By rendering at least a portion of the conductor non conductive

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H01L21/76888

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76888By rendering at least a portion of the conductor non conductive

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High pressure oxidation of metal films
- Patent number 12,173,413
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Amrita B. Mullick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Encapsulated top via interconnects
- Patent number 12,040,230
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,033,965
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization layer and fabrication method
- Patent number 12,002,755
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including aluminum alloy word lines...
- Patent number 11,990,413
- Issue date May 21, 2024
- SanDisk Technologies LLC
- Linghan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures with anchor points
- Patent number 11,929,327
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Inc.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide layered structure and methods of forming the same
- Patent number 11,854,826
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 11,764,070
- Issue date Sep 19, 2023
- Tokyo Electron Limited
- Satoshi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device extension insulation
- Patent number 11,705,393
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chih Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,682,639
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal loss prevention in conductive structures
- Patent number 11,631,640
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling recessed features in semiconductor devices with...
- Patent number 11,621,190
- Issue date Apr 4, 2023
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,532,514
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide layered structure and methods of forming the same
- Patent number 11,443,957
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal loss prevention in conductive structures
- Patent number 11,257,755
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a barrier material on an electrode
- Patent number 11,251,261
- Issue date Feb 15, 2022
- Micron Technology, Inc.
- Sanket S Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure with manganese barrier layer
- Patent number 11,232,983
- Issue date Jan 25, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned lumiramic for improved PCLED stability
- Patent number 11,217,734
- Issue date Jan 4, 2022
- Lumileds LLC
- Kentaro Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with metal containing layer
- Patent number 11,201,232
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated top via interconnects
- Patent number 11,177,171
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned high aspect ratio structures and methods of making
- Patent number 11,177,164
- Issue date Nov 16, 2021
- Applied Materials, Inc.
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area selective deposition for cap layer formation in advanced contacts
- Patent number 11,170,992
- Issue date Nov 9, 2021
- Tokyo Electron Limited
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure oxidation of metal films
- Patent number 11,131,015
- Issue date Sep 28, 2021
- Applied Materials, Inc.
- Amrita B. Mullick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,075,179
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device extension insulation
- Patent number 11,056,428
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chih Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling recessed features in semiconductor devices with...
- Patent number 11,024,535
- Issue date Jun 1, 2021
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect device with reduced capacitance and resistance in sour...
- Patent number 11,004,737
- Issue date May 11, 2021
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antifuse array and method of forming antifuse using anodic oxidation
- Patent number 10,978,461
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Jenn-Gwo Hwu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 10,957,587
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METALLIZATION LAYER AND FABRICATION METHOD
- Publication number 20240282707
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240096642
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240047270
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH CONTACTS EXTENDING THROUGH METAL OXIDE...
- Publication number 20230395510
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Mithun Kumar Ramasahayam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230275048
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Loss Prevention In Conductive Structures
- Publication number 20230253314
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING ALUMINUM ALLOY WORD LINES...
- Publication number 20230051815
- Publication date Feb 16, 2023
- SANDISK TECHNOLOGIES LLC
- Linghan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming an Abrasive Slurry and Methods for Chemical-Mech...
- Publication number 20220384245
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Oxide Layered Structure and Methods of Forming the Same
- Publication number 20220359223
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LAYER AND FABRICATION METHOD
- Publication number 20220238438
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- I-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LOSS PREVENTION IN CONDUCTIVE STRUCTURES
- Publication number 20220173036
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...
- Publication number 20220139776
- Publication date May 5, 2022
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
- Publication number 20220115269
- Publication date Apr 14, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED TOP VIA INTERCONNECTS
- Publication number 20220044967
- Publication date Feb 10, 2022
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20220020601
- Publication date Jan 20, 2022
- TOKYO ELECTRON LIMITED
- Satoshi TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Pressure Oxidation of Metal Films
- Publication number 20210404046
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Amrita B. Mullick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LOSS PREVENTION IN CONDUCTIVE STRUCTURES
- Publication number 20210391255
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen -Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20210351143
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE EXTENSION INSULATION
- Publication number 20210327808
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Chih YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...
- Publication number 20210287936
- Publication date Sep 16, 2021
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Formation Method of Semiconductor Device with Conduct...
- Publication number 20210210383
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chieh Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ENCAPSULATED TOP VIA INTERCONNECTS
- Publication number 20210098293
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20200402848
- Publication date Dec 24, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH METAL CONTAINING LAYER
- Publication number 20200350421
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal A. KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Oxide Layered Structure and Methods of Forming the Same
- Publication number 20200279750
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Wordline Separation in 3D-NAND Devices
- Publication number 20200243382
- Publication date Jul 30, 2020
- Applied Materials, Inc.
- Yihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned High Aspect Ratio Structures And Methods Of Making
- Publication number 20200194304
- Publication date Jun 18, 2020
- Applied Materials, Inc.
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE EXTENSION INSULATION
- Publication number 20200144181
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Chih YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...
- Publication number 20200118871
- Publication date Apr 16, 2020
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS

