by simultaneously passing an electrical current, i.e. electrochemical mechanical polishing

Industry

CPC
H01L21/32125

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32125by simultaneously passing an electrical current, i.e. electrochemical mechanical polishing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Face-up wafer electrochemical planarization apparatus
- Patent number 12,090,600
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Grant
Electrochemical mechanical polishing and planarization equipment fo...
- Patent number 12,017,293
- Issue date Jun 25, 2024
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Yaomin Deng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickness sensor for conductive features
- Patent number 11,631,618
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih Hung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Controlled induced warping of electronic substrates via electroplating
- Patent number 11,236,436
- Issue date Feb 1, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,075,165
- Issue date Jul 27, 2021
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickness sensor for conductive features
- Patent number 10,916,481
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for producing flat surfaces in interconnect str...
- Patent number 10,804,151
- Issue date Oct 13, 2020
- Tessera, Inc.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,741,409
- Issue date Aug 11, 2020
- Samsung Electronics Co., Ltd.
- Hyo Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer removal method and semiconductor structure forming me...
- Patent number 10,453,743
- Issue date Oct 22, 2019
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface planarization system and method
- Patent number 10,226,852
- Issue date Mar 12, 2019
- Nova Measuring Instruments Ltd.
- Igor Turovets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for producing flat surfaces in interconnect str...
- Patent number 10,199,275
- Issue date Feb 5, 2019
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure using polishing process
- Patent number 10,157,781
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical planarization apparatus and methods
- Patent number 9,950,405
- Issue date Apr 24, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Wufeng Deng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Observation and photography apparatus
- Patent number 9,804,067
- Issue date Oct 31, 2017
- KAGOSHIMA UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- Yoshitaka Adachi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for producing flat surfaces in interconnect str...
- Patent number 9,558,998
- Issue date Jan 31, 2017
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bumps and process for making same
- Patent number 9,449,931
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically assisted chemical-mechanical planarization (EACMP) sys...
- Patent number 9,375,821
- Issue date Jun 28, 2016
- National Taiwan University of Science and Technology
- Chao-Chang Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming an optical modulator
- Patent number 9,329,415
- Issue date May 3, 2016
- Agency for Science, Technology and Research
- Jun-Feng Song
- G02 - OPTICS
Information Patent Grant
Systems and methods for producing flat surfaces in interconnect str...
- Patent number 9,318,385
- Issue date Apr 19, 2016
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electroplating
- Patent number 9,309,604
- Issue date Apr 12, 2016
- Novellus Systems, Inc.
- Steven Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for removing electroplated metal facets and reusing a barrie...
- Patent number 9,293,368
- Issue date Mar 22, 2016
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Kai Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for simultaneously removing multiple conductiv...
- Patent number 9,214,359
- Issue date Dec 15, 2015
- Micron Technology, Inc.
- Dinesh Chopra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chemical-mechanical planarization composition having benzenesulfoni...
- Patent number 9,200,180
- Issue date Dec 1, 2015
- Air Products and Chemicals, Inc.
- Gautam Banerjee
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method of forming a planar surface for a semiconductor device struc...
- Patent number 9,153,451
- Issue date Oct 6, 2015
- Micron Technology, Inc.
- Andrew Dennis Watson Carswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for producing flat surfaces in interconnect str...
- Patent number 9,123,703
- Issue date Sep 1, 2015
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing systems and methods for removing conductive material from...
- Patent number 9,099,431
- Issue date Aug 4, 2015
- Micron Technology, Inc.
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of planarization and electro-chemical mechanical polishing...
- Patent number 8,974,655
- Issue date Mar 10, 2015
- Micron Technology, Inc.
- Wayne Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pillar bumps and process for making same
- Patent number 8,823,166
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP composition containing zirconia particles and method of use
- Patent number 8,778,212
- Issue date Jul 15, 2014
- Cabot Microelectronics Corporation
- Wiechang Jin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20250001547
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20230390887
