by reclaiming or re-processing

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CPC
H01L21/02032

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02032by reclaiming or re-processing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a composite structure comprising a thin la...
- Patent number 12,033,854
- Issue date Jul 9, 2024
- Soitec
- Yann Sinquin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal efficient SiC device wafer production
- Patent number 11,996,330
- Issue date May 28, 2024
- II-VI ADVANCED MATERIALS, LLC
- Adolf Schöner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully automated wafer debonding system and method thereof
- Patent number 11,670,524
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Healing method before transfer of a semiconducting layer
- Patent number 11,195,711
- Issue date Dec 7, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pablo Acosta Alba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having high mechanical strength
- Patent number 10,991,660
- Issue date Apr 27, 2021
- ALPHA ANC OMEGA SEMICONDUCTOR (CAYMAN) LTD.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a semiconductor-on-higher thermal conducti...
- Patent number 10,600,635
- Issue date Mar 24, 2020
- Elyakim Kassel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer recycling
- Patent number 10,373,818
- Issue date Aug 6, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing group-III nitride substrate and group-III...
- Patent number 10,290,489
- Issue date May 14, 2019
- Sciocs Company Limited
- Toshio Kitamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SOI substrate and manufacturing method thereof
- Patent number 10,170,356
- Issue date Jan 1, 2019
- ZING SEMICONDUCTOR CORPORATION
- Deyuan Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an SOI wafer
- Patent number 10,115,580
- Issue date Oct 30, 2018
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for recycling a substrate holder
- Patent number 10,100,400
- Issue date Oct 16, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate regeneration method and regenerated substrate
- Patent number 9,859,108
- Issue date Jan 2, 2018
- SEOUL VIOSYS CO., LTD.
- Chang Suk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing bonded wafer with uniform thickness distribution
- Patent number 9,859,149
- Issue date Jan 2, 2018
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate recycling method
- Patent number 9,514,926
- Issue date Dec 6, 2016
- SEOUL VIOSYS CO., LTD.
- Su Youn Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reclaiming processing method for delaminated wafer
- Patent number 9,496,130
- Issue date Nov 15, 2016
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate recycling method and recycled substrate
- Patent number 9,373,496
- Issue date Jun 21, 2016
- SEOUL VIOSYS CO., LTD.
- Joo Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 9,337,080
- Issue date May 10, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reprocessing semiconductor substrate, method for manufac...
- Patent number 9,123,529
- Issue date Sep 1, 2015
- Semiconductor Energy Laboratory Co., Ltd.
- Kazuya Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing thin GaN layers by implantation and recycling...
- Patent number 8,778,775
- Issue date Jul 15, 2014
- Commissariat a l'Energie Atomique
- Aurélie Tauzin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a layer from a donor substrate onto a handl...
- Patent number 8,728,913
- Issue date May 20, 2014
- Soitec
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer recycling method
- Patent number 8,709,954
- Issue date Apr 29, 2014
- LG Innotek Co., Ltd
- Kyung Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer reclamation process
- Patent number 8,696,930
- Issue date Apr 15, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for recycling semiconductor wafers having lo...
- Patent number 8,642,526
- Issue date Feb 4, 2014
- Advanced Technology Materials, Inc.
- Pamela M. Visintin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor substrate having multilayer film and method to reuse...
- Patent number 8,575,722
- Issue date Nov 5, 2013
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reclamation method and wafer reclamation apparatus
- Patent number 8,563,332
- Issue date Oct 22, 2013
- Panasonic Corporation
- Shogo Okita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for edge chamfering of semiconductor wafers u...
- Patent number 8,562,849
- Issue date Oct 22, 2013
- Corning Incorporated
- Jonas Bankaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a layer from a donor substrate onto a handl...
- Patent number 8,476,148
- Issue date Jul 2, 2013
- Soitec
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reclaiming a surface of a substrate
- Patent number 8,435,897
- Issue date May 7, 2013
- S.O.I. Tec Silicon on Insulator Technologies
- Aziz Alami-Idrissi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reprocessing semiconductor substrate and method for manu...
- Patent number 8,404,563
- Issue date Mar 26, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Kazuya Hanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer re-use using chemical mechanical polishing
- Patent number 8,377,825
- Issue date Feb 19, 2013
- Corning Incorporated
