by laser ablation

Industry

CPC
H05K3/0026

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0026by laser ablation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 12,176,384
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 12,177,965
- Issue date Dec 24, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and method for manufacturing the same
- Patent number 12,171,064
- Issue date Dec 17, 2024
- Raytheon Company
- Brandon W. Pillans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for via-hole processing, via-hole processing device, and via-ho...
- Patent number 12,156,347
- Issue date Nov 26, 2024
- LG Innotek Co., Ltd
- Jong Heum Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for shaping flexible circuits to improve routin...
- Patent number 12,156,342
- Issue date Nov 26, 2024
- Aptiv Technologies AG
- David G. Siegfried
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 12,156,345
- Issue date Nov 26, 2024
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,144,158
- Issue date Nov 12, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer composition for laser direct structuring
- Patent number 11,912,817
- Issue date Feb 27, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating rotary equipment for a rotary wing, provided...
- Patent number 11,858,643
- Issue date Jan 2, 2024
- Airbus Helicopters
- Gauthier Gibert
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 11,856,712
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and manufacturing method for printed wiring board
- Patent number 11,849,546
- Issue date Dec 19, 2023
- Kyocera Corporation
- Atsuo Kawagoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi head flexible printed circuit ultraviolet laser drilling devi...
- Patent number 11,839,032
- Issue date Dec 5, 2023
- WUHAN HERO OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xuelian Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for printing conformal materials on component edges at high...
- Patent number 11,785,722
- Issue date Oct 10, 2023
- IO Tech Group Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 11,776,989
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using mask layer
- Patent number 11,756,982
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing untethered, stretchable, and wearable electroni...
- Patent number 11,729,904
- Issue date Aug 15, 2023
- Carnegie Mellon University
- Eric J. Markvicka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of creating exposed cavities in molded electronic devices
- Patent number 11,723,151
- Issue date Aug 8, 2023
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,696,407
- Issue date Jul 4, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,643,362
- Issue date May 9, 2023
- Samsung Display Co., Ltd.
- Tae Kon Kim
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method for producing a waveguide, circuit device and radar system
- Patent number 11,646,479
- Issue date May 9, 2023
- Infineon Technologies AG
- Markus Josef Lang
- G01 - MEASURING TESTING
Information Patent Grant
Component-embedded substrate
- Patent number 11,638,351
- Issue date Apr 25, 2023
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wall for isolation enhancement
- Patent number 11,632,856
- Issue date Apr 18, 2023
- Raytheon Company
- Andrew Southworth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...
- Publication number 20240407107
- Publication date Dec 5, 2024
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis RATAUTAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A BATTERY SENSOR
- Publication number 20240274895
- Publication date Aug 15, 2024
- Xin HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AN...
- Publication number 20240222888
- Publication date Jul 4, 2024
- Huawei Technologies Co., Ltd
- Shuzhao Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polymer Composition For Laser Direct Structuring
- Publication number 20240166803
- Publication date May 23, 2024
- Ticona LLC
- Young Shin Kim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES
- Publication number 20240130093
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
- Publication number 20240121897
- Publication date Apr 11, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
- Publication number 20240121903
- Publication date Apr 11, 2024
- Kyocera Corporation
- Atsuo KAWAGOE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER FOLDED 3D ELECTRONICS
- Publication number 20240090126
- Publication date Mar 14, 2024
- U.S. Army DEVCOM, Army Research Laboratory
- Nathan S. Lazarus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SHAPING FLEXIBLE CIRCUITS TO IMPROVE ROUTIN...
- Publication number 20240064908
- Publication date Feb 22, 2024
- Aptiv Technologies Limited
- David G. Siegfried
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD
- Publication number 20240049396
- Publication date Feb 8, 2024
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- Cheng Ming LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20240040703
- Publication date Feb 1, 2024
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240014047
- Publication date Jan 11, 2024
- TOPPAN INC.
- Yuki UMEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PARALLEL TRANSFER OF MICRO-DEVICES USING TREATMENT
- Publication number 20230395645
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD
- Publication number 20230328898
- Publication date Oct 12, 2023
- Toyota Jidosha Kabushiki Kaisha
- Miwako SHIONOYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A WAVEGUIDE, CIRCUIT DEVICE AND RADAR SYSTEM
- Publication number 20230268630
- Publication date Aug 24, 2023
- INFINEON TECHNOLOGIES AG
- Markus Josef LANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI HEAD FLEXIBLE PRINTED CIRCUIT ULTRAVIOLET LASER DRILLING DEVI...
- Publication number 20230240019
- Publication date Jul 27, 2023
- WUHAN HERO OPTOELECTRONICS TECHNOLOGY CO., LTD.
- XUELIAN LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20230232532
- Publication date Jul 20, 2023
- FUJIKURA LTD.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD EDGE ELECTRICAL CONTACT STRUCTURES
- Publication number 20230232533
- Publication date Jul 20, 2023
- Nokia Solutions and Networks Oy
- David NORTH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS
- Publication number 20230209723
- Publication date Jun 29, 2023
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER TRENCH
- Publication number 20230132123
- Publication date Apr 27, 2023
- Paul Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods for Utilizing Laser Cutting and Chemical Etchin...
- Publication number 20230119513
- Publication date Apr 20, 2023
- NUCURRENT, INC.
- Oleg Los
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Component Carrier With Cavity By Trimming Poorly Adhe...
- Publication number 20230041145
- Publication date Feb 9, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeffrey JIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing a Component Carrier
- Publication number 20230044122
- Publication date Feb 9, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian SATTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Apparatus and Method for Utilizing Surface Mount Technology...
- Publication number 20220408565
- Publication date Dec 22, 2022
- Jabil Inc.
- Weiping (aka Jonathan) Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
- Publication number 20220338357
- Publication date Oct 20, 2022
- KYOCERA CORPORATION
- Atsuo KAWAGOE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20220330435
- Publication date Oct 13, 2022
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CO-AXIAL VIA STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220240375
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Ching-Sheng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD OF PRINTED CIRCUIT BOARD AND LASER PROCESSI...
- Publication number 20220216665
- Publication date Jul 7, 2022
- OFUNA ENTERPRISE Japan Co., Ltd.
- Kunio ARAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR UTILIZING LASER CUTTING AND CHEMICAL ETCHIN...
- Publication number 20220209576
- Publication date Jun 30, 2022
- NUCURRENT, INC.
- Oleg Los
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by laser ablation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of parallel transfer of micro-devices using treatment

