by making a catalytic pattern by photo-imaging

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CPC
H05K3/185

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/185by making a catalytic pattern by photo-imaging

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional molded circuit component
- Patent number 11,839,023
- Issue date Dec 5, 2023
- MAXELL, LTD.
- Atsushi Yusa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laser direct structuring of switches
- Patent number 11,612,061
- Issue date Mar 21, 2023
- Appareo IoT, LLC
- Wyatt Dick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 11,477,893
- Issue date Oct 18, 2022
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for selectively metallizing surface of ceramic substrate, ce...
- Patent number 11,382,216
- Issue date Jul 5, 2022
- BYD Company Limited
- Qing Gong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Three-dimensional molded circuit component
- Patent number 11,259,410
- Issue date Feb 22, 2022
- MAXELL, LTD.
- Atsushi Yusa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,191,165
- Issue date Nov 30, 2021
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated layer forming composition, film having plated-layer precurso...
- Patent number 11,161,331
- Issue date Nov 2, 2021
- FUJIFILM Corporation
- Takeshi Narita
- B32 - LAYERED PRODUCTS
Information Patent Grant
Micro power distribution boxes and methods of manufacturing same us...
- Patent number 11,083,088
- Issue date Aug 3, 2021
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming circuit on substrate
- Patent number 10,966,327
- Issue date Mar 30, 2021
- JCU CORPORATION
- Daisuke Sadohara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for forming traces on a catalytic laminate
- Patent number 10,849,233
- Issue date Nov 24, 2020
- CATLAM, LLC
- Kenneth S Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 10,827,624
- Issue date Nov 3, 2020
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallization structure and manufacturing method thereof
- Patent number 10,750,619
- Issue date Aug 18, 2020
- Industrial Technology Research Institute
- Ming-Huei Yen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for forming contacts on an integrated circuit...
- Patent number 10,685,931
- Issue date Jun 16, 2020
- CATLAM LLC
- Kenneth S. Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite circuit board
- Patent number 10,638,606
- Issue date Apr 28, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless plating method and ceramic substrate
- Patent number 10,602,617
- Issue date Mar 24, 2020
- Mitsubishi Electric Corporation
- Yohei Takemoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedded circuit patterning feature selective electroless
- Patent number 10,586,715
- Issue date Mar 10, 2020
- Intel Corporation
- Yonggang Yong Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 10,448,518
- Issue date Oct 15, 2019
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic molding compound and use thereof
- Patent number 10,440,832
- Issue date Oct 8, 2019
- EMS-Patent AG
- Georg Stoeppelmann
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Packaged devices with antennas
- Patent number 10,411,329
- Issue date Sep 10, 2019
- Apple Inc.
- Steven P. Cardinali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for forming conductive pattern, and resin st...
- Patent number 10,349,527
- Issue date Jul 9, 2019
- LG Chem, Ltd.
- Chee-Sung Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pixel definition layer and manufacturing method thereof, display su...
- Patent number 10,333,066
- Issue date Jun 25, 2019
- BOE Technology Group Co., Ltd.
- Wenjun Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate structure of metal coating
- Patent number 10,306,774
- Issue date May 28, 2019
- Electroplating Engineers of Japan Limited
- Masahiro Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective metallization of an integrated circuit (IC) substrate
- Patent number 10,290,557
- Issue date May 14, 2019
- Intel Corporation
- Brandon C. Marin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier of one or more light-emitting diodes (LEDS) for a signaling...
- Patent number 10,246,001
- Issue date Apr 2, 2019
- Valeo Vision
- Denis Lauvernier
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Composition for forming conductive pattern and resin structure havi...
- Patent number 10,183,866
- Issue date Jan 22, 2019
- LG Chem, Ltd.
- Han Nah Jeong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polymer product and method for selectively metallizing polymer subs...
- Patent number 10,161,044
- Issue date Dec 25, 2018
- BYD Company Limited
- Wei Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating performance using combination metal oxide and metal powder...
- Patent number 10,150,863
- Issue date Dec 11, 2018
- SABIC GLOBAL TECHNOLOGIES B.V.
- Tong Wu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Circuit Board Traces in Channels using Electroless and Electroplate...
- Publication number 20230096301
- Publication date Mar 30, 2023
- CATLAM, LLC
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Component Carrier Interconnection and Manufacturing Method
- Publication number 20220386464