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS
- Publication number 20210320064
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- SUKETU A. PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled Induced Warping of Electronic Substrates via Electroplating
- Publication number 20210230765
- Publication date Jul 29, 2021
- Rockwell Collins, Inc.
- Richard Korneisel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SU...
- Publication number 20210187685
- Publication date Jun 24, 2021
- EBARA CORPORATION
- Atsuo Katagiri
- B24 - GRINDING POLISHING
Information Patent Application
THICKNESS SENSOR FOR CONDUCTIVE FEATURES
- Publication number 20210125881
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- CHIH HUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS
- Publication number 20210020569
- Publication date Jan 21, 2021
- Applied Materials, Inc.
- SUKETU A. PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER REMOVAL METHOD AND SEMICONDUCTOR STRUCTURE FORMING ME...
- Publication number 20190393074
- Publication date Dec 26, 2019
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICKNESS SENSOR FOR CONDUCTIVE FEATURES
- Publication number 20190393107
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- CHIH HUNG CHEN
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE USING POLISHING PROCESS
- Publication number 20180166331
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180130672
- Publication date May 10, 2018
- Samsung Electronics Co., Ltd.
- Hyo Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE PLANARIZATION SYSTEM AND METHOD
- Publication number 20180029189
- Publication date Feb 1, 2018
- NOVA MEASURING INSTRUMENTS LTD.
- Igor TUROVETS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SLURRY FOR CMP AND POLISHING METHOD
- Publication number 20170267895
- Publication date Sep 21, 2017
- Hitachi Chemical Company, Ltd.
- Takashi Shinoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BARRIER LAYER REMOVAL METHOD AND SEMICONDUCTOR STRUCTURE FORMING ME...
- Publication number 20170221753
- Publication date Aug 3, 2017
- ACM Research (Shanghai) Inc.
- Zhaowei Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE PLANARIZATION SYSTEM AND METHOD
- Publication number 20160318148
- Publication date Nov 3, 2016
- NOVA MEASURING INSTRUMENTS LTD.
- Igor TUROVETS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PRODUCING FLAT SURFACES IN INTERCONNECT STR...
- Publication number 20160027693
- Publication date Jan 28, 2016
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SLURRY FOR CMP AND POLISHING METHOD
- Publication number 20150315419
- Publication date Nov 5, 2015
- Hitachi Chemical Company, Ltd.
- Takashi Shinoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING METHOD, POLISHING APPARATUS AND POLISHING TOOL
- Publication number 20150068680
- Publication date Mar 12, 2015
- OSAKA UNIVERSITY
- Yasuhisa SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SIMULTANEOUSLY REMOVING MULTIPLE CONDUCTIV...
- Publication number 20140377953
- Publication date Dec 25, 2014
- Dinesh Chopra
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20140363966
- Publication date Dec 11, 2014
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SYSTEMS AND METHODS FOR REMOVING CONDUCTIVE MATERIAL FROM...
- Publication number 20140322890
- Publication date Oct 30, 2014
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PRODUCING FLAT SURFACES IN INTERCONNECT STR...
- Publication number 20140210102
- Publication date Jul 31, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PLANAR SURFACE FOR A SEMICONDUCTOR DEVICE STRUC...
- Publication number 20140162455
- Publication date Jun 12, 2014
- Micron Technology, Inc.
- Andrew Dennis Watson Carswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN OPTICAL MODULATOR
- Publication number 20140127842
- Publication date May 8, 2014
- Agency for Science, Technology and Research
- Jun-Feng Song
- G02 - OPTICS
Information Patent Application
POLISHING SLURRY FOR CMP AND POLISHING METHOD
- Publication number 20140065825
- Publication date Mar 6, 2014
- HITACHI CHEMICAL CO., Ltd.
- Takashi Shinoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING
- Publication number 20130327650
- Publication date Dec 12, 2013
- Steven Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CMP COMPOSITION CONTAINING ZIRCONIA PARTICLES AND METHOD OF USE
- Publication number 20130313225
- Publication date Nov 28, 2013
- Cabot Microelectronics Corporation
- Wiechang Jin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRICALLY ASSISTED CHEMICAL-MECHANICAL PLANARIZATION (EACMP) SYS...
- Publication number 20130137263
- Publication date May 30, 2013
- NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Chao-Chang Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods for Producing Flat Surfaces in Interconnect Str...
- Publication number 20120326326
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Adjusting Metal Polishing Rate and Reducing Defects Aris...
- Publication number 20120276820
- Publication date Nov 1, 2012
- SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Shoulong Zhang
- B24 - GRINDING POLISHING

by simultaneously passing an electrical current, i.e. electrochemical mechanical polishing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Face-up wafer electrochemical planarization apparatus

Electrochemical mechanical polishing and planarization equipment fo...

