by microetching

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H05K3/383

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/383by microetching

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonded substrate and manufacturing method of bonded substrate
- Patent number 11,917,752
- Issue date Feb 27, 2024
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,882,656
- Issue date Jan 23, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing the printed board
- Patent number 11,229,123
- Issue date Jan 18, 2022
- Nichia Corporation
- Masaaki Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microetching agent for copper, copper surface roughening method and...
- Patent number 11,208,726
- Issue date Dec 28, 2021
- MEC Company Ltd.
- Yuki Ogino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microetchant for copper and method for producing wiring board
- Patent number 11,053,594
- Issue date Jul 6, 2021
- MEC Company Ltd.
- Keisuke Matsumoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching solution for copper and copper alloy surfaces
- Patent number 10,619,251
- Issue date Apr 14, 2020
- Atotech Deutschland GmbH
- Fabian Michalik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 10,366,949
- Issue date Jul 30, 2019
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solution and process for the pre-treatment of copper surfaces using...
- Patent number 10,219,391
- Issue date Feb 26, 2019
- Atotech Deutschland GmbH
- Christian Sparing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,051,746
- Issue date Aug 14, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated circuit substrate
- Patent number 9,980,383
- Issue date May 22, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microetching solution for copper, replenishment solution therefor a...
- Patent number 9,932,678
- Issue date Apr 3, 2018
- MEC Company Ltd.
- Masayo Kurii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,875,957
- Issue date Jan 23, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-module substrate and manufacturing method thereof
- Patent number 9,862,045
- Issue date Jan 9, 2018
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with carrier
- Patent number 9,788,423
- Issue date Oct 10, 2017
- JX Nippon Mining & Metals Corporation
- Tomota Nagaura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of manufacturing wiring substrate, and wiring substrate
- Patent number 9,699,916
- Issue date Jul 4, 2017
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with carrier, method of producing same, copper foil wit...
- Patent number 9,578,741
- Issue date Feb 21, 2017
- JX Nippon Mining & Metals Corporation
- Tomota Nagaura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Metal base substrate, power module, and method for manufacturing me...
- Patent number 9,578,754
- Issue date Feb 21, 2017
- Mitsubishi Electric Corporation
- Mariko Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked wiring
- Patent number 9,566,790
- Issue date Feb 14, 2017
- Seiko Epson Corporation
- Yoshihiko Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,526,169
- Issue date Dec 20, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Gi Ha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacture method thereof
- Patent number 9,510,446
- Issue date Nov 29, 2016
- Tyco Electronics AMP Korea Ltd.
- Yang Yun Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solution and process for the pre-treatment of copper surfaces using...
- Patent number 9,504,161
- Issue date Nov 22, 2016
- Atotech Deutschland GmbH
- Christian Sparing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microetching solution for copper, replenishment solution therefor a...
- Patent number 9,441,303
- Issue date Sep 13, 2016
- MEC Company Ltd.
- Masayo Kurii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion promotion in printed circuit boards
- Patent number 9,338,896
- Issue date May 10, 2016
- Enthone, Inc.
- Abayomi I. Owei
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of treating wiring substrate and wiring substrate manufactur...
- Patent number 9,301,399
- Issue date Mar 29, 2016
- Mitsubishi Gas Chemical Company, Inc.
- Tomoko Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for connecting a precious metal surface to a polymer
- Patent number 9,254,993
- Issue date Feb 9, 2016
- Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hermann Oppermann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,247,644
- Issue date Jan 26, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,161,460
- Issue date Oct 13, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Gi Ha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion promotion in printed circuit boards
- Patent number 9,040,117
- Issue date May 26, 2015
- Enthone Inc.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a wiring board having pads highly resistant...
- Patent number 9,024,207
- Issue date May 5, 2015
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier With Embedded Component on Stepped Metal Structur...
- Publication number 20230098587
- Publication date Mar 30, 2023
- AT&S (Chongqing) Company Limited
- Steve HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220338347
- Publication date Oct 20, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED SUBSTRATE AND MANUFACTURING METHOD OF BONDED SUBSTRATE
- Publication number 20220030708
- Publication date Jan 27, 2022
- NGK Insulators, Ltd.
- Takashi EBIGASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROETCHING AGENT FOR COPPER, COPPER SURFACE ROUGHENING METHOD AND...
- Publication number 20200263308
- Publication date Aug 20, 2020
- MEC COMPANY LTD.
- Yuki OGINO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD
- Publication number 20200141010
- Publication date May 7, 2020
- MEC COMPANY LTD.
- Keisuke MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING SOLUTION FOR COPPER AND COPPER ALLOY SURFACES
- Publication number 20190003061
- Publication date Jan 3, 2019
- Atotech Deutschland GmbH
- Fabian MICHALIK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD
- Publication number 20190003062
- Publication date Jan 3, 2019
- MEC COMPANY LTD.
- Keisuke MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180332720
- Publication date Nov 15, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Circuit Boards
- Publication number 20180279481
- Publication date Sep 27, 2018
- Isola USA Corp.
- Michael Gay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20180166372
- Publication date Jun 14, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS
- Publication number 20170275767
- Publication date Sep 28, 2017
- Atotech Deutschland GmbH
- Markku LAGER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOLUTION AND PROCESS FOR THE PRE-TREATMENT OF COPPER SURFACES USING...
- Publication number 20170086305
- Publication date Mar 23, 2017
- Atotech Deutschland GmbH
- Christian Sparing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROETCHING SOLUTION FOR COPPER, REPLENISHMENT SOLUTION THEREFOR A...
- Publication number 20140326696
- Publication date Nov 6, 2014
- Masayo Kurii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF TREATING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTUR...
- Publication number 20140311778
- Publication date Oct 23, 2014
- Mitsubishi Gas Chemical Company, Inc.
- Tomoko SUZUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140166347
- Publication date Jun 19, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yoon Su Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLUTION AND PROCESS FOR THE PRE-TREATMENT OF COPPER SURFACES USING...
- Publication number 20140076461
- Publication date Mar 20, 2014
- ATOTECH DEUTSCHLAND GMBH
- Christian Sparing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANCHOR GROUP FOR MONOLAYERS OF ORGANIC COMPOUNDS ON METAL AND COMPO...
- Publication number 20140060900
- Publication date Mar 6, 2014
- Siemens Aktiengesellschaft
- Guenter SCHMID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
- Publication number 20140030425
- Publication date Jan 30, 2014
- Enthone Inc.
- Abayomi I. OWEI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Adhesion Promoting Composition for Metal Leadframes
- Publication number 20130312635
- Publication date Nov 28, 2013
- MacDermind Acumen, Inc.
- Nilesh Kapadia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALUMINUM ALLOY COMPOSITE AND METHOD FOR JOINING THEREOF
- Publication number 20130256261
- Publication date Oct 3, 2013
- TAISEI PLAS CO., LTD
- Masanori Naritomi
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130185936
- Publication date Jul 25, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING SOLUTION AND METHOD OF MANUFACTURING PRINTED WIRING SUBSTRA...
- Publication number 20130175238
- Publication date Jul 11, 2013
- Samyoung Pure Chemicals Co., Ltd.
- Dae Jo HONG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130153271
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-TREATED ROUGHENED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20130084463
- Publication date Apr 4, 2013
- FURUKAWA ELECTRIC CO., LTD.
- Satoshi Fujisawa
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
- Publication number 20130078367
- Publication date Mar 28, 2013
- Enthone Inc.
- Abayomi I. Owei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS
- Publication number 20130056438
- Publication date Mar 7, 2013
- Atotech Deutschland GmbH
- Dirk Tews
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adhesion Promoting Composition for Metal Leadframes
- Publication number 20120193773
- Publication date Aug 2, 2012
- Nilesh Kapadia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR THE PRODUCTION OF A METAL-CERAMIC SUBSTRATE, PREFERABLY...
- Publication number 20120193324
- Publication date Aug 2, 2012
- Jürgen SCHULZ-HARDER
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120168212
- Publication date Jul 5, 2012
- KOREA E&S CO., LTD.
- Hyung Gi HA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESION PROMOTION OF METAL TO LAMINATE WITH MULTI-FUNCTIONAL MOLEC...
- Publication number 20120168075
- Publication date Jul 5, 2012
- Enthone Inc.
- Joseph A. Abys
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