- Publication date Dec 1, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengensellschaft
- Abderrazzaq IFIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL MOLDED CIRCUIT COMPONENT
- Publication number 20220132660
- Publication date Apr 28, 2022
- MAXELL, LTD.
- Atsushi YUSA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20220087029
- Publication date Mar 17, 2022
- Ethertronics, Inc.
- Seung Hyuk Choi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20210400818
- Publication date Dec 23, 2021
- HUIZHOU GLORYSKY ELECTRONICS CO.,LTD
- Xiaobin Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CATALYZED METAL FOIL AND USES THEREOF
- Publication number 20210259115
- Publication date Aug 19, 2021
- Averatek Corporation
- Shinichi IKETANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser direct structuring of switches
- Publication number 20210144860
- Publication date May 13, 2021
- Appareo IoT, LLC
- Wyatt Dick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process For Forming Traces on a Catalytic Laminate
- Publication number 20210051804
- Publication date Feb 18, 2021
- CATLAM, LLC
- Kenneth S. BAHL
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Catalytic Laminate with Conductive Traces formed during Lamination
- Publication number 20210022252
- Publication date Jan 21, 2021
- CATLAM LLC
- Kenneth S BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING METALLIZATION STRUCTURE
- Publication number 20200260591
- Publication date Aug 13, 2020
- Industrial Technology Research Institute
- Ming-Huei Yen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME US...
- Publication number 20200196451
- Publication date Jun 18, 2020
- Molex, LLC
- Victor ZADEREJ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20200045827
- Publication date Feb 6, 2020
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN, REMOVABLE, CATALYTIC FILM FOR LASER DIRECT STRUCTURING...
- Publication number 20200022264
- Publication date Jan 16, 2020
- SABIC Global Technologies B.V.
- Yunan CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Catalytic Laminate with Conductive Traces formed during Lamination
- Publication number 20190274221
- Publication date Sep 5, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMOPLASTIC COMPOSITION
- Publication number 20190269012
- Publication date Aug 29, 2019
- DSM IP Assets B. V.
- Frank Peter Theodorus Johannes VAN DER BURGT
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METALLIZATION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190200459
- Publication date Jun 27, 2019
- Industrial Technology Research Institute
- Ming-Huei Yen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LAMINATE STRUCTURE OF METAL COATING
- Publication number 20190090357
- Publication date Mar 21, 2019
- ELECTROPLATING ENGINEERS OF JAPAN LIMITED
- Masahiro ITO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE CIRCUIT BOARD
- Publication number 20190069406
- Publication date Feb 28, 2019
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL MOLDED CIRCUIT COMPONENT
- Publication number 20190069400
- Publication date Feb 28, 2019
- MAXELL HOLDINGS, LTD.
- Atsushi YUSA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING METAL WIRING-CONTAINING LAMINATE, METAL WIRING...
- Publication number 20190029111
- Publication date Jan 24, 2019
- FUJIFILM CORPORATION
- Chika MATSUOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, LAMINATE, AND ELEC...
- Publication number 20190010608
- Publication date Jan 10, 2019
- FUJIFILM CORPORATION
- Kohei HIGASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS PLATING METHOD AND CERAMIC SUBSTRATE
- Publication number 20180199442
- Publication date Jul 12, 2018
- Mitsubishi Electric Corporation
- Yohei TAKEMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE METALLIZATION OF AN INTEGRATED CIRCUIT (IC) SUBSTRATE
- Publication number 20180033707
- Publication date Feb 1, 2018
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIRECT STRUCTURED MATERIALS AND THEIR METHODS OF MAKING
- Publication number 20170367182
- Publication date Dec 21, 2017
- SABIC Global Technologies B.V.
- Tong WU
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD OF CURVED CIRCUIT BOARD AND ELECTRONIC PRODUCT
- Publication number 20170347444
- Publication date Nov 30, 2017
- MOORETEC CO.,LTD.
- YU-MIN LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL CIRCUIT STRUCTURE
- Publication number 20170029953
- Publication date Feb 2, 2017
- Industrial Technology Research Institute
- Tune-Hune KAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20170027057
- Publication date Jan 26, 2017
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC COMPOSITION
- Publication number 20170022358
- Publication date Jan 26, 2017
- MITSUBISHI CHEMICAL EUROPE GMBH
- Bernardus Antonius Gerardus Schrauwen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROVIDING A PRINTED CIRCUIT BOARD USING LASER ASSISTED ME...
- Publication number 20160302307
- Publication date Oct 13, 2016
- Islam A. Salama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASTIC MOLDING COMPOUND AND USE THEREOF
- Publication number 20160295705
- Publication date Oct 6, 2016
- EMS-Patent AG
- Georg STOEPPELMANN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by making a catalytic pattern by photo-imaging