- Jonas Bankaitis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION
- Publication number 20240274468
- Publication date Aug 15, 2024
- Adolf SCHONER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF W...
- Publication number 20240120191
- Publication date Apr 11, 2024
- SOITEC
- Isabelle Huyet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20230282494
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...
- Publication number 20220270875
- Publication date Aug 25, 2022
- SOITEC
- Yann Sinquin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION
- Publication number 20220223476
- Publication date Jul 14, 2022
- ASCATRON AB
- Adolf SCHÖNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEALING METHOD BEFORE TRANSFER OF A SEMICONDUCTING LAYER
- Publication number 20200219719
- Publication date Jul 9, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pablo Acosta Alba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WAFER RECYCLING
- Publication number 20190237321
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HIGH MECHANICAL STRENGTH
- Publication number 20190189569
- Publication date Jun 20, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR A SEMICONDUCTOR-ON-HIGHER THERMAL CONDUCTI...
- Publication number 20180308682
- Publication date Oct 25, 2018
- Diamond Valley Ltd.
- Elyakim KASSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING GROUP-III NITRIDE SUBSTRATE AND GROUP-III...
- Publication number 20180114692
- Publication date Apr 26, 2018
- SCIOCS Company Limited
- Toshio KITAMURA
- C30 - CRYSTAL GROWTH
Information Patent Application
REMOVAL OF NON-CLEAVED/NON-TRANSFERRED MATERIAL FROM DONOR SUBSTRATE
- Publication number 20180033609
- Publication date Feb 1, 2018
- QMAT, Inc.
- Francois J. HENLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKING SUBSTRATE STABILIZING DONOR SUBSTRATE FOR IMPLANT OR RECLAM...
- Publication number 20180019169
- Publication date Jan 18, 2018
- QMAT, Inc.
- Francois J. HENLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING SYSTEM USING ELECTRON BEAM AND CAPACITIVELY-COUPL...
- Publication number 20170330773
- Publication date Nov 16, 2017
- Korea Advanced Institute of Science and Technology
- Hong-Young Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN SOI WAFER
- Publication number 20170287697
- Publication date Oct 5, 2017
- Shin-Etsu Handotai Co., Ltd.
- Hiroji AGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20170256438
- Publication date Sep 7, 2017
- ZING SEMICONDUCTOR CORPORATION
- DEYUAN XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE REGENERATION METHOD AND REGENERATED SUBSTRATE
- Publication number 20160155628
- Publication date Jun 2, 2016
- Seoul Viosys Co., Ltd.
- Chang Suk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE RECYCLING METHOD
- Publication number 20150380236
- Publication date Dec 31, 2015
- Seoul Viosys Co., Ltd.
- Su Youn Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20150249035
- Publication date Sep 3, 2015
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE RECYCLING METHOD
- Publication number 20140322899
- Publication date Oct 30, 2014
- Seoul Viosys Co., Ltd.
- Su Youn Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECLAIMING PROCESSING METHOD FOR DELAMINATED WAFER
- Publication number 20140273400
- Publication date Sep 18, 2014
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR RECYCLING A SUBSTRATE HOLDER
- Publication number 20140178596
- Publication date Jun 26, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE RECYCLING METHOD AND RECYCLED SUBSTRATE
- Publication number 20140138702
- Publication date May 22, 2014
- Seoul Viosys Co., Ltd.
- Joo Won CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reclaimed Wafer And A Method For Reclaiming A Wafer
- Publication number 20140084422
- Publication date Mar 27, 2014
- Tigran Dolukhanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A LAYER FROM A DONOR SUBSTRATE ONTO A HANDL...
- Publication number 20130295696
- Publication date Nov 7, 2013
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE CRYSTAL SUBSTRATE, MANUFACTURING METHOD FOR SINGLE CRYSTAL S...
- Publication number 20130161797
- Publication date Jun 27, 2013
- Disco Corporation
- Hideo Aida
- C30 - CRYSTAL GROWTH
Information Patent Application
INTERNALLY REFORMED SUBSTRATE FOR EPITAXIAL GROWTH, INTERNALLY REFO...
- Publication number 20130161794
- Publication date Jun 27, 2013
- Disco Corporation
- Hideo Aida
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF ELIMINATING FRAGMENTS OF MATERIAL PRESENT ON THE SURFACE...
- Publication number 20130045584
- Publication date Feb 21, 2013
- SOITEC
- Benedicte Osternaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPROCESSING SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFAC...
- Publication number 20120329242
- Publication date Dec 27, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Kazuya HANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR RECLAIMING SEMICONDUCTOR WAFER AND POLISHING COMPOSITION
- Publication number 20120295443
- Publication date Nov 22, 2012
- Fujimi Incorporated
- Hitoshi Morinaga
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR RECYCLING A SOURCE SUBSTRATE
- Publication number 20120199956
- Publication date Aug 9, 2012
- Monique Lecomte
- H01 - BASIC ELECTRIC ELEMENTS