By rendering at least a portion of the conductor non conductive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High pressure oxidation of metal films

Encapsulated top via interconnects

Semiconductor device and method of forming the same

Metallization layer and fabrication method

Three-dimensional memory device including aluminum alloy word lines...

Liner-free conductive structures with anchor points

Metal oxide layered structure and methods of forming the same

Method of forming copper interconnect structure with manganese barr...

Etching method and etching apparatus

Semiconductor device extension insulation

Semiconductor device and method of forming the same

Metal loss prevention in conductive structures

Method for filling recessed features in semiconductor devices with...

Structure and formation method of semiconductor device with conduct...

Metal oxide layered structure and methods of forming the same

Metal loss prevention in conductive structures

Forming a barrier material on an electrode

Copper interconnect structure with manganese barrier layer

Patterned lumiramic for improved PCLED stability

Semiconductor structure with metal containing layer

Encapsulated top via interconnects

Self-aligned high aspect ratio structures and methods of making

Area selective deposition for cap layer formation in advanced contacts

High pressure oxidation of metal films

Semiconductor device and method of forming the same

Semiconductor device extension insulation

Method for filling recessed features in semiconductor devices with...

Field effect device with reduced capacitance and resistance in sour...

Antifuse array and method of forming antifuse using anodic oxidation

Structure and formation method of semiconductor device with conduct...

Patents Applicationslast 30 patents

METALLIZATION LAYER AND FABRICATION METHOD

METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

MICROELECTRONIC DEVICES WITH CONTACTS EXTENDING THROUGH METAL OXIDE...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Metal Loss Prevention In Conductive Structures

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING ALUMINUM ALLOY WORD LINES...

Methods of Forming an Abrasive Slurry and Methods for Chemical-Mech...

Metal Oxide Layered Structure and Methods of Forming the Same

METALLIZATION LAYER AND FABRICATION METHOD

METAL LOSS PREVENTION IN CONDUCTIVE STRUCTURES

METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...

COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER

ENCAPSULATED TOP VIA INTERCONNECTS

ETCHING METHOD AND ETCHING APPARATUS

High Pressure Oxidation of Metal Films

METAL LOSS PREVENTION IN CONDUCTIVE STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE EXTENSION INSULATION

METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...

Structure and Formation Method of Semiconductor Device with Conduct...

ENCAPSULATED TOP VIA INTERCONNECTS

INTERCONNECT STRUCTURE

SEMICONDUCTOR STRUCTURE WITH METAL CONTAINING LAYER

Metal Oxide Layered Structure and Methods of Forming the Same

Methods for Wordline Separation in 3D-NAND Devices

Self-Aligned High Aspect Ratio Structures And Methods Of Making

SEMICONDUCTOR DEVICE EXTENSION INSULATION

METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...