by measuring Auger electrons

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CPC
G01N23/2276

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GPHYSICS G01Measuring instruments G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES G01N23/00Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00

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G01N23/2276by measuring Auger electrons

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of inspecting samples with multiple beams of charged particles
- Patent number 11,815,473
- Issue date Nov 14, 2023
- ASML Netherlands B.V.
- Kuo-Feng Tseng
- G01 - MEASURING TESTING
Information Patent Grant
Sample analysis apparatus and method
- Patent number 11,674,913
- Issue date Jun 13, 2023
- Jeol Ltd.
- Takaomi Yokoyama
- G01 - MEASURING TESTING
Information Patent Grant
Auger electron microscope and analysis method
- Patent number 11,391,682
- Issue date Jul 19, 2022
- Jeol Ltd.
- Kenichi Tsutsumi
- G01 - MEASURING TESTING
Information Patent Grant
Method of generating elemental map and surface analyzer
- Patent number 11,062,434
- Issue date Jul 13, 2021
- Jeol Ltd.
- Tatsuya Uchida
- G01 - MEASURING TESTING
Information Patent Grant
Analysis method for obtaining XPS and AES and elements in each chem...
- Patent number 9,945,797
- Issue date Apr 17, 2018
- Jeol Ltd.
- Masahide Shima
- G01 - MEASURING TESTING
Information Patent Grant
Information processing device and information processing method
- Patent number 9,714,850
- Issue date Jul 25, 2017
- Jeol Ltd.
- Kazushiro Yokouchi
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for determining depth profiling
- Patent number 8,507,853
- Issue date Aug 13, 2013
- Yeda Research and Development Company Ltd.
- Hagai Cohen
- G01 - MEASURING TESTING
Information Patent Grant
Method for treatment of samples for auger electronic spectrometer (...
- Patent number 7,927,893
- Issue date Apr 19, 2011
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Hau Zhang
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for providing a compensated auger spectrum
- Patent number 7,912,657
- Issue date Mar 22, 2011
- Applied Materials Israel, Ltd.
- Dror Shemesh
- G01 - MEASURING TESTING
Information Patent Grant
Contamination pinning for auger analysis
- Patent number 7,855,362
- Issue date Dec 21, 2010
- KLA-Tencor Technologies Corporation
- Alan Brodie
- G01 - MEASURING TESTING
Information Patent Grant
Auger electron spectrometer with applied magnetic field at target s...
- Patent number 7,755,042
- Issue date Jul 13, 2010
- KLA-Tencor Corporation
- Gabor D. Toth
- G01 - MEASURING TESTING
Information Patent Grant
Method and instrument for chemical defect characterization in high...
- Patent number 7,635,842
- Issue date Dec 22, 2009
- KLA-Tencor Corporation
- Mehran Nasser-Ghodsi
- G01 - MEASURING TESTING
Information Patent Grant
Method of nano thin film thickness measurement by auger electron sp...
- Patent number 7,582,868
- Issue date Sep 1, 2009
- SAE Magnetics (H.K.) Ltd.
- Zhi Cheng Jiang
- G01 - MEASURING TESTING
Information Patent Grant
High-resolution auger electron spectrometer
- Patent number 7,560,691
- Issue date Jul 14, 2009
- KLA-Tencor Technologies Corporation
- Alexander J. Gubbens
- G01 - MEASURING TESTING
Information Patent Grant
Method for treatment of samples for auger electronic spectrometer (...
- Patent number 7,504,269
- Issue date Mar 17, 2009
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Hau Zhang
- G01 - MEASURING TESTING
Information Patent Grant
Film thickness and composition measurement via auger electron spect...
- Patent number 7,495,217
- Issue date Feb 24, 2009
- KLA-Tencor Corporation
- Ying Gao
- G01 - MEASURING TESTING
Information Patent Grant
Film thickness and composition measurement via auger electron spect...
- Patent number 7,220,964
- Issue date May 22, 2007
- KLA-Tencor Technologies Corporation
- Ying Gao
- G01 - MEASURING TESTING
Information Patent Grant
Element analyzing method with a scanning type probe microscope and...
- Patent number 5,898,176
- Issue date Apr 27, 1999
- Japan Science and Technology Corp.
- Yuzo Mori
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Analytical method of auger electron spectroscopy for insulating sample
- Patent number 5,889,282
- Issue date Mar 30, 1999
- Samsung Electronics Co., Ltd.
- Hee Seok Yang
- G01 - MEASURING TESTING
Information Patent Grant
Quality monitor and monitoring technique employing optically stimul...
- Patent number 5,393,980
- Issue date Feb 28, 1995
- The United States of America as represented by the administrator of the Natio...
- William T. Yost
- G01 - MEASURING TESTING
Information Patent Grant
Method of measuring resist pattern
- Patent number 4,670,650
- Issue date Jun 2, 1987
- Hitachi, Ltd.
- Toshiharu Matsuzawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Apparatus and method for reducing topographical effects in an auger...
- Patent number 4,638,446
- Issue date Jan 20, 1987
- The Perkin-Elmer Corporation
- Paul W. Palmberg
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Auger Electron Microscope and Analysis Method
- Publication number 20210255124
- Publication date Aug 19, 2021
- JEOL Ltd.
- Kenichi Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF INSPECTING SAMPLES WITH MULTIPLE BEAMS OF CHARGED PARTICLES
- Publication number 20200271598
- Publication date Aug 27, 2020
- ASML NETHERLANDS B.V.
- Kuo-Feng TSENG
- G01 - MEASURING TESTING
Information Patent Application
Method of Generating Elemental Map and Surface Analyzer
- Publication number 20200111197
- Publication date Apr 9, 2020
- JEOL Ltd.
- Tatsuya Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Information Processing Device and Information Processing Method
- Publication number 20160097659
- Publication date Apr 7, 2016
- JEOL Ltd.
- Kazushiro Yokouchi
- G01 - MEASURING TESTING
Information Patent Application
Surface Analysis Instrument
- Publication number 20150168321
- Publication date Jun 18, 2015
- JEOL Ltd.
- Akihiro Tanaka
- G01 - MEASURING TESTING
Information Patent Application
AUGER ELEMENTAL IDENTIFICATION ALGORITHM
- Publication number 20130341504
- Publication date Dec 26, 2013
- KLA -TENCOR CORPORATION,
- Mark Neill
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR DETERMINING DEPTH PROFILING
- Publication number 20110210246
- Publication date Sep 1, 2011
- Yeda Research and Development Company Ltd.
- Hagai COHEN
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR TREATMENT OF SAMPLES FOR AUGER ELECTRONIC SPECTROMETE...
- Publication number 20110168554
- Publication date Jul 14, 2011
- Semiconductor Manufacturing International (Shanghai) Corporation
- QI HAU ZHANG
- G01 - MEASURING TESTING
Information Patent Application
Method for Treatment of Samples for Auger Electronic Spectrometer (...
- Publication number 20090305440
- Publication date Dec 10, 2009
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Hau Zhang
- G01 - MEASURING TESTING
Information Patent Application
Method and System for Providing a Compensated Auger Spectrum
- Publication number 20080234962
- Publication date Sep 25, 2008
- Dror Shemesh
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND INSTRUMENT FOR CHEMICAL DEFECT CHARACTERIZATION IN HIGH...
- Publication number 20080197277
- Publication date Aug 21, 2008
- KLA-Tencor Corporation
- Mehran Nasser-Ghodsi
- G01 - MEASURING TESTING
Information Patent Application
Method for treatment of samples for auger electronic spectrometer (...
- Publication number 20070148790
- Publication date Jun 28, 2007
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Hau Zhang
- G01 - MEASURING TESTING
Information Patent Application
Method of nano thin film thickness measurement by auger electron sp...
- Publication number 20060138326
- Publication date Jun 29, 2006
- Zhi Cheng Jiang
- G01 - MEASURING TESTING