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Catalyzed metal foil and uses thereof

Three-dimensional molded circuit component

Method for manufacturing a circuit having a lamination layer using...

Electroless and electrolytic deposition process for forming traces...

Laser direct structuring of switches

Catalytic laminate with conductive traces formed during lamination

Method for selectively metallizing surface of ceramic substrate, ce...

Three-dimensional molded circuit component

Method for manufacturing a circuit having a lamination layer using...

Plated layer forming composition, film having plated-layer precurso...

Micro power distribution boxes and methods of manufacturing same us...

Method for forming circuit on substrate

Process for forming traces on a catalytic laminate

Catalytic laminate with conductive traces formed during lamination

Metallization structure and manufacturing method thereof

Method and apparatus for forming contacts on an integrated circuit...

Composite circuit board

Electroless plating method and ceramic substrate

Embedded circuit patterning feature selective electroless

Method for manufacturing a circuit having a lamination layer using...

Plastic molding compound and use thereof

Packaged devices with antennas

Composition and method for forming conductive pattern, and resin st...

Pixel definition layer and manufacturing method thereof, display su...

Laminate structure of metal coating

Selective metallization of an integrated circuit (IC) substrate

Carrier of one or more light-emitting diodes (LEDS) for a signaling...

Composition for forming conductive pattern and resin structure havi...

Polymer product and method for selectively metallizing polymer subs...

Plating performance using combination metal oxide and metal powder...

Patents Applicationslast 30 patents

Circuit Board Traces in Channels using Electroless and Electroplate...

Component Carrier Interconnection and Manufacturing Method

THREE-DIMENSIONAL MOLDED CIRCUIT COMPONENT

Method for Manufacturing a Circuit Having a Lamination Layer Using...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CATALYZED METAL FOIL AND USES THEREOF

Laser direct structuring of switches

Process For Forming Traces on a Catalytic Laminate

Catalytic Laminate with Conductive Traces formed during Lamination

METHOD FOR FORMING METALLIZATION STRUCTURE

MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME US...

Method for Manufacturing a Circuit Having a Lamination Layer Using...

ULTRA-THIN, REMOVABLE, CATALYTIC FILM FOR LASER DIRECT STRUCTURING...

Catalytic Laminate with Conductive Traces formed during Lamination

THERMOPLASTIC COMPOSITION

METALLIZATION STRUCTURE AND MANUFACTURING METHOD THEREOF

LAMINATE STRUCTURE OF METAL COATING

COMPOSITE CIRCUIT BOARD

THREE-DIMENSIONAL MOLDED CIRCUIT COMPONENT

METHOD FOR PRODUCING METAL WIRING-CONTAINING LAMINATE, METAL WIRING...

METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, LAMINATE, AND ELEC...

ELECTROLESS PLATING METHOD AND CERAMIC SUBSTRATE

SELECTIVE METALLIZATION OF AN INTEGRATED CIRCUIT (IC) SUBSTRATE

LASER DIRECT STRUCTURED MATERIALS AND THEIR METHODS OF MAKING

MANUFACTURING METHOD OF CURVED CIRCUIT BOARD AND ELECTRONIC PRODUCT

METAL CIRCUIT STRUCTURE

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

THERMOPLASTIC COMPOSITION

METHOD OF PROVIDING A PRINTED CIRCUIT BOARD USING LASER ASSISTED ME...

PLASTIC MOLDING COMPOUND AND USE THEREOF