by physical means only

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H01L21/32131

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32131by physical means only

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,068,259
- Issue date Aug 20, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei Da Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perimeter trench formation and delineation etch delayering
- Patent number 12,040,196
- Issue date Jul 16, 2024
- FEI Company
- James Clarke
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus and method of manufacturing a semiconductor device
- Patent number 11,935,728
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 11,929,285
- Issue date Mar 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treatment method and substrate treatment system
- Patent number 11,876,022
- Issue date Jan 16, 2024
- Tokyo Electron Limited
- Masashi Enomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a slot in EMI shielding...
- Patent number 11,756,897
- Issue date Sep 12, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma die singulation systems and related methods
- Patent number 11,651,998
- Issue date May 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing re-sputtered material from patterned sidewalls
- Patent number 11,615,960
- Issue date Mar 28, 2023
- Cornell University
- David G. Lishan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,605,598
- Issue date Mar 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei Da Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal removal die singulation systems and related methods
- Patent number 11,605,561
- Issue date Mar 14, 2023
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 11,581,223
- Issue date Feb 14, 2023
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor and method of manufacturing the same
- Patent number 11,508,929
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Dongjin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having symmetric conductive interconnection pa...
- Patent number 11,456,252
- Issue date Sep 27, 2022
- SK hynix Inc.
- Tae-Jung Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a lock structure in a semiconductor chip pad
- Patent number 11,430,669
- Issue date Aug 30, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation systems and related methods
- Patent number 11,289,380
- Issue date Mar 29, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perimeter trench formation and delineation etch delayering
- Patent number 11,257,683
- Issue date Feb 22, 2022
- FEI Company
- James Clarke
- G11 - INFORMATION STORAGE
Information Patent Grant
Backside metal removal die singulation systems and related methods
- Patent number 11,127,634
- Issue date Sep 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming angled structures
- Patent number 11,119,405
- Issue date Sep 14, 2021
- Applied Materials, Inc.
- Morgan Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial backside metal removal singulation system and related methods
- Patent number 11,114,343
- Issue date Sep 7, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming interlayer dielectric material by spin-on metal oxide depos...
- Patent number 11,049,811
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Lin Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal insulator metal capacitor with extended capacitor plates
- Patent number 10,998,227
- Issue date May 4, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 10,964,596
- Issue date Mar 30, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming high electron mobility transistor (HEMT) and HEM...
- Patent number 10,896,970
- Issue date Jan 19, 2021
- Sumitomo Electric Device Innovations, Inc.
- Tadashi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a pattern
- Patent number 10,867,796
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Jongchul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma die singulation systems and related methods
- Patent number 10,818,551
- Issue date Oct 27, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation systems and related methods
- Patent number 10,796,963
- Issue date Oct 6, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer arm for film frame substrate handling during plasma singul...
- Patent number 10,692,765
- Issue date Jun 23, 2020
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming high electron mobility transistor (HEMT) and HEM...
- Patent number 10,686,053
- Issue date Jun 16, 2020
- Sumitomo Electric Device Innovations, Inc.
- Tadashi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via contact resistance control
- Patent number 10,685,915
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,636,707
- Issue date Apr 28, 2020
- ABLIC INC.
- Hiroyuki Utsunomiya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE
- Publication number 20250015011
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240242942
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS
- Publication number 20240186182
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Device Dies With Measurement Structures
- Publication number 20240128261
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Slot in EMI Shielding...
- Publication number 20230369241
- Publication date Nov 16, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND REPAIR METHOD THEREOF
- Publication number 20230335508
- Publication date Oct 19, 2023
- Innolux Corporation
- Jia-Sin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230223354
- Publication date Jul 13, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei Da LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE METAL TO SEMICONDUCTOR CONTACTS FOR INTEGRATED NMOS...
- Publication number 20230197823
- Publication date Jun 22, 2023
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS
- Publication number 20230170259
- Publication date Jun 1, 2023
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Slot in EMI Shielding...
- Publication number 20220359419
- Publication date Nov 10, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERIMETER TRENCH FORMATION AND DELINEATION ETCH DELAYERING
- Publication number 20220139722
- Publication date May 5, 2022
- FEI Company
- James Clarke
- G11 - INFORMATION STORAGE
Information Patent Application
DRY ETCH BACK SUBSTRATE INTERCONNECTIONS
- Publication number 20220108918
- Publication date Apr 7, 2022
- QUALCOMM Incorporated
- Kuiwon KANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BACKSIDE METAL REMOVAL DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20210384077
- Publication date Dec 9, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210327822
- Publication date Oct 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei Da LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20210241999
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS
- Publication number 20210217664
- Publication date Jul 15, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SYMMETRIC CONDUCTIVE INTERCONNECTION PA...
- Publication number 20210183769
- Publication date Jun 17, 2021
- SK hynix Inc.
- Tae-Jung HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT SYSTEM
- Publication number 20210183712
- Publication date Jun 17, 2021
- TOKYO ELECTRON LIMITED
- Masashi ENOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF FORMING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) AND HEM...
- Publication number 20210167188
- Publication date Jun 3, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Tadashi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20210082765
- Publication date Mar 18, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20210020514
- Publication date Jan 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package and Method of Manufacturing a Chip Package
- Publication number 20210020458
- Publication date Jan 21, 2021
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERIMETER TRENCH FORMATION AND DELINEATION ETCH DELAYERING
- Publication number 20200402813
- Publication date Dec 24, 2020
- FEI Company
- James Clarke
- G11 - INFORMATION STORAGE
Information Patent Application
PROCESS OF FORMING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) AND HEM...
- Publication number 20200312982
- Publication date Oct 1, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Tadashi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...
- Publication number 20200258780
- Publication date Aug 13, 2020
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL REMOVAL DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20200243388
- Publication date Jul 30, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTIAL BACKSIDE METAL REMOVAL SINGULATION SYSTEM AND RELATED METHODS
- Publication number 20200243389
- Publication date Jul 30, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20200243390
- Publication date Jul 30, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS
- Publication number 20200243391
- Publication date Jul 30, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20200219769
- Publication date Jul 9, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS

