-in components H05K7/12Resilient or clamping means for holding component to structure H05K7/14Mounting supporting structure in casing or on frame or rack H05K7/1401comprising clamping or extracting means H05K7/1402for securing or extracting printed circuit boards H05K7/1404by edge clamping H05K7/1405by clips or resilient members H05K7/1407by turn-bolt or screw member H05K7/1408by a unique member which latches several boards H05K7/1409by lever-type mechanisms H05K7/1411for securing or extracting box-type drawers H05K7/1412hold down mechanisms H05K7/1414with power interlock H05K7/1415manual gripping tools H05K7/1417having securing means for mounting boards, plates or wiring boards H05K7/1418Card guides H05K7/142Spacers not being card guides H05K7/1421Drawers for printed circuit boards H05K7/1422Printed circuit boards receptacles H05K7/1424Card cages H05K7/1425of standardised dimensions H05K7/1427Housings H05K7/1428for small modular apparatus with terminal block H05K7/1429for circuits carrying a CPU and adapted to receive expansion cards H05K7/1431Retention mechanisms for CPU modules H05K7/1432for power drive units H05K7/1434for electronics exposed to high gravitational force; Cylindrical housings H05K7/1435Expandable constructions H05K7/1438Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion H05K7/1439Back panel mother boards H05K7/1441with a segmented structure H05K7/1442with a radial structure H05K7/1444Complex or three-dimensional-arrangements; Stepped or dual mother boards H05K7/1445with double-sided connections H05K7/1447External wirings; Wiring ducts; Laying cables H05K7/1448with connections to the front board H05K7/1449with connections to the back board H05K7/1451with connections between circuit boards or units H05K7/1452Mounting of connectors; Switching; Reinforcing of back panels H05K7/1454Alignment mechanisms; Drawout cases H05K7/1455Coding for prevention of wrong insertion H05K7/1457Power distribution arrangements H05K7/1458Active back panels; Back panels with filtering means H05K7/1459Circuit configuration H05K7/1461Slidable card holders; Card stiffeners; Control or display means therefor H05K7/1462for programmable logic controllers [PLC] for automation and/or industrial process control H05K7/1464Functional units accommodated in the same PLC module housing H05K7/1465Modular PLC assemblies with separable functional units H05K7/1467PLC mounted in a cabinet or chassis H05K7/1468Mechanical features of input/output (I/O) modules H05K7/1469Terminal blocks for connecting sensors H05K7/1471Modules for controlling actuators H05K7/1472Bus coupling modules H05K7/1474Mounting of modules H05K7/1475Bus assemblies for establishing communication between PLC modules H05K7/1477including backplanes H05K7/1478including a segmented bus H05K7/1479including decentralized modules H05K7/1481User interface H05K7/1482PLC power supply; PLC accessories H05K7/1484Electrical diagrams relating to constructional features H05K7/1485Servers; Data center rooms H05K7/1487Blade assembly H05K7/1488Cabinets therefore H05K7/1489characterized by the mounting of blades therein H05K7/1491having cable management arrangements H05K7/1492having electrical distribution arrangements H05K7/1494having hardware for monitoring blades H05K7/1495providing data protection in case of earthquakes, floods, storms, nuclear explosions, intrusions, fire H05K7/1497Rooms for data centers; Shipping containers therefor H05K7/1498Resource management, Optimisation arrangements H05K7/16on hinges or pivots H05K7/18Construction of rack or frame H05K7/183support rails therefor H05K7/186for supporting telecommunication equipment H05K7/20Modifications to facilitate cooling, ventilating, or heating H05K7/20009using a gaseous coolant in electronic enclosures H05K7/20127Natural convection H05K7/20136Forced ventilation H05K7/20145Means for directing air flow H05K7/20154Heat dissipaters coupled to components H05K7/20163the components being isolated from air flow H05K7/20172Fan mounting or fan specifications H05K7/20181Filters; Louvers H05K7/2019Fan safe systems H05K7/202Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers H05K7/20209Thermal management H05K7/20218using a liquid coolant without phase change in electronic enclosures H05K7/20236by immersion H05K7/20245by natural convection; Thermosiphons H05K7/20254Cold plates transferring heat from heat source to coolant H05K7/20263Heat dissipaters releasing heat from coolant H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage H05K7/20281Thermal management H05K7/2029using a liquid coolant with phase change in electronic enclosures H05K7/203by immersion H05K7/20309Evaporators H05K7/20318Condensers H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage H05K7/20336Heat pipes H05K7/20345Sprayers; Atomizers H05K7/20354Refrigerating circuit comprising a compressor H05K7/20363Refrigerating circuit comprising a sorber H05K7/20372Cryogenic cooling; Nitrogen liquid cooling H05K7/20381Thermal management H05K7/2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body H05K7/20409Outer radiating structures on heat dissipating housings H05K7/20418the radiating structures being additional and fastened onto the housing H05K7/20427having radiation enhancing surface treatment H05K7/20436Inner thermal coupling elements in heat dissipating housings H05K7/20445the coupling element being an additional piece H05K7/20454with a conformable or flexible structure compensating for irregularities H05K7/20463Filling compound H05K7/20472Sheet interfaces H05K7/20481characterised by the material composition exhibiting specific thermal properties H05K7/2049Pressing means used to urge contact H05K7/205Thermal paths through the printed circuit board [PCB] H05K7/20509Cold plates H05K7/20518Unevenly distributed heat load H05K7/20536for racks or cabinets of standardized dimensions H05K7/20545Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards H05K7/20554Forced ventilation of a gaseous coolant H05K7/20563within sub-racks for removing heat from electronic boards H05K7/20572within cabinets for removing heat from sub-racks H05K7/20581Cabinets including a drawer for fans H05K7/2059within rooms for removing heat from cabinets H05K7/206Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger H05K7/20609Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger H05K7/20618Air circulating in different modes under control of air guidance flaps H05K7/20627Liquid coolant without phase change H05K7/20636within sub-racks for removing heat from electronic boards H05K7/20645within cabinets for removing heat from sub-racks H05K7/20654within rooms for removing heat from cabinets H05K7/20663Liquid coolant with phase change H05K7/20672within sub-racks for removing heat from electronic boards H05K7/20681within cabinets for removing heat from sub-racks H05K7/2069within rooms for removing heat from cabinets H05K7/207Thermal management H05K7/20709for server racks or cabinets; for data centers H05K7/20718Forced ventilation of a gaseous coolant H05K7/20727within server blades for removing heat from heat source H05K7/20736within cabinets for removing heat from server blades H05K7/20745within rooms for removing heat from cabinets H05K7/20754Air circulating in closed loop within cabinets H05K7/20763Liquid cooling without phase change H05K7/20772within server blades for removing heat from heat source H05K7/20781within cabinets for removing heat from server blades H05K7/2079within rooms for removing heat from cabinets H05K7/208Liquid cooling with phase change H05K7/20809within server blades for removing heat from heat source H05K7/20818within cabinets for removing heat from server blades H05K7/20827within rooms for removing heat from cabinets H05K7/20836Thermal management H05K7/20845for vehicle electronic casings H05K7/20854Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863Forced ventilation H05K7/20872Liquid coolant without phase change H05K7/20881Liquid coolant with phase change H05K7/2089for power electronics H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909Forced ventilation H05K7/20918the components being isolated from air flow H05K7/20927Liquid coolant without phase change H05K7/20936Liquid coolant with phase change H05K7/20945Thermal management H05K7/20954for display panels H05K7/20963Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20972Forced ventilation H05K7/20981Liquid coolant without phase change H05K7/2099Liquid coolant with phase change