by means of a preformed insulating foil

Industry

CPC
H05K3/281

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/281by means of a preformed insulating foil

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board
- Patent number 11,991,826
- Issue date May 21, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Jongmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 11,987,031
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
High-density soft-matter electronics
- Patent number 11,903,139
- Issue date Feb 13, 2024
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Using encapsulated flexible substrate to link sensors and electroni...
- Patent number 11,700,695
- Issue date Jul 11, 2023
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Shemer Shmaryau Berkowitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flexible printed circuit board and flexible printe...
- Patent number 11,523,518
- Issue date Dec 6, 2022
- Sumitomo Electric Printed Circuits, Inc.
- Kou Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable electronic device
- Patent number 11,516,909
- Issue date Nov 29, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Marco Barink
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photosensitive dry film and uses of the same
- Patent number 11,353,791
- Issue date Jun 7, 2022
- Eternal Materials Co., Ltd.
- Tsung-Hsiu Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 11,330,709
- Issue date May 10, 2022
- AMOGREENTECH CO., LTD.
- Jeong Sang Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monitoring circuitry
- Patent number 11,240,913
- Issue date Feb 1, 2022
- HP INDIGO B.V.
- Gideon Amir
- G01 - MEASURING TESTING
Information Patent Grant
Interconnect circuit methods and devices
- Patent number 11,116,070
- Issue date Sep 7, 2021
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Colored thin covering film and manufacturing method
- Patent number 11,116,074
- Issue date Sep 7, 2021
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Wei-Chih Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for laying conductive pathways, method of laying conducti...
- Patent number 11,096,275
- Issue date Aug 17, 2021
- MAS INNOVATION (PRIVATE) LIMITED
- Kosalasiri Jayasundara
- A41 - WEARING APPAREL
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 11,034,128
- Issue date Jun 15, 2021
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
High-density soft-matter electronics
- Patent number 10,945,339
- Issue date Mar 9, 2021
- Carnegie Mellon University
- Carmel Majidi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure, wiring board, substrate for wiring board, copper clad la...
- Patent number 10,912,193
- Issue date Feb 2, 2021
- Kabushiki Kaisha Toshiba
- Hajime Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing the same
- Patent number 10,869,389
- Issue date Dec 15, 2020
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kohei Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide precursor composition and use thereof
- Patent number 10,731,004
- Issue date Aug 4, 2020
- Eternal Materials Co., Ltd.
- Chang-Hong Ho
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic component-containing module
- Patent number 10,707,403
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Yoshiharu Suemori
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Monitoring circuitry
- Patent number 10,701,803
- Issue date Jun 30, 2020
- HP INDIGO B.V.
- Gideon Amir
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 10,668,687
- Issue date Jun 2, 2020
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,674,610
- Issue date Jun 2, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Release material
- Patent number 10,653,001
- Issue date May 12, 2020
- Kuraray Co., Ltd.
- Kazuyuki Ohmori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Modular deformable platform
- Patent number 10,631,401
- Issue date Apr 21, 2020
- Robert Bosch GmbH
- Seow Yuen Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,602,616
- Issue date Mar 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board
- Patent number 10,477,700
- Issue date Nov 12, 2019
- Atotech Deutschland GmbH
- Wonjin Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bio-sensor circuit
- Patent number 10,442,122
- Issue date Oct 15, 2019
- JOHNSON ELECTRIC INTERNATIONAL AG
- Steven Eric Dean
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBL...
- Publication number 20230309222
- Publication date Sep 28, 2023
- Doosan Corporation
- Euidock RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR PRODUCING WIRING...
- Publication number 20230247770
- Publication date Aug 3, 2023
- Nitto Denko Corporation
- Naoki SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD T...
- Publication number 20230135423
- Publication date May 4, 2023
- DOOSAN CORPORATION
- Kwangseok PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20220386453
- Publication date Dec 1, 2022
- Nitto Denko Corporation
- Akihito MATSUTOMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CATHETER AND METHOD FOR CATHETER ASSEMBLY
- Publication number 20220369472
- Publication date Nov 17, 2022
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Shemer Shmaryau Berkowitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20220174819
- Publication date Jun 2, 2022
- DONGWOO FINE-CHEM CO., LTD.
- Jongmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE DRY FILM, AND PRINTED WIRING BOARD WITH PHOTOSENSITI...
- Publication number 20220066322
- Publication date Mar 3, 2022
- TAMURA CORPORATION
- Ryoya TAKASHIMA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
APPARATUS FOR LAYING CONDUCTIVE PATHWAYS, METHOD OF LAYING CONDUCTI...
- Publication number 20220039253
- Publication date Feb 3, 2022
- MAS Innovation (Private) Limited
- Kosalasiri Jayasundara
- B32 - LAYERED PRODUCTS
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20210352798
- Publication date Nov 11, 2021
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MICROSWITCH BASED POSITION SENSOR WITH HARNESS RELIEF FOR MOTORIZED...
- Publication number 20210315106
- Publication date Oct 7, 2021
- HAMILTON SUNDSTRAND CORPORATION
- Agata Kurowska
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20210276301
- Publication date Sep 9, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PREPARING ELECTROMAGNETIC SHIELDING FILM
- Publication number 20210219434
- Publication date Jul 15, 2021
- SHENZHEN KNQ TECHNOLOGY CO., LTD.
- Longfeng SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-Density Soft-Matter Electronics
- Publication number 20210204410
- Publication date Jul 1, 2021
- Carnegie Mellon University
- Carmel Majidi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
STRETCHABLE ELECTRONIC DEVICE
- Publication number 20210136913
- Publication date May 6, 2021
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Marco BARINK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTE...
- Publication number 20210022254
- Publication date Jan 21, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kou NOGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20200290308
- Publication date Sep 17, 2020
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE, WIRING BOARD, SUBSTRATE FOR WIRING BOARD, COPPER CLAD LA...
- Publication number 20200214126
- Publication date Jul 2, 2020
- KABUSHIKI KAISHA TOSHIBA
- Hajime NAKASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHTING CORD FOR DECORATIONS
- Publication number 20190383481
- Publication date Dec 19, 2019
- Aiboling (Xiamen) technology co, ltd
- Tieying SONG
- A44 - HABERDASHERY JEWELLERY
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20190297732
- Publication date Sep 26, 2019
- Atotech Deutschland GmbH
- Wonjin CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELEASE MATERIAL
- Publication number 20190174622
- Publication date Jun 6, 2019
- Kuraray Co., Ltd
- Kazuyuki Ohmori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Wireless Power Transmission Module
- Publication number 20180198310
- Publication date Jul 12, 2018
- AMOSENSE CO., LTD.
- Seung Jae Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modular Deformable Platform
- Publication number 20170367172
- Publication date Dec 21, 2017
- ROBERT BOSCH GmbH
- Seow Yuen Yee
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...
- Publication number 20170339785
- Publication date Nov 23, 2017
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FLEXIBLE, LIGHTWEIGHT PHOTOVOLTAIC ARRAY
- Publication number 20170054046
- Publication date Feb 23, 2017
- Orbital ATK, Inc.
- Robert Minelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILLUMINATING FILM STRUCTURE
- Publication number 20160315236
- Publication date Oct 27, 2016
- FLEXBRIGHT OY
- Pekka Makkonen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20160255715
- Publication date Sep 1, 2016
- Kuraray Co., Ltd
- Kazuyuki OHMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD, APPARATU...
- Publication number 20150366069
- Publication date Dec 17, 2015
- Kabushiki Kaisha Toshiba
- Akihiko Happoya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by means of a preformed insulating foil