by physical means only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and method of manufacturing the same

Perimeter trench formation and delineation etch delayering

Apparatus and method of manufacturing a semiconductor device

Backside metal patterning die singulation system and related methods

Substrate treatment method and substrate treatment system

Semiconductor device and method of forming a slot in EMI shielding...

Plasma die singulation systems and related methods

Method for removing re-sputtered material from patterned sidewalls

Semiconductor device package and method of manufacturing the same

Backside metal removal die singulation systems and related methods

Backside metal patterning die singulation system and related methods

Conductor and method of manufacturing the same

Semiconductor device having symmetric conductive interconnection pa...

Forming a lock structure in a semiconductor chip pad

Backside metal patterning die singulation systems and related methods

Perimeter trench formation and delineation etch delayering

Backside metal removal die singulation systems and related methods

Techniques for forming angled structures

Partial backside metal removal singulation system and related methods

Forming interlayer dielectric material by spin-on metal oxide depos...

Metal insulator metal capacitor with extended capacitor plates

Backside metal patterning die singulation system and related methods

Process of forming high electron mobility transistor (HEMT) and HEM...

Method of forming a pattern

Plasma die singulation systems and related methods

Backside metal patterning die singulation systems and related methods

Transfer arm for film frame substrate handling during plasma singul...

Process of forming high electron mobility transistor (HEMT) and HEM...

Via contact resistance control

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE

APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS

Passive Device Dies With Measurement Structures

Semiconductor Device and Method of Forming a Slot in EMI Shielding...

ELECTRONIC DEVICE AND REPAIR METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

LOW RESISTANCE METAL TO SEMICONDUCTOR CONTACTS FOR INTEGRATED NMOS...

BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS

Semiconductor Device and Method of Forming a Slot in EMI Shielding...

PERIMETER TRENCH FORMATION AND DELINEATION ETCH DELAYERING

DRY ETCH BACK SUBSTRATE INTERCONNECTIONS

BACKSIDE METAL REMOVAL DIE SINGULATION SYSTEMS AND RELATED METHODS

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS

SEMICONDUCTOR DEVICE HAVING SYMMETRIC CONDUCTIVE INTERCONNECTION PA...

SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT SYSTEM

PROCESS OF FORMING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) AND HEM...

PLASMA DIE SINGULATION SYSTEMS AND RELATED METHODS

BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS

Chip Package and Method of Manufacturing a Chip Package

PERIMETER TRENCH FORMATION AND DELINEATION ETCH DELAYERING

PROCESS OF FORMING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) AND HEM...

TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...

BACKSIDE METAL REMOVAL DIE SINGULATION SYSTEMS AND RELATED METHODS

PARTIAL BACKSIDE METAL REMOVAL SINGULATION SYSTEM AND RELATED METHODS

BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS

BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS

PLASMA DIE SINGULATION SYSTEMS AND RELATED METHODS