by reclaiming or re-processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a composite structure comprising a thin la...

Crystal efficient SiC device wafer production

Fully automated wafer debonding system and method thereof

Healing method before transfer of a semiconducting layer

Semiconductor package having high mechanical strength

Method and apparatus for a semiconductor-on-higher thermal conducti...

Method of wafer recycling

Method for manufacturing group-III nitride substrate and group-III...

SOI substrate and manufacturing method thereof

Method for manufacturing an SOI wafer

Method for recycling a substrate holder

Substrate regeneration method and regenerated substrate

Method of producing bonded wafer with uniform thickness distribution

Substrate recycling method

Reclaiming processing method for delaminated wafer

Substrate recycling method and recycled substrate

Method for manufacturing SOI wafer

Method for reprocessing semiconductor substrate, method for manufac...

Method for preparing thin GaN layers by implantation and recycling...

Method for transferring a layer from a donor substrate onto a handl...

Wafer recycling method

Silicon wafer reclamation process

Composition and method for recycling semiconductor wafers having lo...

Semiconductor substrate having multilayer film and method to reuse...

Wafer reclamation method and wafer reclamation apparatus

Methods and apparatus for edge chamfering of semiconductor wafers u...

Method for transferring a layer from a donor substrate onto a handl...

Method for reclaiming a surface of a substrate

Method for reprocessing semiconductor substrate and method for manu...

Semiconductor wafer re-use using chemical mechanical polishing

Patents Applicationslast 30 patents

CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION

METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF W...

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...

CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION

HEALING METHOD BEFORE TRANSFER OF A SEMICONDUCTING LAYER

METHOD OF WAFER RECYCLING

SEMICONDUCTOR PACKAGE HAVING HIGH MECHANICAL STRENGTH

METHOD AND APPARATUS FOR A SEMICONDUCTOR-ON-HIGHER THERMAL CONDUCTI...

METHOD FOR MANUFACTURING GROUP-III NITRIDE SUBSTRATE AND GROUP-III...

REMOVAL OF NON-CLEAVED/NON-TRANSFERRED MATERIAL FROM DONOR SUBSTRATE

BACKING SUBSTRATE STABILIZING DONOR SUBSTRATE FOR IMPLANT OR RECLAM...

PLASMA PROCESSING SYSTEM USING ELECTRON BEAM AND CAPACITIVELY-COUPL...

METHOD FOR MANUFACTURING AN SOI WAFER

SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF

SUBSTRATE REGENERATION METHOD AND REGENERATED SUBSTRATE

SUBSTRATE RECYCLING METHOD

METHOD FOR MANUFACTURING SOI WAFER

SUBSTRATE RECYCLING METHOD

RECLAIMING PROCESSING METHOD FOR DELAMINATED WAFER

METHOD FOR RECYCLING A SUBSTRATE HOLDER

SUBSTRATE RECYCLING METHOD AND RECYCLED SUBSTRATE

Reclaimed Wafer And A Method For Reclaiming A Wafer

METHOD FOR TRANSFERRING A LAYER FROM A DONOR SUBSTRATE ONTO A HANDL...

SINGLE CRYSTAL SUBSTRATE, MANUFACTURING METHOD FOR SINGLE CRYSTAL S...

INTERNALLY REFORMED SUBSTRATE FOR EPITAXIAL GROWTH, INTERNALLY REFO...

METHOD OF ELIMINATING FRAGMENTS OF MATERIAL PRESENT ON THE SURFACE...

METHOD FOR REPROCESSING SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFAC...

METHOD FOR RECLAIMING SEMICONDUCTOR WAFER AND POLISHING COMPOSITION

METHOD FOR RECYCLING A SOURCE SUBSTRATE