by microetching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded substrate and manufacturing method of bonded substrate

Wiring substrate and method for manufacturing wiring substrate

Method of manufacturing the printed board

Microetching agent for copper, copper surface roughening method and...

Microetchant for copper and method for producing wiring board

High-speed interconnects for printed circuit boards

Etching solution for copper and copper alloy surfaces

Wiring substrate and semiconductor device

Solution and process for the pre-treatment of copper surfaces using...

High-speed interconnects for printed circuit boards

Laminated circuit substrate

Microetching solution for copper, replenishment solution therefor a...

Wiring substrate and semiconductor device

Power-module substrate and manufacturing method thereof

Copper foil with carrier

Method of manufacturing wiring substrate, and wiring substrate

Copper foil with carrier, method of producing same, copper foil wit...

Metal base substrate, power module, and method for manufacturing me...

Method of forming stacked wiring

Printed circuit board and method for manufacturing the same

Printed circuit board and manufacture method thereof

Solution and process for the pre-treatment of copper surfaces using...

Microetching solution for copper, replenishment solution therefor a...

Adhesion promotion in printed circuit boards

Method of treating wiring substrate and wiring substrate manufactur...

Method for connecting a precious metal surface to a polymer

Wiring board and method for manufacturing the same

Printed circuit board and method for manufacturing the same

Adhesion promotion in printed circuit boards

Method of manufacturing a wiring board having pads highly resistant...

Patents Applicationslast 30 patents

Component Carrier With Embedded Component on Stepped Metal Structur...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

BONDED SUBSTRATE AND MANUFACTURING METHOD OF BONDED SUBSTRATE

MICROETCHING AGENT FOR COPPER, COPPER SURFACE ROUGHENING METHOD AND...

MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD

ETCHING SOLUTION FOR COPPER AND COPPER ALLOY SURFACES

MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

Method of Manufacturing Circuit Boards

Wiring Substrate and Semiconductor Device

COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS

SOLUTION AND PROCESS FOR THE PRE-TREATMENT OF COPPER SURFACES USING...

MICROETCHING SOLUTION FOR COPPER, REPLENISHMENT SOLUTION THEREFOR A...

METHOD OF TREATING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTUR...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SOLUTION AND PROCESS FOR THE PRE-TREATMENT OF COPPER SURFACES USING...

ANCHOR GROUP FOR MONOLAYERS OF ORGANIC COMPOUNDS ON METAL AND COMPO...

ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

Adhesion Promoting Composition for Metal Leadframes

ALUMINUM ALLOY COMPOSITE AND METHOD FOR JOINING THEREOF

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

ETCHING SOLUTION AND METHOD OF MANUFACTURING PRINTED WIRING SUBSTRA...

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

SURFACE-TREATED ROUGHENED COPPER FOIL AND COPPER CLAD LAMINATE

ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS

Adhesion Promoting Composition for Metal Leadframes

METHOD FOR THE PRODUCTION OF A METAL-CERAMIC SUBSTRATE, PREFERABLY...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

ADHESION PROMOTION OF METAL TO LAMINATE WITH MULTI-FUNCTIONAL MOLEC...