Methods and apparatus for forming dual metal interconnects

Thickness sensor for conductive features

Controlled induced warping of electronic substrates via electroplating

Methods and apparatus for forming dual metal interconnects

Thickness sensor for conductive features

Systems and methods for producing flat surfaces in interconnect str...

Method of manufacturing a semiconductor device

Barrier layer removal method and semiconductor structure forming me...

Surface planarization system and method

Systems and methods for producing flat surfaces in interconnect str...

Method for forming semiconductor structure using polishing process

Chemical mechanical planarization apparatus and methods

Observation and photography apparatus

Systems and methods for producing flat surfaces in interconnect str...

Pillar bumps and process for making same

Electrically assisted chemical-mechanical planarization (EACMP) sys...

Method for forming an optical modulator

Systems and methods for producing flat surfaces in interconnect str...

Method and apparatus for electroplating

Method for removing electroplated metal facets and reusing a barrie...

Method and apparatus for simultaneously removing multiple conductiv...

Chemical-mechanical planarization composition having benzenesulfoni...

Method of forming a planar surface for a semiconductor device struc...

Systems and methods for producing flat surfaces in interconnect str...

Polishing systems and methods for removing conductive material from...

Methods of planarization and electro-chemical mechanical polishing...

Pillar bumps and process for making same

CMP composition containing zirconia particles and method of use

Patents Applicationslast 30 patents

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS

Controlled Induced Warping of Electronic Substrates via Electroplating

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SU...

THICKNESS SENSOR FOR CONDUCTIVE FEATURES

METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS

BARRIER LAYER REMOVAL METHOD AND SEMICONDUCTOR STRUCTURE FORMING ME...

THICKNESS SENSOR FOR CONDUCTIVE FEATURES

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE USING POLISHING PROCESS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SURFACE PLANARIZATION SYSTEM AND METHOD

POLISHING SLURRY FOR CMP AND POLISHING METHOD

BARRIER LAYER REMOVAL METHOD AND SEMICONDUCTOR STRUCTURE FORMING ME...

SURFACE PLANARIZATION SYSTEM AND METHOD

SYSTEMS AND METHODS FOR PRODUCING FLAT SURFACES IN INTERCONNECT STR...

POLISHING SLURRY FOR CMP AND POLISHING METHOD

POLISHING METHOD, POLISHING APPARATUS AND POLISHING TOOL

METHOD AND APPARATUS FOR SIMULTANEOUSLY REMOVING MULTIPLE CONDUCTIV...

Pillar Bumps and Process for Making Same

POLISHING SYSTEMS AND METHODS FOR REMOVING CONDUCTIVE MATERIAL FROM...

SYSTEMS AND METHODS FOR PRODUCING FLAT SURFACES IN INTERCONNECT STR...

METHOD OF FORMING A PLANAR SURFACE FOR A SEMICONDUCTOR DEVICE STRUC...

METHOD FOR FORMING AN OPTICAL MODULATOR

POLISHING SLURRY FOR CMP AND POLISHING METHOD

METHOD AND APPARATUS FOR ELECTROPLATING

CMP COMPOSITION CONTAINING ZIRCONIA PARTICLES AND METHOD OF USE

ELECTRICALLY ASSISTED CHEMICAL-MECHANICAL PLANARIZATION (EACMP) SYS...

Systems and Methods for Producing Flat Surfaces in Interconnect Str...

Method for Adjusting Metal Polishing Rate and Reducing Defects Aris...