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing shielded printed wiring board and shielded...

Methods of forming flexible interconnect circuits

Flexible printed circuit board

Protection tape for printed circuit board and display device includ...

Methods of forming interconnect circuits

High-density soft-matter electronics

Using encapsulated flexible substrate to link sensors and electroni...

Method of making flexible printed circuit board and flexible printe...

Stretchable electronic device

Fluororesin base material, printed wiring board, and circuit module

Photosensitive dry film and uses of the same

Flexible printed circuit board

Monitoring circuitry

Interconnect circuit methods and devices

Colored thin covering film and manufacturing method

Apparatus for laying conductive pathways, method of laying conducti...

Protection tape for printed circuit board and display device includ...

High-density soft-matter electronics

Structure, wiring board, substrate for wiring board, copper clad la...

Printed circuit board and method for producing the same

Polyimide precursor composition and use thereof

Electronic component-containing module

Monitoring circuitry

Protection tape for printed circuit board and display device includ...

Multilayer rigid flexible printed circuit board and method for manu...

Release material

Modular deformable platform

Multilayer rigid flexible printed circuit board and method for manu...

Method for manufacturing a printed circuit board

Bio-sensor circuit

Patents Applicationslast 30 patents

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

Interconnect Circuit Methods And Devices

INTERCONNECT CIRCUIT METHODS AND DEVICES

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBL...

WIRING CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR PRODUCING WIRING...

ADHESIVE COMPOSITION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD T...

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

CATHETER AND METHOD FOR CATHETER ASSEMBLY

FLEXIBLE PRINTED CIRCUIT BOARD

PHOTOSENSITIVE DRY FILM, AND PRINTED WIRING BOARD WITH PHOTOSENSITI...

APPARATUS FOR LAYING CONDUCTIVE PATHWAYS, METHOD OF LAYING CONDUCTI...

INTERCONNECT CIRCUIT METHODS AND DEVICES

MICROSWITCH BASED POSITION SENSOR WITH HARNESS RELIEF FOR MOTORIZED...

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

METHOD FOR PREPARING ELECTROMAGNETIC SHIELDING FILM

High-Density Soft-Matter Electronics

STRETCHABLE ELECTRONIC DEVICE

METHOD OF MAKING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTE...

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

STRUCTURE, WIRING BOARD, SUBSTRATE FOR WIRING BOARD, COPPER CLAD LA...

LIGHTING CORD FOR DECORATIONS

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD

RELEASE MATERIAL

Wireless Power Transmission Module

Modular Deformable Platform

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYM...

METHOD OF MANUFACTURING FLEXIBLE, LIGHTWEIGHT PHOTOVOLTAIC ARRAY

ILLUMINATING FILM STRUCTURE

CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME

APPARATUS FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD, APPARATU...