Component carrier and method of manufacturing a component carrier

Interconnect and method for manufacturing the same

Jig for via-hole processing, via-hole processing device, and via-ho...

Systems and methods for shaping flexible circuits to improve routin...

Overmolded components having sub-flush residuals

Power electronics assemblies having embedded power electronics devices

Reciprocal PCB manufacturing process

Panel molded electronic assemblies with multi-surface conductive co...

Component-embedded substrate

Printed circuit board structure including a closed cavity

Method for manufacturing transparent circuit board

Polymer composition for laser direct structuring

Fine feature formation techniques for printed circuit boards

Method of fabricating rotary equipment for a rotary wing, provided...

Method of manufacturing multilayer substrate

Printed wiring board and manufacturing method for printed wiring board

Multi head flexible printed circuit ultraviolet laser drilling devi...

Systems for printing conformal materials on component edges at high...

Methods of parallel transfer of micro-devices using treatment

Methods of parallel transfer of micro-devices using mask layer

Method for manufacturing a circuit having a lamination layer using...

Method of producing untethered, stretchable, and wearable electroni...

Methods of creating exposed cavities in molded electronic devices

Core layer with fully encapsulated co-axial magnetic material aroun...

Electroless and electrolytic deposition process for forming traces...

Display device and manufacturing method thereof

Method for producing a waveguide, circuit device and radar system

Component-embedded substrate

Wall for isolation enhancement

Patents Applicationslast 30 patents

METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...

METHOD OF MAKING A BATTERY SENSOR

CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AN...

TRANSPARENT CIRCUIT BOARD

Polymer Composition For Laser Direct Structuring

POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES

VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD

LASER FOLDED 3D ELECTRONICS

SYSTEMS AND METHODS FOR SHAPING FLEXIBLE CIRCUITS TO IMPROVE ROUTIN...

METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

METHODS OF PARALLEL TRANSFER OF MICRO-DEVICES USING TREATMENT

BOARD

METHOD FOR PRODUCING A WAVEGUIDE, CIRCUIT DEVICE AND RADAR SYSTEM

MULTI HEAD FLEXIBLE PRINTED CIRCUIT ULTRAVIOLET LASER DRILLING DEVI...

COMPONENT-EMBEDDED SUBSTRATE

BOARD EDGE ELECTRICAL CONTACT STRUCTURES

OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS

SOLDER TRENCH

Systems and Methods for Utilizing Laser Cutting and Chemical Etchin...

Manufacturing Component Carrier With Cavity By Trimming Poorly Adhe...

Component Carrier and Method of Manufacturing a Component Carrier

System, Apparatus and Method for Utilizing Surface Mount Technology...

PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

CO-AXIAL VIA STRUCTURE AND MANUFACTURING METHOD OF THE SAME

LASER PROCESSING METHOD OF PRINTED CIRCUIT BOARD AND LASER PROCESSI...

SYSTEMS AND METHODS FOR UTILIZING LASER CUTTING AND CHEMICAL ETCHIN...