by measuring Auger electrons

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Methods of inspecting samples with multiple beams of charged particles

Sample analysis apparatus and method

Auger electron microscope and analysis method

Method of generating elemental map and surface analyzer

Analysis method for obtaining XPS and AES and elements in each chem...

Information processing device and information processing method

Method and system for determining depth profiling

Method for treatment of samples for auger electronic spectrometer (...

Method and system for providing a compensated auger spectrum

Contamination pinning for auger analysis

Auger electron spectrometer with applied magnetic field at target s...

Method and instrument for chemical defect characterization in high...

Method of nano thin film thickness measurement by auger electron sp...

High-resolution auger electron spectrometer

Method for treatment of samples for auger electronic spectrometer (...

Film thickness and composition measurement via auger electron spect...

Film thickness and composition measurement via auger electron spect...

Element analyzing method with a scanning type probe microscope and...

Analytical method of auger electron spectroscopy for insulating sample

Quality monitor and monitoring technique employing optically stimul...

Method of measuring resist pattern

Apparatus and method for reducing topographical effects in an auger...

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

Auger Electron Microscope and Analysis Method

METHODS OF INSPECTING SAMPLES WITH MULTIPLE BEAMS OF CHARGED PARTICLES

Method of Generating Elemental Map and Surface Analyzer

Information Processing Device and Information Processing Method

Surface Analysis Instrument

AUGER ELEMENTAL IDENTIFICATION ALGORITHM

METHOD AND SYSTEM FOR DETERMINING DEPTH PROFILING

APPARATUS FOR TREATMENT OF SAMPLES FOR AUGER ELECTRONIC SPECTROMETE...

Method for Treatment of Samples for Auger Electronic Spectrometer (...

Method and System for Providing a Compensated Auger Spectrum

METHOD AND INSTRUMENT FOR CHEMICAL DEFECT CHARACTERIZATION IN HIGH...

Method for treatment of samples for auger electronic spectrometer (...

Method of nano thin film thickness measurement by auger electron sp...